VIA Technologies COMe-8X91 Quick Manual

Com express module; carrier board reference
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COMe-8X91
COM Express Module
and
COMEDB3
Carrier Board Reference
Quick Guide

Key Features:

VIA Eden™ X2 processor
Onboard DDR3 SODIMM memory
Integrated VIA C-9 HD DX9 2D/3D graphics processor
Support PCIe x1 and Mini PCIe sockets
Display interface in 18/24-bit single-channel LVDS panel and
one DisplayPort
Support USB 2.0 and GigaLAN

COMEDB3 Carrier Board Specifications

COM Express Module Type
▪ Support Mini Form Factor Type 10
Audio
▪ VIA VT2021 High Definition Audio Codec
Super I/O
▪ VIA VT1211 LPC Super IO
BIOS
▪ AMI BIOS
▪ 4/8M bit LPC Flash BIOS, PLCC 32 pin or SPI BIOS

Onboard Connectors, Ports and Sockets

▪ 1 x LVDS connector
▪ 1 x Inverter connector
▪ 1 x CD-In with housing connector
▪ 1 x SPDIF with housing connector
▪ 1 x SD card socket, shared with DIO1 pin header
▪ 1 x ATX power connector
▪ 1 x AUX power connector
▪ 2 x SATA connectors
▪ 1 x CPU fan connector
▪ 1 x System fan connector
▪ 1 x PCIe x1 slot
▪ 2 x MiniPCIe sockets

Rear I/O Connectors and Ports

▪ 4 x USB 2.0 ports
▪ 1 x DisplayPort
▪ 1 x RJ-45 LAN port (Gigabit Ethernet)
▪ 6 x Audio jacks (support multi-channel audio outputs)

COMe-8X91 Module Specifications

Core
Processor
▪ VIA Eden X2 800 MHz NanoBGA2 CPU

Chipset

▪ VIA VX900 all-in one system processor
System Memory
▪ Onboard 1GB DDR3/DDR3L 1066
BIOS
▪ AMI BIOS
▪ 4/8Mbit SPI flash memory
Operating System
▪ Microsoft Windows 7/WES7, XP/XPe and CE 6.0
▪ Linux
Hardware Monitoring
▪ CPU temperature reading
▪ CPU fan speed reading
▪ System voltage monitoring
WatchDog Timer
▪ Software Programmable
Expansion Bus
▪ 3 x PCIe Gen2 x1
Graphics and Video
▪ Integrated VIA C-9 HD DX9 2D/3D graphics
VGA
processor and unified video decoding accelerator
LVDS Interface
▪ 1 x LVDS channel supports single-channel 8-bit or
24-bit LVDS panel
HDMI
®
Interface
▪ 1 x HDMI
®
port (optional)
▪ 1 x DisplayPort (without HDCP support)
DisplayPort Interface
Ethernet
Chipset
▪ VIA VT6130 Gigabit Ethernet controller

Onboard Pin Headers

▪ 1 x FIR pin header
▪ 1 x Serial pin header with 2 sets of TX and RX signals
▪ 2 x COM pin headers (support 2 COM ports with +5V/+12V
power select option RI pin)
▪ 1 x LPT pin header
▪ 1 x SPI pin header
▪ 1 x LPC pin header
▪ 1 x DIO1 pin header, shared with SDIO connector
▪ 1 x DIO2 pin header (from VIA VT1211)
▪ 1 x SMBus pin header
▪ 1 x I²C pin header
▪ 2 x USB 2.0 pin headers for four USB 2.0 ports
▪ 1 x Panel Power Select pin header
▪ 1 x Front LAN LED pin header
▪ 1 x Front Audio pin header
▪ 1 x Front Panel pin header for HDD LED, Power LED, Switch
and Speaker
Onboard Jumper
▪ 1 x Clear CMOS jumper
▪ 1 x Inverter Voltage Select jumper
▪ 1 x Panel Power Select jumper
▪ 1 x COM Voltage Select jumper
▪ 2 x BIOS Type Select jumpers (for select LPC/SPI BIOS)
▪ 2 x BIOS Select jumper (for select Module/Carrier board BIOS)
▪ 6 x USB Select jumper (for select USB header/MiniPCIe)
Switch
▪ 1 x Power button switch
▪ 1 x Reset switch
Form Factor and Dimension
▪ Mini-ITX
▪ 6 layers
▪ 17 cm x 17 cm
Input / Output
Audio
▪ 1 x HD audio digital interface
LAN
▪ 1 x LAN port
USB
▪ 8 x USB 2.0 ports
▪ 2 x SATA 3.0 Gbps ports
SATA
Serial
▪ 2 x Serial ports with TX and RX signals

Expansion Buses

▪ 1 x System Management Bus (SMBus) interface
▪ 1 x I²C bus (default for Eup LAN control)
▪ 1 x SDIO interface (by default)
▪ 1 x GPIO interface with 4 INs and 4 OUTs (shared with
SDIO)
▪ 1 x LPC bus interface
▪ 1 x SPI
▪ Support Express Card, speaker out, reset function,
thermal protection, suspend/wake signals, power
button, power good and fan control signals
Mechanical and Environment
COM Express Compliance
▪ COM Express™ Type 10, Mini Module
Dimension
▪ 55 mm x 84 mm
▪ -40°C to 70°C
Storage Temperature
Operating Temperature
▪ 0°C up to 50°C
Operating Humidity
▪ 0% to 95% (relative humidity; non-condensing)
Operating Temperature
▪ 0°C up to 50°C
Storage Temperature
▪ -40°C up to 70°C
Operating and Storage Humidity
▪ 95% relative humidity
Operating System
▪ Microsoft Windows 7, XP, XPe, WinCE 6.0, WES7
▪ Linux

COMe-8X91 Module Layout

Top View
Bottom View

COMEDB3 Carrier Board Layout

Onboard Ports and Connectors
Rear I/O Ports

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Summary of Contents for VIA Technologies COMe-8X91

  • Page 1 COMe-8X91 Module Specifications COMe-8X91 Module Layout Input / Output Audio ▪ 1 x HD audio digital interface Core Top View ▪ 1 x LAN port Processor ▪ VIA Eden X2 800 MHz NanoBGA2 CPU ▪ 8 x USB 2.0 ports Chipset ▪...
  • Page 2 Installing heatsink with fan Installing COMe-8X91 module Secure the COMe-8X91 module with the heatsink by screwing and Align the connector of the COMe-8X91 module into the connector slot on on the COMEDB3 carrier board tightening the four screws (10mm screws).

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Comedb3

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