About This Guide This document provides the design guidelines essential for incorporating either an Eterna LTP5901 or LTP5902 module. The document covers design, layout, EMI, and some manufacturing considerations. Audience This document is intended for system developers, hardware designers, and layout engineers. Related Documents The following related documents are available: Eterna Serial Programmer Guide...
1 Design Guidelines Schematic Design The LTP5901 and LTP5902 require little external circuitry, as the devices references, decoupling and power supply filtering are integrated. The LTP5901 and LTP5902 have been modularly certified for operation in many geographies – see the ETERNA2 User’s Guide for the currently supported geographies and regulatory related specifications.
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representative for details on how to order license key certificates. The certificate contains a product key and instructions for requesting the generation of a license key, which typically takes one to two business days to receive a license key. License keys are entered via either the set config command documented in SmartMesh IP Manager CLI Guide or the setLicense...
generally cost more than powdered iron core inductors with similar electrical characteristics. Eterna LTP5901 Recommended Land Pattern (Chip Antenna) Two common practices for defining land patterns are Non Solder Mask Defined, NSMD, and Solder Mask Defined, SMD. Given the lead pitch of the LTP5901 and that tolerances for metal etch are commonly more precise than solder mask deposition, it is recommended to use NSMD land patterns.
Eterna LTP5902 Recommended Land Pattern (MMCX) Two common practices for defining land patterns are Non Solder Mask Defined, NSMD, and Solder Mask Defined, SMD. Given the lead pitch of the LTP5902 and that tolerances for metal etch are commonly more precise than solder mask deposition, it is recommended to use NSMD land patterns.
250 μA to 10 mA in less than 1 μs without generating a transient greater than 200 mV. For systems with regulated supplies, consultation with Linear Technology is strongly recommended. Eterna can be configured to support current limited supplies. Contact Linear Technology for details. Voltage Supervision and Reset...
2 Manufacturing Guidelines Reflow Given that Eterna modules are assembled using either “SAC305”, "Alpha OM-338 CSP" or " SMIC ECO M705-GRN360" No Clear Solder Paste, careful adherence to J-STD-020 to avoid reflowing the modules during the assembly process is necessary. The solder joint quality of the “castellations”...
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SmartMesh Industrial and Eterna are trademarks of Dust Networks, Inc. The Dust Networks logo, Dust, Dust Networks, and SmartMesh are registered trademarks of Dust Networks, Inc. The Linear logo is a registered trademark of Linear Technology Corporation. All third-party brand and product names are the trademarks of their respective owners and are used solely for informational purposes.
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