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Level
Location no
C1323
Inductor,Multilayer,
6
L1206
Chip
L1753
6
LD8950
LED,Chip
6
R1503
Resistor,Chip
6
R8401
Resistor,Chip
Inductor,Multilayer,
6
L5107
Chip
C4133
Capacitor,Ceramic,
6
C4134
Chip
C4135
C10000
Capacitor,Ceramic,
6
C5130
Chip
L7500
Inductor,Wire
6
L7501
Wound,Chip
Capacitor,Ceramic,
6
C4168
Chip
R3208
R5303
6
Resistor,Chip
R5305
R5306
Connector,Termina
6
CN9100
l Block
R5300
R5301
R5302
R6615
R6920
Wire Pad,Short
6
R6921
R7600
R9100
R9101
R9511
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Description
P/N
EAP62227001
EAV62092201
EBC62236701
ERHZ0000441
EAP62108001
ECCH0017501
EAE62685301
EAP62588001
ECCH0042302
ERHY0009505
EAG63749801
SAFP0000401
Specification
LG HK 0603 1N2S-T 1.2NH 0.3NH - 450mA - -
0.12OHM 10GHZ 4 SHIELD - 0.6X0.3X0.3MM R/TP
TAIYO YUDEN CO.,LTD
IR26-71C/L447/S63/TR8 CLEAR 1.15~1.6V 65mA
8.5 920~960nm 100mW 3012 R/TP 2P -
EVERLIGHT ELECTRONICS CO., LTD.
RC0402FR-074K75L 4.75KOHM 1% 1/16W 1005
R/TP 0.4T max. YAGEO CORPORATION
MCR01MZP5J220 22OHM 5% 1/16W 1005 R/TP -
ROHM.
LQP03TG2N2C02D 2.2NH 0.2NH - 450mA - -
0.25OHM 6GHZ 13 SHIELD - 0.6X0.3X0.3MM R/TP
MURATA MANUFACTURING CO.,LTD.
CL10A226MQ8NRNE 22uF 20% 6.3V X5R -
55TO+85C 1608 R/TP 0.8MM - SAMSUNG
ELECTRO-MECHANICS CO., LTD.
CL05A105KA5NQNC 1uF 10% 25V X5R -
55TO+85C 1005 R/TP 0.6T max. Samsung(1.0+-0.1
0.5+-0.1 0.5+-0.1) Murata (1.0+-0.05 0.5+-0.05 0.5+-
0.05) SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
MAKK2016T4R7M 4.7UH 20% - 1A 1 1.05 0.38OHM
- - SHIELD 2.0X1.25X1.0 MM - R/TP TAIYO
YUDEN CO.,LTD
CL21A475KACLRNC 4.7uF -10TO+10% 25V X5R -
55TO+85C 2012 R/TP 0.85+-0.1 - SAMSUNG
ELECTRO-MECHANICS CO., LTD.
MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP -
ROHM.
HSBC-4P25-39F1 4P 2.50MM STRAIGHT DIP
T/REEL - HAN SHIN TERMINAL CO., LTD.
AX3100 ATL SV_SHIPBACK,MAIN,A
- 245 -
Copyright © 2014 LG Electronics. Inc. All right reserved.
Remark
Only for training and service purposes
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