Module Is Easy To Damage; Ber(Bit Error Rate) Is High; Production Guidance; Reflow Soldering Temperature - Ebyte E73-2G4M08S1E User Manual

Chengdu Ebyte Electronic Technology Co., Ltd.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;
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The signal will be affected when the antenna is near metal object or put in a metal case;
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Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
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distance);
The power supply low voltage under room temperature is lower than recommended value, the lower the voltage, the
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lower the transmitting power;
Due to antenna quality or poor matching between antenna and module.
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6.2 Module is easy to damage

Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will
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lead to a permanent damage to the module.
Please check the stability of power supply and ensure the voltage not to fluctuate too much.
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Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic
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susceptibility.
Please ensure the humidity is within limited range for some parts are sensitive to humidity.
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Please avoid using modules under too high or too low temperature.
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6.3 BER(Bit Error Rate) is high

Here are co-channel signal interference nearby, please be away from interference sources or modify frequency and
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channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable;
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The extension line and feeder quality are poor or too long, so the bit error rate is high.
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7 Production guidance

7.1 Reflow soldering temperature

Profile Feature
Solder Paste
Preheat Temperature min (Tsmin)
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time(tL)Maintained Above(TL)
Peak temperature(Tp)
Aveage ramp-down rate(Tp to Tsmax)
Time 25℃ to peak temperature
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Curve characteristics
Solder paste
Min preheating temp.
Max preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp
Time below liquid phase
line
Peak temp
Average ramp-down rate
Time to peak
temperature for 25℃
E73-2G4M08S1E User Manual
Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8 minutes max