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Bull Escala E1-700 Repair And Maintenance Instructions

Planning for cec hot add and hot-node repair maintenance
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Planning for CEC hot add and hot-node
repair maintenance
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86 A1 43FF 05

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  • Page 1 Planning for CEC hot add and hot-node repair maintenance REFERENCE 86 A1 43FF 05...
  • Page 3 ESCALA Models Reference The ESCALA Power7 publications concern the following models: Bull Escala E1-700 / E3-700 (31E/2B ,8231-E2B) Bull Escala E1-705 (31E/1C, 8231-E1C) Bull Escala E1-715 (31E/1D, 8231-E1D) Bull Escala E3-705 (31E/2C, 8231-E2C) Bull Escala E3-715 (31E/2D, 8231-E2D) Bull Escala E2-700 / E2-700T...
  • Page 4 Quoting of brand and product names is for information purposes only and does not represent trademark misuse. The information in this document is subject to change without notice. Bull will not be liable for errors contained herein, or for incidental or consequential damages in connection with the use of this material.

  • Page 5: Table Of Contents

    Contents Safety notices ....... . . v Planning for CEC hot-node add and hot-node repair maintenance... 1 What's new in Planning for CEC hot-node add and hot-node repair maintenance .

  • Page 7: Safety Notices

    Safety notices Safety notices may be printed throughout this guide: v DANGER notices call attention to a situation that is potentially lethal or extremely hazardous to people. v CAUTION notices call attention to a situation that is potentially hazardous to people because of some existing condition.
  • Page 8 DANGER When working on or around the system, observe the following precautions: Electrical voltage and current from power, telephone, and communication cables are hazardous. To avoid a shock hazard: v Connect power to this unit only with the IBM provided power cord. Do not use the IBM provided power cord for any other product.
  • Page 9 Observe the following precautions when working on or around your IT rack system: v Heavy equipment–personal injury or equipment damage might result if mishandled. v Always lower the leveling pads on the rack cabinet. v Always install stabilizer brackets on the rack cabinet. v To avoid hazardous conditions due to uneven mechanical loading, always install the heaviest devices in the bottom of the rack cabinet.
  • Page 10 CAUTION: Removing components from the upper positions in the rack cabinet improves rack stability during relocation. Follow these general guidelines whenever you relocate a populated rack cabinet within a room or building: v Reduce the weight of the rack cabinet by removing equipment starting at the top of the rack cabinet.
  • Page 11 (L003) All lasers are certified in the U.S. to conform to the requirements of DHHS 21 CFR Subchapter J for class 1 laser products. Outside the U.S., they are certified to be in compliance with IEC 60825 as a class 1 laser product.
  • Page 12 CAUTION: Data processing environments can contain equipment transmitting on system links with laser modules that operate at greater than Class 1 power levels. For this reason, never look into the end of an optical fiber cable or open receptacle. (C027) CAUTION: This product contains a Class 1M laser.

  • Page 13: Planning For Cec Hot-Node Add And Hot-Node Repair Maintenance

    Planning for CEC hot-node add and hot-node repair maintenance CEC hot-node add and hot-node repair maintenance operations improve system availability by avoiding a scheduled system outage. Hardware can be added and repaired while the system is powered on, but depending on the specific model, all critical applications should be quiesced (stopped or powered off), or moved to another system using Live Partition Mobility (LPM).

  • Page 14: What's New In Planning For Cec Hot-Node Add And Hot-Node Repair Maintenance

    Note: All of the hot add and repair activities must be performed by a service representative. Checklists are available that list the prerequisite planning tasks that are required prior to performing hot maintenance. Special considerations for CEC hot-add and hot-repair The following special considerations need to be taken into account when performing CEC hot-node add and hot-node repair maintenance operations.
  • Page 15 Table 1. CEC hot-node add and hot-node repair maintenance operations checklists for models 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC Operations Models 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC tasks Responsibility Ensure that sufficient space is available in the rack that contains Customer the system for another node to be installed under the existing Hot-node add nodes.
  • Page 16 Table 1. CEC hot-node add and hot-node repair maintenance operations checklists for models 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC (continued) Operations Models 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC tasks Responsibility Verify that service processor redundancy is enabled, except on a Customer system with a single node. Service representative must To enable service processor redundancy on the managed system verify...
  • Page 17 Table 1. CEC hot-node add and hot-node repair maintenance operations checklists for models 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC (continued) Operations Models 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC tasks Responsibility If the customer wants to dynamically add the new processors and Customer memory resources to activated partitions after the Hot-node add, the profiles that were used to activate the partitions must have the maximums for memory set to the appropriate values.

