Reflow Soldering Curve - Ebyte E19-868M20S User Manual

Chengdu Ebyte Electronic Technology Co., Ltd.
Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature

7.2 Reflow soldering curve

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Curve characteristics
Solder paste
Min preheating temp.
Mx preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp.
Time below liquid phase line
Peak temp.
Aveage ramp-down rate
Time to peak temperature
for 25℃
E19 -868M20S User Manual
Sn-Pb Assembly Pb-Free Assembly
Sn63/Pb37 Sn96.5/Ag3/Cu0.5
100℃
150℃
60-120 sec 60-120 sec
3℃/second max 3℃/second max
183℃
60-90 sec 30-90 sec
220-235℃ 230-250℃
6℃/second max 6℃/second max
max 6 minutes max 8 minutes
150℃
200℃
217℃
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