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Level
Location no
D8900
VA7303
6
Varistor
VA7400
VA7406
C10050
C10051
C10064
Capacitor,Ceramic,
6
C1148
Chip
C1159
C9102
L10069
6
FL1108
IC,RF Amplifier
C5105
C5111
C5112
C5113
C5114
Capacitor,Ceramic,
6
C5133
Chip
C5140
C5146
C5147
C9505
C4136
Capacitor,Ceramic,
6
C4138
Chip
C4182
6
U5200
IC,NFC
6
U3200
IC,MCP,eMMC
C5207
C5219
Capacitor,Ceramic,
6
C5220
Chip
C5222
6
R5200
Resistor,Chip
Inductor,Multilayer,
6
L6613
Chip
C3200
C3205
Capacitor,Ceramic,
6
C5104
Chip
C7200
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Description
P/N
SEVY0003601
ECCH0009103
EAN62581401
ECCH0009514
EAE62767801
EAN62632401
EAN63126301
ECZH0001215
ERHZ0000407
ELCH0001444
ECCH0000198
Specification
ICVL0505101V150FR 5.6V 0% 100pF 1.0*0.5*0.55
NONE SMD R/TP INNOCHIPS TECHNOLOGY
C0603C0G1H101JT00NN 100pF 5% 50V C0G -
55TO+125C 0603 R/TP - - TDK CORPORATION
SFMG2B0D001 1.5~3.1V 0 0 0W 0W 0 0 MCM
R/TP 8P Gain : 17.2dB NF : 0.85dB
WISOL.CO.,LTD
MCH032A(AN)100DK 10pF 0.5PF 25V X7R -
55TO+125C 0603 R/TP - ROHM.
JDK212BBJ476MD 47uF -20TO20% 6.3V X5R -
55TO+85C 2012 R/TP 0.85T - TAIYO YUDEN
CO.,LTD
PN5472A2UK/C20803 WLCSP 2.81x2.79x0.56 NFC
IC WLCSP R/TP 42P NXP Semiconductors
THGBMBG6D1KBAIL 8Gbyte
2.7VTO3.6V,1.7VTO1.95V 11.5x13.0x0.8 TR 153P
MLC NAND FBGA 8GB eMMC v5.0 (A19nm 64Gb
MLC x 1/11.5x13.0/91.0%) TOSHIBA
ELECTRONICS KOREA CORPORATION
C1005X5R1A105KT000F 1uF 10% 10V X5R -
55TO+85C 1005 R/TP - TDK KOREA
COOPERATION
MCR01MZP5J105 1MOHM 5% 1/16W 1005 R/TP -
ROHM.
0402AF-101XJEW 100NH 5% - 900mA - - 0.16OHM
1.4GHZ 8 NON SHIELD NONE 1.12X0.66X0.66MM
R/TP COILCRAFT SINGAPORE PTE LTD.
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -
55TO+85C 1005 R/TP . SAMSUNG ELECTRO-
MECHANICS CO., LTD.
- 232 -
Copyright © 2014 LG Electronics. Inc. All right reserved.
Remark
Only for training and service purposes
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