  • Page 18: Cec Hot-Node Add And Hot-Node Repair Maintenance Operations Checklists For Model 9119-Fhb

    Table 1. CEC hot-node add and hot-node repair maintenance operations checklists for models 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC (continued) Operations Models 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC tasks Responsibility Hardware in a node can fail at any time. When this happens a node can become unconfigured during system IPL to isolate the failure.
  • Page 19 Table 2. CEC hot-node add and hot-node repair maintenance operations checklists for model 9119-FHB (continued) Operations Model 9119-FHB tasks Responsibility Other hardware serviceable events outside of the CEC must be Service representative Hot-node repair repaired before starting a hot repair operation. This eliminates the and hot GX possibility of other hardware failures interfering with the hot adapter repair...
  • Page 20 Table 2. CEC hot-node add and hot-node repair maintenance operations checklists for model 9119-FHB (continued) Operations Model 9119-FHB tasks Responsibility Obtain and apply Capacity Upgrade on Demand (CUoD) Customer activation codes prior to the operation so that the memory Hot-node add and resources are available immediately after the hot add operation.

  • Page 21: Model 9117-Mmb, 9117-Mmc, 9179-Mhb, And 9179-Mhc System Firmware And Hmc Levels

    Table 2. CEC hot-node add and hot-node repair maintenance operations checklists for model 9119-FHB (continued) Operations Model 9119-FHB tasks Responsibility Hot-node add, On systems with large amounts of memory, Reliable Scalable Customer hot-node upgrade Cluster Technology (RSCT) PTF 3.1.0.4 must be downloaded from Service representative must (memory), the Fix Central website (http://www-933.ibm.com/support/...
  • Page 22 Table 3. System firmware and HMC levels for hot node add, hot memory addition or upgrade, hot GX adapter additions, and drawer additions and removals for 9117-MMB and 9179-MHB systems (continued) Minimum system firmware and Recommended system firmware and Function HMC levels HMC levels Memory addition or upgrade...

  • Page 23: Model 9117-Mmc And 9179-Mhc System Firmware And Hmc Levels

    Table 4. System firmware and HMC levels for repairs for 9117-MMB and 9179-MHB systems (continued) Minimum system firmware and Recommended system firmware and Function HMC levels HMC levels 19-inch I/O drawer repair All levels All levels This operation is supported on all 19-inch I/O expansion units Operator (control) panel replacement All levels...

  • Page 24: Model 9119-Fhb System Firmware And Hmc Levels

    Table 6. System firmware and HMC for repairs for 9117-MMC and 9179-MHC systems (continued) Minimum system firmware and Recommended system firmware and Function HMC levels HMC levels 19-inch CEC drawer power supply AM740_075 or later AM740_098 or later and fan V7R7.4.0M1 (MH01297) V7R7.4.0M3 (MH01333) 19-inch I/O drawer repair...
  • Page 25 Table 7. System firmware and HMC levels for hot node add, hot memory addition or upgrade, hot GX adapter additions, and drawer additions and removals for 9119-FHB (continued) Minimum system firmware and Recommended system firmware and Function HMC levels HMC levels GX adapter addition AH730_035 or later AH730_099 or later...

