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VersaMax* Analog Input, 16-Bit Thermocouple Module
October 2016
Wiring Connections for Carriers with Three Rows of Terminals:
A
AI 6
AI 7
13
14
15
16
Thermistor
AI 4
7
8
9
10
AI 1
AI 2
1
2
3
4
Cable Shield Connections
Shielded twisted pair cable is recommended for the analog channel
connections. If possible, the cable should be grounded at the source
device. If that is not possible, the cable shield must be grounded at the
I/O module. This can be done using an Auxiliary I/O Terminal strip.
If the module is installed on a Terminal-style I/O Carrier, shield
connections can be made on an Auxiliary I/O Terminal that is attached
to the I/O carrier.
If the module is installed on a Compact Terminal-style I/O Carrier, shield
connections can be made on an Auxiliary I/O Terminal that is mounted
near the I/O carrier.
If the module is installed on a Connector-style I/O Carrier, the cable
shield can be connected directly to an Interposing Terminal. A shielded
interposing cable (shielded cables are available separately) must be
used between the Connector-style I/O Carrier and the Interposing
Terminal. An Auxiliary I/O Terminal Strip can also be added to the
Interposing Terminal if additional shield connections are required.
Product Version Information
Revision letters:
KF
Firmware version:
1.25
Firmware
44A750342-G05. Available as a free
upgrades:
download at http://ge-ip.com/support.
Compatibility
Firmware version 1.25 is compatible with all hardware versions of the
ALG630.
This module is compatible with:
PLC CPU Firmware version 1.20 or later.
Ethernet NIU EBI001 all versions.
Genius NIU GBI001 Firmware version 1.10 or later*
Profibus NIU PBI001 Firmware version 1.10 or later*
DeviceNet NIU DBI001 Firmware version 1.10 or later. The
DeviceNet NIU does not support software configuration. Therefore,
analog modules used with a DeviceNet NIU must be
autoconfigured and use only their default configuration settings.
*
For GBI001, NIU version 2.0 or above is required to perform software
configuration. For PBI001, NIU version 2.01 or above is required to
perform software configuration.
17
18
Note: only for thermocouple carrier
AI 5
11
12
AI 3
5
6
IC200ALG630
Product Revision History
Revision
IC200ALG630-KF
IC200ALG630-JF
IC200ALG630-HF
IC200ALG630-HE
IC200ALG630-GE
IC200ALG630-FE
IC200ALG630-GD
IC200ALG630-FD
BXIOAI7-FD
IC200ALG630-ED
BXIOAI7-ED
IC200ALG630-EC
BXIOAI7-EC
IC200ALG630-DC
BXIOAI7-DC
IC200ALG630-DB
BXIOAI7-DB
IC200ALG630-CB
BXIOAI7-CB
IC200ALG630-BB
BXIOAI7-BB
IC200ALG630-AB
BXIOAI7-AB
IC200ALG630-AA
BXIOAI7-AA
Restrictions and Open Issues
Additional faults may be logged when a new configuration
containing parameter changes such as the Alarm High limit or
Alarm Low limit in the hardware configuration of an analog module
is stored followed by a Clear All operation. The additional faults are
logged against the previous configuration. This issue is observed
when Machine Edition is connected to Versamax CPUs
(IC200CPU001, IC200CPU002, IC200CPU005 and IC200CPUE05)
and does not occur with Versamax NIUs (IC200GBI001,
IC200EBI001, IC200PBI001, and IC200DBI001).
When more than 20 faults are sent to a GBC70 within a single
Genius scan, under rare conditions one fault or fault contact may
not be reported by the GBC70. This has been observed when
simultaneous open wire condition occurs in all eight channels of
IC200ALG240 module or if several I/O modules in a GNIU rack
generate multiple faults simultaneously. This issue has only been
observed when the GBC70 was in a rack with an RX7i CPU.
3
Date
Description
EU RoHS compliant module per
directive 2011/65/EU dated 8-June-
Oct 2016
2011. No changes to features,
performance or compatibility.
Label change. No changes to
Jan 2012
features, performance or
compatibility.
Firmware release 1.25. Resolves
component obsolescence issue. No
Apr 2011
change to features, performance or
compatibility.
Labeling change. No changes to
Feb 2011
compatibility, functionality or
performance.
Firmware release 1.24. Resolved
Sept 2010
fault reporting issue in Remote/Local
IO configuration.
Changed manufacturing location. No
Aug 2009
changes to compatibility, functionality
or performance.
Updated Power Supply OK signal
Oct 2008
circuitry.
Firmware release 1.20. Improved I/O
Sept 2007
scanning.
Plastic change on locking
Apr 2005
mechanism
Feb 2005 Configurable for 50Hz line frequency
Changed to V0 plastic for module
Apr 2004
housing.
ATEX approval for Group 2 Category
Jan 2004
3 applications.
Improved reporting of Open Input
Nov 2002
error at higher temperatures.
Firmware version 1.01. Enhanced
June 2001
Open Circuit reporting
July 1999 Initial product release
GFK-1700L
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