Basic Operation; Hardware Design - Ebyte E19 Series User Manual

Chengdu Ebyte Electronic Technology Co., Ltd.
12 SCK
13 MISO
14 MOSI
15 NSS
16 TXEN
17 RXEN
18 GND
19 ANT
20 GND
21 GND
22 GND

4. Basic operation

4.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and

the module needs to be reliably grounded.；
Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse

connection may cause permanent damage to the module；
Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the

maximum value the module will be permanently damaged；
Please check the stability of the power supply, the voltage can not be fluctuated frequently；

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the

margin, so the whole machine is beneficial for long-term stable operation.；
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other

parts with large electromagnetic interference.；
High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the

module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the
copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of
the module and routed in the Bottom Layer；
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer

or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees；
It is assumed that there are devices with large electromagnetic interference around the module that will greatly

affect the performance. It is recommended to keep them away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done；
Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,

power traces) around the module that will greatly affect the performance of the module. It is recommended to stay
away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding
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Input
Output
Input
Input
Radio frequency switch control, make sure the TXEN pinis in high level, RXEN pin is
Input
in low level when transmitting.
Radio frequency switch control, make sure the TXEN pinis in high level, RXEN pin is
Input
in low level when transmitting
-
-
-
-
-
SPI clock
SPI clock
SPI clock
Chip select
Ground electrode, connected to the power reference ground
Antenna
Ground electrode, connected to the power reference ground
Ground electrode, connected to the power reference ground
Ground electrode, connected to the power reference ground
E19-915M30S User Manual
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