Advertisement
BSMI CNS15663 限用物質含有情況標示聲明書
Declaration of the Presence Condition of the Restricted Substances Marking
設備名稱：M.2 / PCIE SSD Module
Equipment name
單元Unit
鉛
Lead
(Pb)
印刷電路板總成
－
PCB Assembly
晶片
○
Chip
散熱片
○
Heat Sink
連接器 (設計選配)
○
Connectors (Design options)
其他塑膠組件 (設計選配)
Other plastic components
○
(Design options)
備考1. "超出0.1 wt %" 及 "超出0.01 wt %" 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1 wt %" and "exceeding 0.01 wt %" indicate that the percentage content of the restricted
substance exceeds the reference percentage value of presence condition.
備考2. "○"係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "○" indicates that the percentage content of the restricted substance does not exceed the percentage
of reference value of presence.
備考3. "－"係指該項限用物質為排除項目。
Note 3: The "－" indicates that the restricted substance corresponds to the exemption.
型號（型式）：GP-ASACNE6200TTTDA
Type designation (Type)
限用物質及其化學符號
Restricted substances and its chemical symbols
汞
鎘
六價鉻
多溴聯苯
Hexavalent
Polybrominated
Mercury
Cadmium
chromium
biphenyls
(Hg)
(Cd)
(Cr
)
(PBB)
+6
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
- 13 -
多溴二苯醚
Polybrominated
diphenyl ethers
(PBDE)
○
○
○
○
○
○
○
○
○
○
Advertisement
