Package Outlines And Packing Specifications - Sharp RJ33N3AD0LT Specifications

11 PACKAGE OUTLINE AND PACKING SPECIFICATION
11．1 Package Outline Specification
Refer to attached drawing.
（The seal resin stick out from the package shall be passed.）
11．2 Markings
Marking contents
（1） ．Product name
（2） ．Company name
（3） ．Country of origin
（4） ．Date code
Positions of markings are shown in the package outline drawing.
But,markings shown in that drawing are not provided any measurements of their characters
and their positions.
11．3 Packing Specification
3－1．Packing materials
Material Name
Cover Tape
Device case
Device tray
Cover tray
PP band
Moisture-proof bag
Desiccant
Buffer
Label
3－2．External appearance of packing
Refer to attached drawing
ISSUE NUMBER
35246ADC
R J 3 3 N 3 A D 0 LT
：
Ｓ
：
ＪＰＮ
：
ＹＹ ＷＷ Ｘ ＸＸ
：
Material Spec.
Polyimide(1device/tape)
Cardboard(720devices/case)
Conductive plastic
(90devices/tray)
Conductive
plastic(1tray/case)
Polypropylene
Al-laminated bag
Silica gel
Cardboard(2sheets/case)
Paper
(NOTE)
RJ33N3AD0LG
Denotes the production ref.code.(1～2 figures)
Denotes the production day of the week.
１ ２
SUN. MON.
Denotes the production week.
（01,02,03,...,52,53）
Denotes the production year.
(Lower two digits of the year.)
Glass lid covering
Device tray fixing
Device packing(8trays/case)
Device packing
Device tray fixing
Device packing
Device packing
Shock absorber of device tray
Indicates part number,quantity and date of
manufacture
３ ４ ５
TUE. WED. THU. FRI.
Purpose
23
６ ７
SAT.