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including PCBs or PCAs already listed as a
separate item above)
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Components and waste containing
asbestos
Components, parts and materials
containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Lay the monitor on a flat, soft and clean surface.
2.
Push the button release the stand-base ass'y
3.
Remove the screws to release the Rear cover
4.
Remove the cable pin, screws and tapes
5.
Release the mainframe, take out the mylar
6.
Remove the screws and cables to detach the MB & Power board
7.
Remove the screws and seperate teh camera ass'y
8.
Left Panel, middle frame with the keyboards and panel.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
Include the cartridges, print heads, tubes, vent chambers, and
service stations. 2
PSG instructions for this template are available at
EL-MF877-01
0
0
0
0
Tool Size (if
applicable)
200mm
200mm
Page 2
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