  • Page 26: Preparing For Hot Repair Or Upgrade Utility

    Table 8. System firmware and HMC levels for repairs for 9119-FHB (continued) Minimum system firmware and Recommended system firmware and Function HMC levels HMC levels 24-inch I/O drawer repair All levels All levels This operation is supported on all 24-inch I/O expansion units Bulk power AH730_035 or later AH730_099 or later...
  • Page 27 Figure 1. FRU selection within Prepare For Hot Repair or Upgrade Utility 5. Click Next. 6. Click OK when prompted to continue with the Advanced Power Control command. The Prepare for Hot Repair or Upgrade utility displays one of the following: v A message indicates why a node evacuation of the selected node is not allowed.
  • Page 28 Figure 2. Prepare for Hot Repair or Upgrade Main window The Prepare for Hot Repair or Upgrade window displays a summary of conditions that must be corrected before staring the node evacuation process. Use the four tabs (Platform, Partitions, Memory, and Processors) to view errors or warnings. An individual message can be selected to view additional details.
  • Page 29 Note: Shutting down a partition frees up memory and processor resources. If a partition must be shut down, click Recheck to reevaluate the memory and processor resources. Common messages for Prepare for Hot Repair or Upgrade Some of the common error conditions and warning messages that are displayed in the Prepare for Hot Repair or Upgrade utility for node evacuation are listed in Table 9.
  • Page 30 Table 9. Common error conditions and information messages (continued) Common error condition or Message type information message Description Platform Unit will be taken offline This message is a warning message that indicates a messages system unit or expansion unit will be varied off during the service procedure.
  • Page 31 Table 9. Common error conditions and information messages (continued) Common error condition or Message type information message Description Partition I/O resource in use by Linux partition This message indicates that an I/O resource that is being messages used by an active Linux logical partition is impacted by the node evacuation procedure.
  • Page 32 Table 9. Common error conditions and information messages (continued) Common error condition or Message type information message Description Partition Partition not node evacuation-capable This error message indicates that an IBM i partition is not messages capable of supporting the node evacuation function. Click on the message text to view the name of the partition that does not support node evacuation.
  • Page 33 Figure 3. Processors tab showing insufficient processors condition Planning for CEC hot-node add and hot-node repair maintenance...
  • Page 34 Figure 4. Details for the Unit will be taken offline message...
  • Page 35 Figure 5. Details for the IBM i In use IO resource message Planning for CEC hot-node add and hot-node repair maintenance...
  • Page 36 Figure 6. Details for the Critical disk resource attached message...
  • Page 37 Figure 7. Partitions tab showing error messages for AIX resources Planning for CEC hot-node add and hot-node repair maintenance...
  • Page 38 Figure 8. Details for the I/O resource in use by AIX partition message...
  • Page 39 Figure 9. Partitions tab showing error messages for Linux resources Planning for CEC hot-node add and hot-node repair maintenance...

  • Page 40: Model 9117-Mmb, 9117-Mmc, 9179-Mhb, And 9179-Mhc Multidrawer External Smp And Fsp Flex Cabling

    Figure 10. Details for the I/O resource in use by Linux partition message Model 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC multidrawer external SMP and FSP flex cabling Learn how to properly connect the external symmetric multiprocessor (SMP) and flexible service processor (FSP) flex cables to 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC multidrawer systems. Figure 11 on page 29 shows the configuration of the front SMP flex cables for 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC systems with a two socket central processing unit (CPU) card.
  • Page 41 Figure 11. Model 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC multidrawer (two socket CPU card) SMP flex cabling Figure 12 shows the configuration of the front SMP flex cables for 9179-MHC systems with a four socket CPU card. Figure 12. Model 9179-MHC multidrawer (four socket CPU card) SMP flex cabling Planning for CEC hot-node add and hot-node repair maintenance...
  • Page 42 Figure 13 shows the configuration of the rear FSP flex cables for all 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC systems. Figure 13. Model 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC multidrawer FSP flex cabling Figure 14 on page 31 shows the front SMP and rear FSP flex cabling location codes for all 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC systems.

  • Page 43: Cec Hot-Node Add And Hot-Node Repair Maintenance On A Two Drawer System With A Two Socket Cpu Card - Front

    Figure 14. Model 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC multidrawer flex cabling connector location codes. The front of the server with SMP connector location codes is shown in the first illustration in this figure. The back of the server for systems that have an FSP card (CCIN 2BBB) installed is shown in the middle illustration in this figure.

  • Page 44: Cec Hot-Node Add And Hot-Node Repair Maintenance On A Two Drawer System With A Four Socket Cpu Card - Front

    Figure 15. Model 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC two drawer flex cabling (two socket CPU card) CEC hot-node add and hot-node repair maintenance on a two drawer system with a four socket CPU card - Front Perform CEC hot-node add and hot-node repair maintenance on the front CEC (central processing unit, memory, and other CEC components) or drawer replacement of either drawer 1 or drawer 2.

