Hot air smd rework station, low vibration air pump, suits leaded & lead free solder rohs, quality heating element, rapid heat up, long service life, includes 4 nozzles, smd tweezer set, chip removal tool & spare heating element, individual temperature & a
T 1287 Hot Air SMD Rework Station Operating Instructions • Low vibration air pump • Suits leaded & lead free solder (RoHS) • Quality heating element • Rapid heat up • Long service life • Includes 4 nozzles, SMD tweezer set, chip removal tool & spare heating element •...
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MICRON OVERVIEW Thank you for choosing the T 1287 SMD Rework Station – a great solution for your soldering equipment needs! This tool is specifically designed for soldering and desoldering Surface Mount Devices (SMDs) with temperature controlled hot air. The T 1287 will achieve marked improvements in the quality and efficiency of your rework tasks.
INSIDE THE BOX: ? T 1287 Workstation and air pump handle / pencil. ? Nozzles: 10mm x 10mm; 14mm x 14mm; 4mm dia; 7mm dia. ? Pliers (Tweezer) – 4 different sets, non-magnetic stainless steel.
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MICRON FIGURE 1. FRONT PANEL: Main power switch Hot air pencil input Temperature increase (UP) Temperature decrease (DOWN) Temperature display SET function key Hot air flow increase (UP) Air flow level display Hot air flow decrease (DOWN) INSTALLATION Select the Nozzle that matches the size of the IC. Attach the nozzle when both the heating element and the nozzle are cool and the unit is turned off and unplugged.
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MICRON OPERATION TEMPERATURE SETTING: Press ▲ or ? key on the left side of the front panel to choose the desired temperature. When the temperature reaches the desired setting, the heating indicator light will flash on and off to maintain the set temperature.The temperature will change 1 degree by pressing the keys ▲ or ? at any time.
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NOTE: While there are many advantages of hot air SMD rework, it is also possible to have defects for soldering BGA. It is recommended that all soldering joints be closely inspected. T 1287 SPECIFICATIONS Voltage input: ................240V AC Wattage: ..................1000W Heating element: ..............Nichrome...
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MICRON COMMONLY USED ACRONYMS FOR SOLDERING INTEGRATED CIRCUITS (ICs) SMD: Surface Mounted Device. SOIC: Small Outline Integrated Circuit SOP: Small Outline Package QFP: Quad Flat Package PLCC:Plastic Lead Chip Carrier BGA: Ball Grid Array PCB: Printed Circuit Board SOJ: Small Outline J-leaded IMPORTANT SERVICE NOTE: There are no user serviceable parts inside the unit.
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