LG -D385 Service Manual page 286

Level Location No.
6 ZD5300 Diode,TVS
Capacitor
6 C2369
Ceramic,Chip
6 R2107 Resistor,Chip
Inductor
6 L1106
Multilayer,Chip
6 U5100 IC,WiFi
Module
6 U1100
Tx Module
R2206
R2207
6 Resistor,Chip
R2208
R2209
C6450
Capacitor
6 C6451
Ceramic,Chip
C9601
D9500
D9501
D9502
6 Diode,TVS
D9503
D9504
D9505
Capacitor
6 L1606 (High Frequency)
Ceramic,Chip
C5100 Capacitor
6
C5101 Ceramic,Chip
Capacitor
6 C8013
Ceramic,Chip
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Description Part Number
EAH62233601
EAE62282201
EBC62581801
ELCH0001056
EAN62698901
EAT62313201
ERHY0009516
ECZH0000830
EAH61693001
EAE62946201
ECZH0001217
EAE62505701
Spec
ESD18VU1B-02LRH 18.5V 20 22.9V 2A 0W TSLP-
2-17 R/TP 2P 1 INFINEON TECHNOLOGIES
(ASIA PACIFIC) PTE LTD.
GRM033R71E102KA01D 0.000000001F 10% 25V
X7R -55TO+125C 0603 R/TP 0.3+/-0.03 MM -
MURATA MANUFACTURING CO.,LTD.
RC0603F392CS 3.9KOHM 1% 1/20W 0603 R/TP -
SAMSUNG ELECTRO-MECHANICS CO., LTD.
1005GC2T2N7SLF 2.7NH 0.3NH - 300mA
0.17OHM 5.5GHZ 8 SHIELD NONE
1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS
LTD.
WCN-3620-0-61WLNSP WiFi(11bgn)+BT4.0+FM
IC for QMC 28nm BB, 3.32*3.55*0.63, 0.4pitch
WLCSP R/TP 61P QUALCOMM
INCORPORATED.
HRPF89165B 0DBM 0DB 0% 0A 0A 0DB 0DBM
0DBM 42P 6.0x6.0x1.0MM TxM for WTR2605,
SP6T MURATA MANUFACTURING CO.,LTD.
MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP
- ROHM.
C1005C0G1H330JT000F 33pF 5% 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
uClamp0541Z 5V 6V min 12V 2A 30W
SLP0603P2X3 R/TP 2P 1 SEMTECH
INTERNATIONAL AG
GRM0335C1E2R2C_H 2.2pF 0.25PF 25V C0G -
55TO+125C 0603 R/TP 0.3+-0.03 L:0.6+-0.03
W:0.3+-0.03 T:0.3+-0.03 MURATA
MANUFACTURING CO.,LTD.
GRM155R60J474K 470nF 10% 6.3V X5R -
25TO+70C 1005 BK-DUP - MURATA
MANUFACTURING CO.,LTD.
CL10A105KB8NNNC 1uF 10% 50V X5R -
55TO+85C 1608 R/TP 0.9T max. - SAMSUNG
ELECTRO-MECHANICS CO., LTD.
- 286 - Copyright © 2014 LG Electronics. Inc. All right reserved.
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Only for training and service purposes