Table of Contents General Information .......................... 6 Symbols Used ........................... 6 Certification ..........................6 Safety instructions ........................7 Electrical connection ......................... 7 Introduction ............................8 Overview ........................... 8 Key Features ..........................8 General Description .......................... 9 Functional Description ......................9 PCB description ........................
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Bottom View ..........................20 Side View ..........................20 Product History ..........................21 Version Information ......................... 21 8.1.1 Sentis3D-M530 ........................ 21 Anomalies ..........................21 Document Revision History ......................22 List of Figures and Tables ......................23 Template No.: 900-306 / A...
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Bluetechnix takes no liability for any damages and errors causing of the usage of this board. The user of this board is responsible by himself for the functionality of his application. He is allowed to use the board only if he has the qualification.
Version 2 General Information This guide applies to the Sentis3D-M530 camera platform from Bluetechnix. Follow this guide chapter by chapter to set up and understand your product. If a section of this document only applies to certain camera parts, this is indicated at the beginning of the respective section.
Hardware User Manual - Sentis3D-M530 Last change: 27 April 2016 Version 2 Safety instructions Important This manual is part of the device and contains information and illustrations about the correct handling of the device and must be read before installation or use. Observe the operating instructions.
The Sentis3D-M530 is a depth sensor module, developed by Bluetechnix, operating on the Time-of-Flight (ToF) principle. The Sentis3D-M530 is based on the ToF sensor IRS1020/1125 from Infineon and Freescale i.MX6 processor. The camera consists of different modules from Bluetechnix like the TIM-U-IRS1020, LIM-u- LED-850 and CM-i.MX6x.
3.3.6 RGB LED A RGB LED is available on the Extension-Board and can be used to show the state of the Sentis3D-M530 (component (f) in Figure 6-1). The RGB LED is controlled by a Toshiba LED driver (TCA62724FMG(O,EL)) connected though the I2C2 interface with the CM-i.MX6x.
Version 2 Hardware installation Mounting The Sentis3D-M530-Baseboard provides 4 x M3 mounting holes to fix it on the enclosure. The positions of the mounting holes is shown in figure 7.1 (3.2mm holes). Note: The mounting holes must be electrically connected to the enclosure using metallic screws! The LIM modules mounted on the Sentis3D-M530-Baseboard must be fixed to a heatsink or to the enclosure.
Lenses and objective The Sentis3D-M530 is equipped with a 80° objective for the TIM module, 90° objective for the 2D sensor and 90° lenses for the LIM modules. Other objectives/lenses can be provided by Bluetechnix on request.
Hardware User Manual - Sentis3D-M530 Last change: 27 April 2016 Version 2 Specifications Electrical Specifications 5.1.1 Operating Conditions Symbol Parameter Typical Unit Input supply voltage Input current Operating Temperature °C Storage Temperature °C FITP Frame-rate Integration Time Product Table 5-1 Electrical characteristics Depends on cooling mechanism.
GBit Ethernet Connector (b) This standard RJ45 connector provides a 10/100/1000 Base-T interface to the Sentis3D-M530. Extension Connector (c) The Mini-DIN 8 connector provides several interfaces to connect the Sentis3D-M530 to external devices. Figure 6-3 Mini-DIN8 pin out Signal Type...
Hardware User Manual - Sentis3D-M530 Last change: 27 April 2016 Version 2 Note: To use the output functionality of the GPIO pin an external pullup resistor is necessary. This pullup must be designed for a minimum current of 13mA. (e.g 1k5 pullup to 20V)
Figure 4-2 Possible optical isolation (Side view) ....................13 Figure 4-3 Possible optical isolation (Top view) ....................13 Figure 6-1 Connectors of the Sentis3D-M530 (top view with transparent LIM-u-LED-850) ......16 Figure 6-2 Front panel vew ..........................16 Figure 6-3 Mini-DIN8 pin out ..........................17 Figure 7-1 Top View of the Sentis3D-M530-Baseboard ...................
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