HP 11848A Service Manual page 55

Phase noise interface
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Model 11848 A
Replaceable Parts
Table 3. Reference Designations
REFERENCE DESIGNATIONS
A
assembly
AT
attenuator; isolator;
termination
B
, . . . fan; motor
BT
battery
C
capacitor
CP
coupler
CR
diode; diode
thyristor; varactor
DC
directional coupler
DL
delay line
OS
annunciator;
signaling device
(audible or visual);
lamp; LED
E
miscellaneous
electrical part
F
fuse
FL
filter
H
hardware
HY
circulator
J
electrical connector
(stationary portion);
jack
K
relay
L
coil; inductor
M
meter
MP
miscellaneous
mechanical part
P
electrical connector
(movable portion);
plug
Q
transistor; SCR;
triode thyristor; FET
R
resistor
RT
thermistor
S
switch
T
transformer
TB
terminal board
TC
thermocouple
TP
test point
U
integrated circuit;
microcircuit
V
electron tube
VR
voltage regulator;
breakdown diode
W
cable; transmission
path; wire
X
socket
Y
crystal unit (piezo­
electric or quartz)
Z
tuned cavity; tuned
circuit
Table 4. Abbreviations (1 of 2)
ABBREVIATIONS
A
ac
alternating current
ACCESS
accessory
ADJ
adjustment
A/D
analog-to-digital
AF
audio frequency
AFC
automatic
frequency control
AGC
automatic gain
control
AL
aluminum
ALC
automatic level
control
AM
amplitude modulation
AMPL
amplifier
APC
automatic phase
control
ASSY
assembly
AUX
auxiliary
avg
average
AWG
American wire
gauge
BAL
balance
BCD
binary coded
decimal
BD
board
BECU
beryllium copper
BFO
beat frequency
oscillator
BH
binder head
BKDN
breakdown
BP
bandpass
BPF
bandpass filter
BRS
brass
BWO
backware-wave
oscillator
CAL
calibrate
ccw
counter-clockwise
CER
ceramic
CHAN
channel
cm
centimeter
CMO
cabinet mount only
COAX
COEF
coefficient
COM
common
COMP
composition
COMPL
complete
CONN
connector
CP
cadmium plate
CRT
cathode-ray tube
CTL
complementary
transistor logic
CW
continuous wave
cw
clockwise
cm . .
centimeter
D/A
digital-to-analog
dB
decibel
dBm
decibel referred
to1 mW
dc
direct current
deg
degree (temperature
interval or difference)
...°
degree (plane
angle)
°C
degree Celsius
(centigrade)
°F
degree Fahrenheit
°K
degree Kelvin
DEPC
deposited carbon
DET
detector
diam
diameter
DIA
diameter (used in
parts list)
DIFF AMPL
differential
amplifier
div
division
DPDT
double-pole,
double-throw
OR
drive
DSB
double sideband
DTL
diode transistor
logic
DVM
digital voltmeter
ECL
emitter coupled
logic
EMF
electromotive force
EDP
electronic data
processing
ELECT
electrolytic
ENCAP
encapsulated
EXT
external
F
farad
FET
field-effect transistor
F/F
flip-flop
FH
flat head
FIL H
fillister head
FM —
frequency modulation
FP
front panel
FREQ
frequency
FXD
fixed
g
gram
GE
germanium
GHz
gigahertz
GL
glass
GRD
grounded)
H
henry
h
hour
HET
heterodyne
HEX
hexagonal
HD
head
HDW
hardware
HF
high frequency
HG
mercury
HI
high
HP
Hewlett-Packard
HPF
high pass filter
HR
hour (used in
parts list)
HV
high voltage
Hz
Hertz
1C
integrated circuit
ID
inside diameter
IF
intermediate
frequency
1MPG
impregnated
In
incandescent
INCL
includes)
INP
input
INS
insulation
INT
internal
kg
kilogram
kHz
kilohertz
k
kilohm
kV
kilovolt
lb
pound
LC
inductance-
capacitance
LED
light-emitting diode
LF
low frequency
LG
long
LH
left hand
LIM
limit
UN
linear taper (used
in parts list)
LKWASH
lock washer
LO
low; local oscillator
LOG
logarithmic taper
(used in parts list)
log
logarithmic)
LPF
tow
pass filter
LV
low voltage
m
meter (distance)
mA
milliampere
MAX
maximum
M
megohm
MEG
meg (10
6
) (used
in parts list)
MET FLM
metal film
MET OX
metallic oxide
MF
medium frequency;
microfarad (used in
parts list)
MFR
manufacturer
mg
milligram
MHz
megahertz
mH
millihenry
mho
mho
min
minute (time)
minute (plane angle)
MINAT
miniature
NOTE
All abbreviations in the parts list will be in upper-case.
25

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