Procedure; Bill Of Materials - ISSI IS31LT3135-V1 Manual

IS31LT3135­V1, IS31LT3135­V2
Dual Ch. (Main/Sub) LED Driver Evaluation Board Guide
Procedure
The IS31LT3135 evaluation board comes assembled and equipped with the purpose of allowing the user to easily
demonstrate, or evaluate, functions of the IC driver. In order to verify device operation, please follow the listed directions
carefully.
Caution: When powering on the circuit; ensure that all connections are properly linked to complete the board circuitry.
1. Connect the negative terminal of the power supply to the GND pin.
2. Connect the positive terminal of supply to the VCC pin.
3. Connect the negative end of the LED panel (LED arrays) to the LED− terminal.
4. Connect the positive end of the LED panel (LED arrays) to the LED+ terminal.
5. After ensuring connections are sound and that the circuit is complete, turn on the power supply to drive current
through the LED panel (LED arrays) and perform evaluation.
Bill of Materials
Name
Capacitor
Resistor
Diode
HBLED Driver IC
Integrated Silicon Solution, Inc. –
V2, 4/23/2012
Figure 2: IS31LT3135 evaluation board circuit schematic.
10uF±20%,16V, Surface‐mount, 0805
100nF±20%,50V, Surface‐mount, 0603
51K±1%, Surface‐mount, 0805 (V1)
47K±1%, Surface‐mount, 0805 (V2)
30K±1%, Surface‐mount, 0805
30K±1%, Surface‐mount, 0805
33±1%, Surface‐mount, 0805
Schottky type, SS16,1A, 60V, SMA
IS31LT3135, SOP‐8 Package
Table 2: IS31LT3135 Bill of Materials. Refer to Figure 2 for specific component locations
http://www.issi.com
Description Symbol Quantity
C1 1
C2 1
R1 1
R2 1
R3 1
R4 1
D1 1
U1 1
2