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HP ProDesk 480 G3 Disassembly Instructions Manual
HP ProDesk 480 G3 Disassembly Instructions Manual

HP ProDesk 480 G3 Disassembly Instructions Manual

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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 480 G3 MT Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Power cord
Cooler fan 81g,system fan 99g,PSU fan 67g
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
2
1
6
1
247g
Page 1

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Summary of Contents for HP ProDesk 480 G3

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable)
  • Page 3 Figure1 Release Thumb screw on the access panel. Figure2 Griping the tab at the end of access panel, pull towards the rear and remove from unit. Figure3 Pull 3 pcs bezel hooks and remove the front bezel Figure4 Unplug the cooler cable from PCA from chassis.
  • Page 4 Figure7 Release the HDD screws Figure8 Remove the HDD form chassis Figure9 Push the latch and release the Slim ODD. Figure10 Remove the Slim ODD form chassis. Figure11 Unplug all cable conn. from PCA. Figure12 Release 8 pcs screws from PCA EL-MF877-00 Page 4 Template Revision B...
  • Page 5 Figure13 Remove PCA from chassis Figure14 Push the hooks on both sides and then pick up the memory Figure15 Rotate the handle and open it up Figure16 Remove the CPU from board Figure17 Remove the battery from the PCA Figure18 Release the screw of the FIO cable EL-MF877-00 Page 5 Template Revision B...
  • Page 6 Figure19 Rotation and Remove the FIO module from Figure20 Push the plastic hook. chassis Figure21 Remove the PWR_LED switch from chassis Figure22 Release 1 pcs screw of speaker Figure23 Remove the speaker form chassis Figure24 Release the SD card reader screw EL-MF877-00 Page 6 Template Revision B...
  • Page 7 Figure25 Remove the SD Card reader from chassis Figure26 Release 2 pcs screws from system fan. Figure27 Remove the system fan from chassis Figure28 Release 4 pcs screws of PSU and remove it Figure29 Pull up the PSU and remove it Figure30 Cut the cable tie EL-MF877-00 Page 7...
  • Page 8 Figure31 Remove screw for bottom Figure32 Remove screw for top Figure33 Remove FG screw Figure34 Disconnect fan connector Figure35 Remove LED holder Figure36 Remove plastic cover EL-MF877-00 Page 8 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 9 Figure37 Remove PCB screw Figure38 Remove AC inlet screw Figure 39 Cut output cable, AC inlet wire, LED wire Figure40 Remove capacitors use solder iron Figure41 Heat the solder of Electrolytic Capacitors Figure42 Heat the solder of Electrolytic Capacitors greater greater than 2.5cm in diameter or height and remove it.
  • Page 10 Figure43 Heat the solder of Electrolytic Capacitors Figure44 Heat the solder of Electrolytic Capacitors greater greater than 2.5cm in diameter or height and remove it. than 2.5cm in diameter or height and remove it. (C801) (Ortega 180W ATX bronze-Delta) (C1,C6) (Gamay-S 300W APFC_AcBel) Figure45 Heat the solder of Electrolytic Capacitors Figure46 Heat the solder of Electrolytic Capacitors greater greater than 2.5cm in diameter or height and remove it...
  • Page 11 Figure49 Heat the solder of Electrolytic Capacitors Figure50 Heat the solder of Electrolytic Capacitors greater greater than 2.5cm in diameter or height and remove it. than 2.5cm in diameter or height and remove it. (C223, C224, C225, C406, C105) (Gamay-S 300W (C72 C74 C75 C33) (Crasto-S 180W APFC_Huntkey) Bronze_Lite-On) Figure51 Heat the solder of Electrolytic Capacitors...