CCS Technical Documentation
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2 LED drivers
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IR Interface
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Voltage references needed for analogue blocks
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Charging function
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Baseband regulators
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RF regulators
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RF interface converters
The UEM is housed in a 168-pin uBGA package (12x12mm, 0.8mm pitch).
External flash and external SRAM
The Combo-Memory is a multi chip package memory which combines 64Mbit (4Mx16)
muxed burst multi bank Flash and 4Mbit muxed CMOS SRAM. These two dies are stacked
on each other in one package. The functionality of the Flash memory is the same, as it is
known from generic BB4.0 products.
The combo is supplied by single 1.8V for read, write and erase operation.
This Combo memory is housed in a 48-ball TBGA type with a 0.5mm ball pitch. The outer
dimensions are 10x8mm and the thickness is 1.1 mm.
Energy management
The energy management of RH-6 is based on BB 4.0 architecture. A so called semi fixed
battery (BL-4C) supplies power primarily to UEM ASIC and the RF PA. UEM includes sev-
eral regulators to supply RF and baseband. It provides the energy management including
power up/down procedure.
Power supply modes
The functional behavior of the UEM can be divided into 7 different states. Since the UEM
controls the regulated power distribution of the phone, each of these states affects the
general functionality of the phone:
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No supply
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Backup
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Power off
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Reset
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Power on
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Sleep
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Protection
Issue 1 10/2003
Company Confidential
6 - BB Description & Troubleshooting
© 2003 Nokia Corporation.
RH-6
Page 9