Sony AN-LP1 Service Manual page 7

AN-LP1
4-1. PRINTED WIRING BOARDS
• Semiconductor
Location
Ref. No. Location
D1 H-2
D2 H-2
D5 G-3
D6 G-3
D7 G-3
D8 G-3
D9 G-1
D10 G-1
D11 G-1
D12 G-2
D13 G-2
D14 G-1
D101 F-8
D102 E-8
D103 B-10
D104 D-9
D105 D-9
D106 D-9
D107 D-9
D108 D-9
IC101 B-10
Q1 G-3
Q2 G-2
Q101 E-8
Q102 E-8
Q103 B-9
Q104 A-9
Q105 C-10
Q106 C-9
Q107 B-8
Q108 C-8
Q109 C-8
Q110 C-8
Q111 C-9
Q112 C-9
Q113 C-10
Q114 C-10
Q115 C-9
Q116 B-9
Q117 C-9
Q118 C-8
Q119 D-8
Q120 C-9
Q121 C-10
Q122 C-10
Q123 D-8
SECTION 4
DIAGRAMS
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Note on Printed Wiring Board:
•
: parts extracted from the component side.
•
: parts extracted from the conductor side.
•
: indicates side identified with part number.
•
r
: Through hole.
•
¢
: internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
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