  • Page 45: Cec Hot-Node Add And Hot-Node Repair Maintenance On A Two Drawer System - Rear

    Figure 16. Model 9179-MHC two drawer flex cabling (four socket CPU card) CEC hot-node add and hot-node repair maintenance on a two drawer system - Rear Perform CEC hot-node add and hot-node repair maintenance on the rear FSP or drawer replacement of either drawer 1 or drawer 2.

  • Page 46: Cec Hot-Node Add And Hot-Node Repair Maintenance On A Three Drawer System With A Two Socket Cpu Card - Drawer 1 Front

    CEC hot-node add and hot-node repair maintenance on a three drawer system with a two socket CPU card - Drawer 1 front Perform CEC hot-node add and hot-node repair maintenance on the front CEC (central processing unit, memory, and other CEC components) or drawer replacement of drawer 1. This procedure is not necessary for hard disk drive, storage media, or assembly.

  • Page 47: Cec Hot-Node Add And Hot-Node Repair Maintenance On A Three Drawer System With A Four Socket Cpu Card - Drawer 1 Front

    7. Reinstall SMP flex assembly 3 to connector P3-T2 on drawer 1 and to connector P3-T1 on drawer 3. 8. Reinstall SMP flex assembly 4 to connector P3-T2 on drawer 2 and to connector P3-T2 on drawer 3. 9. Reinstall the front bezel on drawer 1. 10.

  • Page 48: Cec Hot-Node Add And Hot-Node Repair Maintenance On A Three Drawer System With A Four Socket Cpu Card - Drawer 2 Front

    CEC hot-node add and hot-node repair maintenance on a three drawer system with a four socket CPU card - Drawer 2 front Perform CEC hot-node add and hot-node repair maintenance on the front CEC (central processing unit, memory, and other CEC components) or drawer replacement of drawer 2. This procedure is not necessary for hard disk drive, storage media, or assembly.

  • Page 49: Cec Hot-Node Add And Hot-Node Repair Maintenance On A Three Drawer System - Drawer 1 Rear

    15. Reinstall the front bezel on drawer 3. Figure 19. Model 9179-MHC three drawer flex cabling (four socket CPU card) - front CEC hot-node add and hot-node repair maintenance on a three drawer system - Drawer 1 rear Perform CEC hot-node add and hot-node repair maintenance on the rear FSP or drawer replacement of drawer 1.

  • Page 50: Cec Hot-Node Add And Hot-Node Repair Maintenance On A Three Drawer System - Drawer 3 Rear

    Attention: FSP cable connector plugging sequence is critical. The cable connector P2-T1 must be plugged before completing all other connections for a given enclosure. Failure to connect the P2-T1 connector first may cause system errors. 1. Remove the FSP cover from drawer 1. 2.

  • Page 51: Cec Hot-Node Add And Hot-Node Repair Maintenance On A Four Drawer System With A Two Or Four Socket Cpu Card - Drawer 1 Front

    Figure 20. Model 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC three drawer flex cabling - rear CEC hot-node add and hot-node repair maintenance on a four drawer system with a two or four socket CPU card - Drawer 1 front Perform CEC hot-node add and hot-node repair maintenance on the front CEC (central processing unit, memory, and other CEC components) or drawer replacement of drawer 1.

  • Page 52: Cec Hot-Node Add And Hot-Node Repair Maintenance On A Four Drawer System With A Two Or Four Socket Cpu Card - Drawer 2 Front

    CEC hot-node add and hot-node repair maintenance on a four drawer system with a two or four socket CPU card - Drawer 2 front Perform CEC hot-node add and hot-node repair maintenance on the front CEC (central processing unit, memory, and other CEC components) or drawer replacement of drawer 2. This procedure is not necessary for hard disk drive, storage media, or assembly.

  • Page 53: Cec Hot-Node Add And Hot-Node Repair Maintenance On A Four Drawer System With A Two Or Four Socket Cpu Card - Drawer 4 Front

    CEC hot-node add and hot-node repair maintenance on a four drawer system with a two or four socket CPU card - Drawer 4 front Perform CEC hot-node add and hot-node repair maintenance on the front CEC (central processing unit, memory, and other CEC components) or drawer replacement of drawer 4. This procedure is not necessary for hard disk drive, storage media, or assembly.

