LB-Link BL-M8189ME1 User Manual
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LB-Link BL-M8189ME1 User Manual

802.11b/g/n 150mbps 1t1r wifi sdio module
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BL-M8189ME1(ETV)
802.11b/g/n 150Mbps 1T1R
WiFi SDIO Module
SHENZHEN BILIAN ELECTRONIC CO., LTD
Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China
Web: www.b-link.net.cn

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Summary of Contents for LB-Link BL-M8189ME1

  • Page 1 BL-M8189ME1(ETV) 802.11b/g/n 150Mbps 1T1R WiFi SDIO Module SHENZHEN BILIAN ELECTRONIC CO., LTD Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China Web: www.b-link.net.cn...

  • Page 2: Revision History

    Module Name: BL-M8189ME1 Module Type: 802.11b/g/n 150Mbps 1T1R WiFi SDIO Module Revision: V1.2 Customer Approval: Company: Title: Signature: Date: BL-link Approval: Title: Signature: Date: Revision History Revision Summary Release Date Initial release 2015.09.15 Official release 2021.04.24 http://www.b-link.net.cn...
  • Page 3 1. Introduction BL-R8189ME1 product Accord with FCC CE and is 150M wireless SDIO adapter which has lower power consumption, high linearity output power, accords with IEEE802.11B/G/N, and supports IEEE802.11i safety protocol, along with IEEE 802.11e standard service quality. It connects with other wireless device which accorded with these standards together, supports the new data encryption on 64/128 bit WEP and safety mechanism on WPA-PSK/WPA2-PSK, WPA/WPA2.IIt’s easy and convenient to link to wireless network for the users using desktop, laptop and other...

  • Page 4: Pin Assignments

    1.3 General Specifications Module Name BL-M8189ME1 WiFi Module Chipset RTL8189ETV -CG WiFi Standards IEEE802.11b/g/n/, 1T1R, 2.4GHz, 150Mbps (Max) Host Interface SDIO 2.0 Antenna Connect to the external antennas through half hole pad Dimension SMD 44Pins, 12*12*1.5mm (L*W*H) DC 3.3±0.2V(main power) @ 350...
  • Page 5 VBAT VDD3.3V WL_REG_ON Power down select, pull high for use WAKE WLAN to wake-up HOST, pull high for use SD_D2 SDIO data 2 SD_D3 SDIO data 3 /GSPI chip select SD_CMD SDIO command/GSPI data input SD_CLK SDIO clock /GSPI clock SD_D0 SDIO data 0 /GSPI data output SD_D1...

  • Page 6: Electrical And Thermal Specifications

    Ground P: Power, I: Input, O: Output, I/O: In/Output, RF: Analog RF Port 3. Electrical and Thermal Specifications 3.1 Recommended Operating Conditions Parameters Units Ambient Operating Temperature ℃ External Antenna VSWR 1.92 VDD33 Supply Voltage VDIO(1.8V) 3.2 Current Consumption Conditions : VDD33=3.3V ; Ta:25℃ VDD33 Current (average) Use Case Units...
  • Page 7 4. WiFi RF Specifications 4.1 2.4G WiFi RF Specification Conditions : VDD33=3.3V ; Ta:25℃ Features Description WLAN Standard IEEE 802.11b/g/n Frequency Range 2.4~2.484GHz (2.4GHz ISM Band) Channels Ch1~Ch14 (For 20MHz Channels) 802.11b (DSSS): DBPSK, DQPSK, CCK; Modulation 802.11g (OFDM): BPSK, QPSK, 16QAM, 64QAM; 802.11n (OFDM): BPSK, QPSK, 16QAM, 64QAM;...

  • Page 8: Mechanical Specifications

    5. Mechanical Specifications 5.1 Module Outline Drawing Module dimension: 12.0*12.0*1.5mm (L*W*H; Tolerance: ±0.15mm) Module Bow and Twist：≤0.1mm http://www.b-link.net.cn...

  • Page 9: Application Information

    5.2 Mechanical Dimensions 6. Application Information 6.1 Typical Application Circuit http://www.b-link.net.cn...
  • Page 10 6.2 Recommend PCB Layout Footprint Design size mm Top View http://www.b-link.net.cn...
  • Page 11 Parts Specification Manufacturer Note Chipset RTL8189ETV-CG Realtek Shenzhen Tie Fa Technology limited Guangdong KINGSHINE ELECTRONICS BL-M8189ME1 CO., LTD Quzhou Sunlord Electronics Co., Ltd SHENZHEN KAIYUEXIANG ELECTRONICS CO., LTD HARMONY ELECTRONICS CORP. Crystal 26MHz-9pF-10ppm-3225 HOSONIC ELECTRONIC CO., LTD. UN Semiconductor Co., Ltd...
  • Page 12 8. Package and Storage Information 8.1 Package Dimensions Package specification: 1. 2,000 modules per roll and 10,000 modules per box. 2. Outer box size: 37.5*36*29cm. 3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 25.3mm (with a width of 21.3mm carrying belt). 4.

  • Page 13: Storage Conditions

    8.2 Storage Conditions Absolute Maximum Ratings: Storage temperature: -45℃ to +85℃ Storage humidity: 10% to 95% RH（Non-Condensing） Recommended Storage Conditions: Storage temperature: 5℃ to +40℃ Storage humidity: 20% to 90% RH Please use this Module within 12month after vacuum-packaged. The Module shall be stored without opening the packing. After the packing opened, the Module shall be used within 72hours.
  • Page 14 FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’...
  • Page 15 Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.

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