Miscellaneous; How To Replace The Llp; Package - Panasonic KX-TG6641B Service Manual

13 Miscellaneous

13.1. How to Replace the LLP (Leadless Leadframe Package) IC
Note:
This description is only applied on the model with Shield case.
13.1.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608 °F ± 68 °F (320 °C ± 20 °C)
13.1.2. Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.1.3. How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the P.C.Board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely.
Note:
• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the
P.C.Board.
3. After removing the IC, clean the P.C.Board of residual solder.
P.C.Board
IC
P.C.Board
KX-TG6641B/KX-TG6643B/KX-TG6644B/KX-TG6645B/KX-TGA660B
IC
Hot Air Desoldering Tool
Tweezers, etc.
P.C.Board
Hot Air Desoldering Tools
63