HP 280 G3 Microtower Business Product End-Of-Life Disassembly Instructions page 2

Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Crisscross Screw Driver
Description #2 Hexagon Screw Driver
Description #3 Electric Iron
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel (Step1)
2. Disconnect ODD/ HDD power cable and ODD/ HDD SATA cable from ODD (Step2~Step3)
3. Remove ODD/ HDD from chassis (Step4~Step7)
4. Remove all cables and heat sink from MB (Step8~Step11)
5. Remove the Memory/ CPU/ Battery from MB (Step12~Step14)
6. Remove front panel from chassis (Step15)
7. Remove MB from chassis (Step16)
8. Remove system fan (Step17)
9. PSU from chassis (Step17~Step19)
10. Separate PSU and remove the Electrolytic Capacitors (Step 20~Step23)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
Step1 Loose thumb screw and remove
access panel.
EL-MF877-01
Tool Size (if
applicable)
PH1
T-15
QUICK 310
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