Module Is Easy To Damage; Ber(Bit Error Rate) Is High; Production Guidance; Reflow Soldering Temperature - Ebyte E30-433T20S User Manual

Chengdu Ebyte Electronic Technology Co,;Ltd
Data lose rate will be affected by temperature, humidity and co-channel interference.

The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.

Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.

The signal will be affected when the antenna is near metal object or put in a metal case.

Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the

distance).
The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the

transmitting power.
Due to antenna quality or poor matching between antenna and module.


9.2 Module is easy to damage

Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.

Please check the stability of power source, the voltage cannot fluctuate too much.

Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic

susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.

Please avoid using modules under too high or too low temperature.


9.3 BER(Bit Error Rate) is high

There is co-channel signal interference nearby, please be away from interference sources or modify frequency and

channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.

The extension line and feeder quality are poor or too long, so the bit error rate is high;


10 Production guidance

10.1 Reflow soldering temperature

Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Average ramp-down rate（Tp to Tsmax）
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co,;Ltd
Profile Feature Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
E30-433T20S user manual
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
17