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2.3
Recommended Dimensions for User System Mount Pad
Figure 6 shows the recommended dimensions for the mount pad (footprint) for the user system with
an IC socket for an TFP-100G package (NQPACK100SE: manufactured by Tokyo Eletech
Corporation). Note that the dimensions in figure 6 are somewhat different from those of the actual
chip's mount pad.
Figure 6
15.10 (min.)
11.10 (max.)
0.40 × 24 = 9.60 ± 0.05
0.40 ± 0.05
0.20 ± 0.05
Recommended Dimensions for Mount Pad
Unit: mm
9
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