H3C SecPath L5030 Installation, Quick Start page 3

Mounting the device in a rack 安装设备到机柜
Installing interface modules安装接口模块
Interface modules are not hot swappable.
To avoid module damage, do not touch the components on an interface module.
Install a filler panel in an unused slot to prevent dust from entering the chassis and ensure good ventilation.
接口模块不支持热插拔。
请勿直接接触接口模块上的元器件，避免造成损坏。
若设备插槽没有安装接口模块，请及时安装假面板，防止灰尘进入设备，同时又保证设备的良好通风散热。
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1
2
5
3
4
4
Compatible slots for the interface modules 接口模块安装槽位
Install the interface modules into the compatible slots. 不同接口模块适配的槽位不同
Interface module 接口模块
NSQM1TG8A
NSQM1QG2A
NSQM1G4XS4
NSQM1GT8A
NSQM1GP8A
NSQM1GT4PFCA
Installing and removing a hard disk 安装与拆卸硬盘
Hard disks are not hot swappable.
No hard disk is provided with the device. Prepare them yourself as required. For the system to identify the
disks, use disks from H3C.
To avoid ESD damage, always wear an ESD wrist strap when working with a hard disk.
Hold a hard disk by its two sides and do not touch its components or squeeze, shake, or hit the hard disk.
Install a filler module in an unused hard disk slot to prevent dust from entering the chassis.
For a hard disk to operate correctly, execute the fdisk and format commands to partition and format the
file system before using the hard disk.
Before removing a partitioned hard disk, you must use the umount command to unmount all file systems
on the hard disk.
硬盘不支持热插拔。
设备不随机提供硬盘，请您根据需求自行选购。
请采用H3C公司的硬盘，否则系统无法识别。
安装和拆卸硬盘时，请佩戴防静电腕带以避免硬盘受到静电放电的损害。
手接触硬盘时拿硬盘的两侧，不要触碰元器件或挤压、振动、撞击硬盘。
若不再安装硬盘时，请安装假面板，以避免灰尘或异物进入设备内部造成静电吸附或损坏。
为确保硬盘的正常使用，使用硬盘前，需在命令行视图下执行fdisk及format命令，对硬盘进行分区及格式
化操作。
在拔出硬盘前，需在命令行视图下执行umount命令，卸载所有的分区才能安全拔出硬盘，否则，可能会引
起硬盘存储介质的损坏。
Installing a hard disk 安装硬盘
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Remove the filler module from the hard disk slot and then push the hard disk slowly into the slot along the slide rails.
先拆下硬盘卡槽假面板，然后将硬盘沿着插槽导轨缓慢的推进插槽。
Compatible slots 安装槽位
Slots 1 to 3
Slots 4 to 8
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1
2