Table Of Contents - Sony CDX-1150 Service Manual

SERVICE NOTE
CAUTION
Use of controls or adjustments or performance of proce-
dures other than those specified herein may result in haz-
ardous radiation exposure.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
The laser diode in the optical pick-up block may suffer electrostatic
break-down easily. When handling it, perform soldering bridge to
the laser-tap on the flexible board. Also perform measures against
electrostatic break-down sufficiently before the operation.
The flexible board is easily damaged and should be handled with
care.
laser-tap
OPTICAL PICK-UP FLEXIBLE BOARD
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-up
block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
NOTES ON PICK-UP FLEXIBLE BOARD
The pick-up flexible board in this set is secured to the optical pick-up
with an adhesive tape. Once the tape is removed, an adhering force
becomes weak, and it cannot be reused.
Therefore, if the optical pick-up is replaced, replace also the pick-up
flexible board with a new one.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE
WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.

TABLE OF CONTENTS

1. GENERAL
Location of controls ................................................................ 3
Setting the clock ..................................................................... 3
Radio ....................................................................................... 3
CD Player ................................................................................ 3
Other Functions ...................................................................... 4
Connections ............................................................................ 4
2. DISASSEMBLY
2-1. Cover ................................................................................... 6
2-2. Front Panel Assy ................................................................. 6
2-3. Key Board ........................................................................... 7
2-4. Main Sub Assy .................................................................... 7
2-5. CD Mechanism Block ......................................................... 8
2-6. Heat Sink ............................................................................. 8
2-7. Chassis (R) Block Assy ....................................................... 9
2-8. Floating Block Assy ............................................................ 9
2-9. Roller Arm Assy ................................................................ 10
2-10. Optical Pick-up Block ....................................................... 10
3. DIAGRAMS
3-1. IC Pin Description ............................................................. 11
3-2. Block Diagram .................................................................. 13
3-3. Printed Wiring Boards -Main Section- ............................ 15
3-4. Schematic Diagram -Main Section (1/3)- ........................ 19
3-5. Schematic Diagram -Main Section (2/3)- ........................ 21
3-6. Schematic Diagram -Main Section (3/3)- ........................ 23
3-7. Schematic Diagram -Display Section- ............................. 25
3-8. Printed Wiring Board -Display Section- .......................... 27
4. EXPLODED VIEWS
4-1. Chassis Section ................................................................. 31
4-2. Front Panel Section ........................................................... 32
4-3. CD Mechanism Section (1) ............................................... 33
4-4. CD Mechanism Section (2) ............................................... 34
5. ELECTRICAL PARTS LIST
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........................................ 35