Download Print this page

Advertisement

SERVICE MANUAL
SUPPLEMENT-1
File this supplement with the service manual.
Subject : Change of Main and Key Boards
When performing service and inspection, check the suffix of the part number of
the main and key boards.
– MAIN BOARD (SIDE B) –
MAIN Board Part No.
Former : 1-672-491-11
New
– KEY BOARD (SIDE B) –
KEY Board Part No.
Former : 1-672-492-11
New
CDX-1150
US Model
(ECN-CSB00629)
: 1-672-491-12
: 1-672-492-12
1
1
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS
AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
For schematic diagrams
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
W or less unless otherwise
4
specified.
%
: indicates tolerance.
¢
: internal component.
• C : panel designation.
Note: The components identified by mark ! or dotted line
with mark ! are critical for safety.
Replace only with part number specified.
• U : B+ Line.
• Power voltage is dc 14.4V and fed with regulated dc power
supply from ACC and BATT cords.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: FM
f
: AM
J
: CD
• ((
)) : Page of supplement-1.
For printed wiring boards
• Y : parts extracted from the conductor side.
®
: Through hole.
¢
: internal component.
• b : Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A)
parts face are indicated.
• ((
)) : Page of supplement-1.

Advertisement

loading

Summary of Contents for Sony CDX-1150

  • Page 1 CDX-1150 THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is US Model printed in each block.) For schematic diagrams • All capacitors are in µF unless otherwise noted. pF: µµF...
  • Page 2 CDX-1150 1. PRINTED WIRING BOARDS — MAIN SECTION — • Semiconductor Location Ref. No. Location (D501) B-10 D503 B-13 D504 B-12 D505 C-11 D506 D-13 D507 D-12 D508 E-11 D509 F-11 D510 E-12 D511 D512 E-10 D513 D514 D516 B-12...
  • Page 3 CDX-1150 ((Page 8))
  • Page 4 CDX-1150 2. SCHEMATIC DIAGRAM — MAIN SECTION (1/3) — ((Page 5)) • Waveforms (MODE:PLAY) 1.3Vp-p IC102 (ARF) Approx. 200mVp-p @™ IC102 (TE) Approx. 600mVp-p @£ (FE) IC102 Note: • Voltage and waveforms are dc with respect to ground under no-signal conditions.
  • Page 5 CDX-1150 3. SCHEMATIC DIAGRAM — MAIN SECTION (2/3) — ((Page 6)) Note: • Voltage is dc with respect to ground under no-signal (detuned) condition. no mark : FM < > : CD PLAY...
  • Page 6 CDX-1150 4. SCHEMATIC DIAGRAM — MAIN SECTION (3/3) — ((Page 5)) Note: • Voltage is dc with respect to ground under no-signal (detuned) condition. no mark : FM ) : AM < > : CD PLAY...
  • Page 7 CDX-1150 5. SCHEMATIC DIAGRAM — DISPLAY SECTION — ((Page 6)) Note: • Voltage is dc with respect to ground under no-signal (detuned) condition. no mark : FM...
  • Page 8 CDX-1150 6. PRINTED WIRING BOARD — DISPLAY SECTION — ((Page 3))
  • Page 9: Electrical Parts List

    7. ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in • Items marked “*” are not stocked since When indicating parts by reference the parts list may be different from the they are seldom required for routine service. number, please include the board. parts specified in the diagrams or the Some delay should be anticipated components used on the set.
  • Page 10 MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark A-3294-623-A MAIN BOARD, COMPLETE C154 1-107-826-11 CERAMIC CHIP 0.1uF C155 1-162-927-11 CERAMIC CHIP 100PF ********************* C401 1-107-826-11 CERAMIC CHIP 0.1uF 3-034-438-02 BRACKET (IC) C402 1-107-826-11 CERAMIC CHIP 0.1uF 3-034-441-03 HEAT SINK C403...
  • Page 11 MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C483 1-164-230-11 CERAMIC CHIP 220PF C731 1-107-823-11 CERAMIC CHIP 0.47uF C500 1-107-826-11 CERAMIC CHIP 0.1uF C732 1-162-970-11 CERAMIC CHIP 0.01uF C501 1-128-659-21 ELECT 3300uF C733 1-162-970-11 CERAMIC CHIP 0.01uF C502 1-125-898-11 CERAMIC CHIP...
  • Page 12 MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark IC102 8-759-574-25 IC AN8835SB-E1 R105 1-216-841-11 METAL CHIP 1/16W IC103 8-759-574-24 IC BA5984FP-E2 R106 1-216-864-11 METAL CHIP 1/16W IC400 8-759-487-82 IC LC75374E R107 1-216-833-00 RES,CHIP 1/16W IC500 8-759-578-83 IC HA13158A R108 1-216-845-11 METAL CHIP...
  • Page 13 MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R451 1-220-158-11 RES,CHIP 3.6K 1/16W R618 1-216-833-00 RES,CHIP 1/16W R456 1-208-518-41 RES,CHIP 1/10W R619 1-216-821-11 METAL CHIP 1/16W R470 1-216-837-11 METAL CHIP 1/16W R620 1-216-864-11 METAL CHIP 1/16W R471 1-216-635-11 METAL CHIP...
  • Page 14 CDX-1150 Sony Corporation 9-926-489-81 99G0419-1 Mobile Electronics Company Printed in Japan C1999. 7 Published by Quality Assurance Dept.