Processors; Figure 2-10. Processor Assembly - Compaq Deskpro Workstation AP230 Technical Reference Manual

Chapter 2 System Overview

2.4.1 PROCESSORS

The Compaq Deskpro EN Series include models based on Celeron and Pentium III processors. All
Compaq Deskpro Workstation AP230 models feature the Pentium III processor. These processors
are backward-compatible with software written for the Pentium II, Pentium MMX, Pentium Pro,
Pentium, and x86 microprocessors. Both processor architectures include a floating-point unit, first
and secondary caches, and enhanced performance for multimedia applications through the use of
multimedia extension (MMX) instructions.
These systems employ a PGA370 zero-insertion-force (ZIF) socket designed for mounting a "Flip-
Chip" (FC-PGA370) processor package (Figure 2-10).
Heat Sink
Retaining Clip
Heat Sink for
MHz Processors
(Shown in unlock position)
Figure 2–10. Processor Assembly And Mounting
The PGA370 socket allows easy changing/upgrading of the processor. Raising the Lock/Unlock
handle of the socket in the vertical position allows the processor package to be removed or
inserted into the socket. Lowering the Lock/Unlock handle in the down (horizontal) position locks
the processor package in place. These systems support processors fitted with passive heat sink or
processor fitted with a heat sink/fan assembly with a power cable that attaches to a fan-power
header provided on the system board.
NOTE: These systems support processors using the FC-PGA370 package only. The
PPGA370 package, while physically installable, will not work in these systems.
2-14 Compaq Deskpro Personal Computers
Lock/Unlock
Handle
Third Edition – April 2001
Heat Sink
Retaining Bar
Heat Sink for
GHz Processors
FC-PGA370
Package
PGA370
Socket