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HP Compaq dc7800 Small Form Factor Business Product End-Of-Life Disassembly Instructions
HP Compaq dc7800 Small Form Factor Business Product End-Of-Life Disassembly Instructions

HP Compaq dc7800 Small Form Factor Business Product End-Of-Life Disassembly Instructions

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Product End-of-Life Disassembly Instructions
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive
2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Quantity
of items
included
in
product
2 or 3 (1
sys
board, 1
or 2 P/S
PCAs
1
2, 4, 7, 8,
or 5

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Summary of Contents for HP Compaq dc7800 Small Form Factor Business

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Rotate the power supply to its full upright position (1), pull the power supply forward (2), and then lift the power supply straight up and out of the chassis (3). HP uses four different power supply vendors. See the instructions below to disassemble and remove required power supply components: POWER SUPPLY 1: a.
  • Page 3: Power Supply

    c. Lift the cover off the power supply. The cover you remove is in two pieces, and hinges connect the covers to the power supply chassis. d. Using dikes, cut all cables connected to the PCA in the power supply. e.
  • Page 4 c. Lift the cover off the power supply. The cover you remove is in two pieces, and hinges connect the covers to the power supply chassis. d. Using dikes, cut all cables connected to the PCA in the power supply. e.