Table of Contents
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TABLE OF CONTENTS
Specifications ........................................................................... 1
Location of parts and controls ............................................ 2
........................................................... 3
3-1. Cover Removal ........................................................... 4
3-2. Display Board Removal ............................................. 4
3-3. Cassette Lid Assy Removal ........................................ 5
3-5. Mechanism Deck, Main Board, Belt Removal ........... 6
4-1. Mechanical Adjustments ............................................ 7
4-2. Electrical Adjustments ................................................ 7
5-1. Explanation of IC Terminals ..................................... 10
5-2. Block Diagram ........................................................... 11
5-3. Printed Wiring Boards (Main Section) ..................... 13
5-4. Schematic Diagram (Main Section) ......................... 15
5-5. Schematic Diagram (Display Section) ..................... 18
5-6. Printed Wiring Boards (Display Section) ................. 21
6-1. Cassette Lid Section ................................................. 23
6-2. Main Board Section .................................................. 24
6-3. Mechanism Deck Section (MF-WMFS473) ............ 25
................................... 26
SECTION 1
GENERAL
- 2 -
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
This section is extracted from
instruction manual.
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