Sony MAP-S1 Service Manual page 43

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen
(Conductor Side) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side: Parts on the pattern face side seen
(SIDE B) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) the parts face are indicated.
• MAIN board is multi-layer printed board. However, the
patterns of intermediate layers have not been included in
diagrams.
• Indication of transistor.
C
Q These are omitted.
B E
• Abbreviation
CND : Canadian model
HK : Hong Kong model
MY : Malaysia model
Note: Refer to the "NEW/FORMER DISCRIMINATION OF MAIN,
NETWORK, FRONT-L AND AMP BOARDS" on page 4 for
how to distinguish suffi x-11 and suffi x-12 of MAIN, NET-
WORK, FRONT-L and AMP boards for Canadian model.
MAP-S1
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• 2 : Nonfl ammable resistor.
• C : Panel designation.
Note: Note:
The components identi- Les composants identifi és
fi ed by mark 0 or dotted par une marque 0 sont
line with mark 0 are criti- critiques pour la sécurité.
cal for safety. Ne les remplacer que par
Replace only with part une pièce portant le nu-
number specifi ed. méro spécifi é.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : TUNER (FM)
( ) : CD
< > : TUNER (DAB)
[ ] : USB
* : Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : AUDIO
f : TUNER
: CD PLAY
J
: USB
E
a : Bluetooth
: LAN
d
: WIRELESS LAN
G
• Abbreviation
CND : Canadian model
HK : Hong Kong model
MY : Malaysia model
Note: Refer to the "NEW/FORMER DISCRIMINATION OF MAIN,
NETWORK, FRONT-L AND AMP BOARDS" on page 4 for
how to distinguish suffi x-11 and suffi x-12 of MAIN, NET-
WORK, FRONT-L and AMP boards for Canadian model.
• Circuit Boards Location
NFC module
(RC-S801) (NFC1)
Bluetooth module
(BT1)
MS-091 board
FRONT board
FRONT-L board
HP board
USB board
FRONT-EJECT board
43 43
FRONT-KEY board
TUNER board
module (DAB tuner) (DAB1)
DAB board
WiFi module (WIFI1)
NETWORK board
AMP board
MAIN board
FRONT-R board
MAP-S1
SUBPOWER board