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RJ33N3AD0LG ○ Handle this document carefully for it contains material protected by international copyright law. Any reproduction, full or in part, of this material is prohibited without the express written permission of the company. ○ When using the products covered herein, please observe the conditions written herein and the precautions outlined in the following paragraphs.
RJ33N3AD0LG CONTENTS DESCRIPTION ‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥ 1.1 Features 1.2 Applications ARRANGEMENT OF PIXELS AND COLOR FILTERS ‥‥‥‥‥‥‥‥‥‥‥‥‥‥ PIN CONFIGURATION ‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥ ABSOLUTE MAXIMUM RATINGS ‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥ 4.1 CCD, VDr Power sequence RECOMMENDED OPERATING CONDITIONS ‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥ CHARACTERISTICS ‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥ DRIVE TIMING CHART ‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥ EXAMPLE OF STANDARD OPERATING CIRCUIT ‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥ PECIFICATION FOR BLEMISH ‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥...
"iSHCCD". The "iSHartina" series is a key device group of Sharp which realizes a next-generation sensing world. The circuit diagram and others included in this specifications are intended for use to explain typical application examples.
RJ33N3AD0LG 2 ARRANGEMENT OF PIXELS AND COLOR FILTERS Optical black (2 pixels) Image pixels 1928(H)× 1088(V) Optical black Optical black (28pixels) (28 pixels) Optical black (6 pixels) (2 pixels) Dummy bit 1 pin Pin arrangement of the vertical readout clock (1, 1088) (1928, 1088) (1, 1)
RJ33N3AD0LG 3 PIN CONFIGURATION(TOP VIEW) ・EXAMPLE OF PIN CONFIGURATION FOR THE STANDARD OPERATING CIRCUIT (When the number of φV terminals is 12, please connect in this example of a circuit.-1) PW φ φ φ φ φ φ φ OOFD φ VS1A φ...
RJ33N3AD0LG 6 CHARACTERISTICS (Drive method : 1/30s frame accumulation) :+25℃, but +60℃ for parameter No.4 and No.5. Operating conditions : the typical values specified in “5 RECOMMENDED OPERATING CONDITIONS”. Color temperature of light source : 3200K, IR cut-off filter (CM-500,1 mmt) is used. Parameter Symbol Note...
RJ33N3AD0LG 8 EXAMPLE OF STANDARD OPERATING CIRCUIT (When the number of φV terminals is 12, please connect in this example of a circuit.-1) OD 1 φRS1 OOFD φLH1A φH1A φH2A φv1A φv1B φH2B φv1C φH1B φv1D φLH1B φv2 φRS2 φv3 OD 2 φv4...
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RJ33N3AD0LG ・EXAMPLE OF OPERATING CIRCUIT-2 (When the number of φV terminals is 8, please connect in this example of a circuit.-2) [Please use it, connecting φvS1A =φvS1B、φv2 =φvS2、φv3=φvS3、φv4=φvS4] OD 1 φRS1 OOFD φLH1A φH1A φH2A φv1A φv1B φH2B φv1C φH1B φv1D φLH1B φv2...
RJ33N3AD0LG 9 SPECIFICATION FOR BLEMISH (1/30 s frame accumulation) 1) Definition of blemish Level of blemish Permitted number of Comment (mV) blemish ・See fig.9-1(a), fig.9-2. 100≦ B White blemish ・Vout = Vstd B <100 (Exposed) no count 120≦ B 55≦ B <120 Black blemish (Exposed) 40≦...
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RJ33N3AD0LG 【MEASURING CONDITION】 ・ Ta: 60 ℃ ・ Measuring block diagram CCD output Amplifier output AMP CCD CDS The output voltage is measured at the CCD output. The gain of the amplifier is adjusted to the unity between the CCD output and the amplifier output. White blemish Black blemish Vout...
RJ33N3AD0LG 10 PRECAUTIONS 10.1 Package breakage In order to prevent the package from being broken, observe the following instructions: The CCD is a precise optical component and the package material is ceramic. Therefore, ・Take care not to drop the device when mounting, handling, or transporting. ・Avoid giving a shock to the package.
10.4 Other Soldering should be manually performed within 2 seconds at 400 ºC maximum at soldering iron. Fig. 10-1 shows Sharp's recommended temperature profile for reflow soldering of ceramic. To ensure satisfactory results, Your company should evaluate and confirm actual mounting performance.
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RJ33N3AD0LG (ºC) (sec) Mark Contents Unit Rising ratio of temperature 1~5ºC /sec Temperature of pre heat 160~180 ºC Period of keeping pre heat 90±30sec Temperature of heat 230ºC or more Period of high temperature 40~60sec Peak temperature 250±5ºC Falling ratio of temperature 2~5ºC /sec Frequency of reflow 2 times(*1)
RJ33N3AD0LG 11 PACKAGE OUTLINE AND PACKING SPECIFICATION 11.1 Package Outline Specification Refer to attached drawing. (The seal resin stick out from the package shall be passed.) 11.2 Markings Marking contents (1) .Product name R J 3 3 N 3 A D 0 LT :...
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RJ33N3AD0LG 11.4 Precaution 1) .Before unpacking, confirm the imports of the chapter "Handling Precaution" in this device specification. 2) .Unpacking should be done on the stand treated with anti-ESD. At that time, the same anti-ESD treatment should be done to operator's body, too. 11.5 Chemical substance information in the product Product Information Notification based on Chinese law, Management Methods for Controlling Pollution by Electronic Information Products.
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RJ33N3AD0LG RJ33N3A D0LT S 材質 MATERIAL 仕上 FINISH 名称 NAME コード CODE Assembly Process Production Engineering Dept. 図番 ELECTRONIC COMPONENTS AND DEVICES GROUP DRAWING No. 5 0 SHARP CORPORATION...
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R J 3 3 N 3 A D 0 L G ' 1 3 . 0 5 . 2 4 仕上 FINISH 材質 MATERIAL 名称 NAME コード Assembly Process Production Engineering Dept. CODE ELECTRONIC COMPONENTS AND DEVICES GROUP 図番 DRAWING No. SHARP CORPORATION...
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