Components And Connectors - Lenovo System x3550 M4 Product Manual

Low-voltage Intel Xeon processors draw less energy to satisfy the demands of power and thermally
constrained data centers and telecommunication environments.
Low-voltage 1.35 V DDR3 memory RDIMMs consume up to 19% less energy compared to 1.5 V DDR3
RDIMMs.
Solid-state drives (SSDs) consume as much as 80% less power than traditional spinning 2.5-inch HDDs.
The server uses hexagonal ventilation holes, a part of Calibrated Vectored Cooling™ technology.
Hexagonal holes can be grouped more densely than round holes, providing more efficient airflow
through the system.
IBM Systems Director Active Energy Manager™ provides advanced data center power notification and
management to help achieve lower heat output and reduced cooling needs.

Components and connectors

Figure 2 shows the front of the server.
Figure 2. Front view of the System x3550 M4
Figure 3 shows the rear of the server.
Figure 3. Rear view of the System x3550 M4
System x3550 M4 (E5-2600 v2) (withdrawn product) 4