Advertisement
Item
A
Elongate the stencil opening 0.05 mm
with the direction reverse the center of
the module and add an isolation
bridge with 0.2 mm width at the X axis
direction.
B&C
0.3 mm width stencil opening and 0.2
mm space to divide the pad with the
angle of 45.
D
Elongate the stencil opening 0.05 mm
with the reverse direction for the
adjacent pad, but will not reduce the
air gap, and add an isolation bridge
with 0.2 mm width at the X axis
direction.
E
Elongate the stencil opening 0.05 mm
with the X+ direction and add an
isolation bridge with 0.2 mm width at
the axis direction.
Reflow Profile
For the soldering temperature of the LGA module, see the following figure:
Description
7
Figure
Advertisement
