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HP OMEN 15 Product End-Of-Life Disassembly Instructions

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Product End-of-Life Disassembly Instructions
Product Category: External Options
Marketing Name / Model
[List multiple models if applicable.]
OMEN by HP 15 Laptop PC
OMEN by HP Laptop
OMEN by HP Laptop 15
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on
the plastic part. For any questions on plastic marking, please contact
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries, excluding Li-Ion batteries.
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin cell,
etc.)
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
EL-MF877-00
Template Revision C
Last revalidation date 09-May-2018
Notes
With a surface greater than 10 sq cmMB
All types including standard alkaline, coin or button
style batteries BATTERY
Battery(ies) are attached to the product by (check all
that apply with an "x" inside the "[ ]"):
[4] screws
[
[
[
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps LCD
HPI instructions for this template are available at
HP's Sustainability
] snaps
] adhesive
] other. Explain
EL-MF877-01
Contact.
Quantity of
items
included in
product
1
1
1
Page 1

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Summary of Contents for HP OMEN 15

  • Page 1 Product Category: External Options Marketing Name / Model [List multiple models if applicable.] OMEN by HP 15 Laptop PC OMEN by HP Laptop OMEN by HP Laptop 15 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Quantity of items Item Description Notes included in product greater than 2.5 cm in diameter or height External electrical cables and cords DC Cable for External Power Supply(Power cords,Adapter) Gas Discharge Lamps Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above) Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent...
  • Page 3: Disassembly Process

    3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). Disassembly process: Step1: Remove log low assy Step2: Remove battery pack EL-MF877-00 Page 3 Template Revision C...
  • Page 4 Step3: Remove HDD assy Step4: Remove NGFF Step5: Remove Thermal module EL-MF877-00 Page 4 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
  • Page 5 Step6: Remove MB and SD board/PCB Step7: Remove LCD assy Step8: Remove Speakers& DC IN cable EL-MF877-00 Page 5 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
  • Page 6 Step9: Remove Power Board and Thermal Sensor Board Step10: Remove bezel & hinge cap assy Step11: Remove LCD panel EL-MF877-00 Page 6 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
  • Page 7 Step12: Remove hinge r & hinge l assy Step13: Remove LCD support bracket Step14: Remove EDP cable & antenna cable EL-MF877-00 Page 7 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...