Basic Considerations For Manual De-Soldering - SimCom SIM300DZ Manuallines

SMT module de-soldering and rework Guidelines

5 Basic considerations for manual de-soldering

Basic considerations for manual de-soldering:
Immobility: Do not allow the parts to move during solidification of the solder. The end of the
period of solidification of the solder can be observed by a sudden change in the appearance of
the solder surface.
Overheating: The bodies of the components positioned in the stream of gas are often heated
more rapidly than the terminations to be soldered, so that for this reason also overheating
may be encountered.
Removal of excess solder: Removal of solder may be performed at various stages of the repair
operation. Sometimes it is useful to remove as much as possible of the solder before the module is
taken out of or off its place; in other cases the module has already been removed and then excess
solder must be taken off the solder lands before the repaired module or a new one can be replaced
and resoldered.
Module de-soldering and rework _UGD_V1.01
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07.12.2009