  • Page 54: Cec Hot-Node Add And Hot-Node Repair Maintenance On A Four Drawer System - Drawer 1 Rear

    CEC hot-node add and hot-node repair maintenance on a four drawer system - Drawer 1 rear Perform CEC hot-node add and hot-node repair maintenance on the rear FSP or drawer replacement of drawer 1. For information about FSP flex assembly locations and codes, see Figure 22 on page 44. Attention: FSP cable connector plugging sequence is critical.

  • Page 55: Cec Hot-Node Add And Hot-Node Repair Maintenance On A Four Drawer System - Drawer 3 Rear

    CEC hot-node add and hot-node repair maintenance on a four drawer system - Drawer 3 rear Perform CEC hot-node add and hot-node repair maintenance on the rear FSP or drawer replacement of drawer 3. For information about FSP flex assembly locations and codes, see Figure 22 on page 44. Attention: FSP cable connector plugging sequence is critical.
  • Page 56 Figure 22. Model 9117-MMB, 9117-MMC, 9179-MHB, and 9179-MHC four-drawer flex cabling - rear...

  • Page 57: Notices

    Notices This information was developed for products and services offered in the U.S.A. The manufacturer may not offer the products, services, or features discussed in this document in other countries. Consult the manufacturer's representative for information on the products and services currently available in your area.

  • Page 58: Trademarks

    This information is for planning purposes only. The information herein is subject to change before the products described become available. This information contains examples of data and reports used in daily business operations. To illustrate them as completely as possible, the examples include the names of individuals, companies, brands, and products.
  • Page 59 Federal Communications Commission (FCC) statement Note: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment.
  • Page 60 VCCI Statement - Japan The following is a summary of the VCCI Japanese statement in the box above: This is a Class A product based on the standard of the VCCI Council. If this equipment is used in a domestic environment, radio interference may occur, in which case, the user may be required to take corrective actions.
  • Page 61 Electromagnetic Interference (EMI) Statement - Taiwan The following is a summary of the EMI Taiwan statement above. Warning: This is a Class A product. In a domestic environment this product may cause radio interference in which case the user will be required to take adequate measures. IBM Taiwan Contact Information: Electromagnetic Interference (EMI) Statement - Korea Germany Compliance Statement...

  • Page 62: Class B Notices

    EN 55022 Klasse A Geräte müssen mit folgendem Warnhinweis versehen werden: "Warnung: Dieses ist eine Einrichtung der Klasse A. Diese Einrichtung kann im Wohnbereich Funk-Störungen verursachen; in diesem Fall kann vom Betreiber verlangt werden, angemessene Maßnahmen zu ergreifen und dafür aufzukommen." Deutschland: Einhaltung des Gesetzes über die elektromagnetische Verträglichkeit von Geräten Dieses Produkt entspricht dem “Gesetz über die elektromagnetische Verträglichkeit von Geräten (EMVG)“.
  • Page 63 This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:...
  • Page 64 VCCI Statement - Japan Japanese Electronics and Information Technology Industries Association (JEITA) Confirmed Harmonics Guideline (products less than or equal to 20 A per phase) Japanese Electronics and Information Technology Industries Association (JEITA) Confirmed Harmonics Guideline with Modifications (products greater than 20 A per phase) IBM Taiwan Contact Information Electromagnetic Interference (EMI) Statement - Korea...

  • Page 65: Terms And Conditions

    Dieses Produkt entspricht den Schutzanforderungen der EU-Richtlinie 2004/108/EG zur Angleichung der Rechtsvorschriften über die elektromagnetische Verträglichkeit in den EU-Mitgliedsstaaten und hält die Grenzwerte der EN 55022 Klasse B ein. Um dieses sicherzustellen, sind die Geräte wie in den Handbüchern beschrieben zu installieren und zu betreiben.
  • Page 66 IBM reserves the right to withdraw the permissions granted herein whenever, in its discretion, the use of the publications is detrimental to its interest or, as determined by IBM, the above instructions are not being properly followed. You may not download, export or re-export this information except in full compliance with all applicable laws and regulations, including all United States export laws and regulations.
  • Page 68 Printed in USA...

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