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2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 SCREW DRIVER(PHILLIPS HEAD)
Description #2 SCREW DRIVER(PHILLIPS HEAD)
Description #3 SCREW DRIVER(PHILLIPS HEAD)
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Remove Stand Base From Display Head
2.
Remove Rear Cover From Display Head
3.
Remove Front Cover From Display Head
4.
Remove Key Board Off From Front Cover
5.
Disassemble Front Cover ASSY
6.
Disassemble Rear Cover ASSY
7.
Take Screw(*4) Off From Chassis Cover & Remove Panel
8.
Take Screw(x9) Off From P.C.B
9.
Take Screw(x6) Off From P.C.B
10. Take Off P.C.B From Chassis& Remove BKT (Printed Circuit Assemblies>10cm**2)
11. Remove Mylar From Chassis Cover
12. Remove Gasket From Chassis Cover
13. LCD PANEL EXPLODE
14. Remove VESA Cover&Pivot Cover off Stand Base
15. Remove Riser Lift Cover off Stand Base
16. Remove Base Cover & Base Cover BKT Off Stand Base
17. Remove Stand Front Cover off Stand BKT
18. Remove Stand Rear Cover Off Stand BKT
19. Remove Vesa Cover Assy Off Stand BKT
20. Remove Vesa Cover Off VESA BKT
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision A
Tool Size (if
applicable)
#0
#1
#2
Page 2
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