Unleaded Solder; Service Know-How; When The Optical Unit Assy Is Replaced; When The Board Is Replaced - Sony VPL-GH10 Service Manual

Hide thumbs Also See for VPL-GH10:
Table of Contents

Advertisement

1-4. Unleaded Solder

Boards requiring use of unleaded solder are printed with a
lead free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come
printed with the lead free mark due to their particular size.)
: LEAD FREE MARK
m
. Be sure to use the unleaded solder for the printed circuit
board printed with the lead free mark.
. The unleaded solder melts at a temperature about 40 dC
higher than the ordinary solder, therefore, it is recom-
mended to use the soldering iron having a temperature
regulator.
. The ordinary soldering iron can be used but the iron tip
has to be applied to the solder joint for a slightly longer
time. The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful.

1-5. Service Know-How

1-5-1. When the Optical Unit ASSY is
Replaced
1. Write the 3DGamma/LookUpTable/ABGamma/LCK/
OGMTable/CSMatrixTable data contained in the
attached CD-R.
See "1-6-3. Writing 3DGamma/LookUpTable/DDC/
ABGamma/LCK/OGMTable/CSMatrixTable Data"
for more about how to write data.
2. Change the IRIS data to the values of the IRIS adjust-
ment data stored in the supplied CD-R. For how to
change the data, refer to "1-5-3. IRIS Copy".
3. Change the Panel Driver Gain B data to the values of
the adjustment data stored in the supplied CD-R.
For how to change the data, refer to "1-5-4. Panel
Driver Gain B Copy".
VPL-GH10

1-5-2. When the Board is Replaced

1. When the QA board is replaced
Remove IC602 from the old QA board and install
IC602 by reusing the removed IC602.
IC602 is not possible, follow the procedure described
below.
* When replacing IC602, the heat sink should be removed. To remove
the heat sink, cut the four legs of the heat sink, at the QA side of the
heat sink. After IC602 is replaced, use the new heat sink and also
use the new heat conductive sheet. Do not re-use the heat sink and
heat conductive sheet.
a) Change the IRIS data to the values of the IRIS
adjustment data before replacement. (For the
method to change the IRIS data, refer to "1-5-3.
IRIS Copy".)
In case if the data cannot be changed, perform the
IRIS adjustment.
(For the IRIS adjustment, refer to "2-4. IRIS
Adjustment."
b) Obtain the former OGMTable data from the
original QA board before replacement as follows.
(For the method of obtaining the former OGM
Table data from the original QA board before
replacement, refer to "1-6-4. How to Obtain the
3DGamma/LookUpTable/DDC/ABGamma/LCK/
OGMTable/CSMatrixTable Data from the
Board".)
Write down the obtained OGMTable data as
follows.
(For the method of writing down the obtained
OGMTable data, refer to "1-6-3. Writing 3DGam-
ma/LookUpTable/DDC/ABGamma/LCK/OG-
MTable/CSMatrixTable Data".)
In case if the former OGMTable data cannot be
obtained from the original QA board before
replacement, perform the W/B adjustment. (For
the W/B adjustment, refer to "2-3. White Balance
Adjustment on Servicing".)
c) Return the Panel Driver/Gain B value back to its
original value before the QA board is replaced.
(For the method of returning the above value to
the original value, refer to "1-5-4. Panel Driver
Gain B Copy".)
In case if the original data cannot be copied,
perform the Panel Driver Gain B Adjustment.
(For the method of Panel Driver Gain B Adjust-
ment, refer to "2-5. Panel Driver Gain B Adjust-
ment".)
*
If reuse of
1-19

Advertisement

Table of Contents
loading

Table of Contents