Table of Contents
Advertisement
SX127X RF Module
4. Remark
DIO0、 DIO1、 DIO2、 DIO3、 DIO4、 DIO5 is generally purpose I/O, can be configured into multiple function,please check SX1278/SX1276
manual for more details, floating is allowed.
RST, TXEN, RXEN pin must be connected, in which RST control the reset of chip, TXEN, RXEN pin control RF switch.
Make sure the grounding is good, with low power ripple, also should increase filter capacitor and as close as possible to the VCC and
GND pins.
SPI communication rate should not be set too high, usually around 1M.
Make sure TXEN pin is high level, RXEN pin is low level when transmitting.
make sure RXEN pin is high level, TXEN pin is low level when receiving.
make sure TXEN、RXEN pin is low level before turning off.
The register configuration can be reinitialized to obtain higher stability when the chip is invalid.
5. Production Guidance
5.1 Reflow Temperature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
Profile Feature
Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
User Manual of E19 Series Modules
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8 minutes max
10
Advertisement
Table of Contents
