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Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Screw driver
Hexagon Screw Driver
Flathead screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Use tool to release screws on monitor, then separate the Stand from monitor head
2.
Use tool to release screws on monitor, then use tool to separate rear cover from monitor head through tear down slot.
3.
Disassemble the lamp wire, LVDS FFC*2 and ctrl-BD FFC from connector, tear the tape*2 from chassis, separate
Assy- chassis from monitor head by hand.
4. Disassemble the lamp wire from panel, and disassemble ctrl-BD from MF by hand.
5. Use tool to release screws*9 on MF, then separate the MF from panel.
6. Use tool to release Hexagon screw*2 from SHD, then release screws*7 on the power board and interface board, then
disassemble power-BD and interface-BD from the chassis by hand.
7. Disassemble the LVDS*2 by hand.
8. Release Column & base by hand.
9. Use tool to release screw*3 from Column.
10.
11.
12.
13.
14.
15.
16.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Use tool to release screws on monitor, then separate the Stand from monitor head
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
Tool Size (if
applicable)
2
1
1
Page 2
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