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WCS-880
4-5.
PRINTED WIRING BOARDS – RX Section –
1
2
J51
J52
v
RX BASE BOARD
MIX MIC
(COMPONENT SIDE)
A
C158
R155
B
C
E
CF2
R152
B
L151
L52
L57
L58
+
R82
C154
C77
C67 +
C
RV52
LF51
D
C79
R79
E
• Semiconductor Location
Ref. No.
Location
Ref. No.
Location
F
D1
D-7 (*1)
IC51
C-8
D1
F-8 (*2)
IC52
D-9
D51
C-7
IC101
B-6
D53
B-9
D54
D-10
Q1
F-7
D55
C-9
Q2
F-7
D101
B-6
Q3
F-3
D102
A-5
Q101
A-6
D151
A-10
Q151
B-10
(SHIELD CASE)
D152
C-9
Q152
B-9
D153
A-9
Q153
A-1
D154
C-10
Q154
C-10
Q155
A-9
IC1
B-8
*1: Mounted on the RX BASE board.
*2: Mounted on the FE board.
3
4
SW1
RF
SW101
CHANNEL
POWER
1
2
3
L2
OFF
ON
SW1
C6
SW101
+
C52
CT1
CT2
CT3
C51
C13 +
C73
RV51
C7
+
C58
+
+
C71
FE BOARD
(COMPONENT SIDE)
L9
C27
C26
R10
C25
C15
R8
C24
B
PC7
Q3
F1
C
(PRINT COIL)
E
C10
5
6
D102
RX BASE BOARD
BATT
Q101
B C E
D102
2
C105
IC101
R103
L101
R104
1
3
D101
K
A
K
A
A/K
D51
A
K
C72
C101
A/K
LF101
FS1
D1
L4
A
11
(11)
1-681-325-
ANT2
LEAD
ANTENNA
FE BOARD
(CONDUCTOR SIDE)
C51
C3
R5
G1
S
G2
D
C2
C4
Q1
R3
C52
C52
C41
11
(11)
(SHIELD CASE)
Note on Printed Wiring Boards:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: Through hole.
z
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
14
14
7
8
9
(CONDUCTOR SIDE)
D153
C22
C1
C5
C11
C2
C4
C12
R3
R9
R1
C15
14
1
CF1
IC1
15
28
TP51
L3
D55
TP54
+
1
8
C57
R57
IC51
C56
C61
C60
R53
R62
4
5
4
1
IC52
5
8
C65
R67
R69
K
C66
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION R6)
1PC. 1.5V
C53
C30
D1
A K
C5
C31
E
C
B
E
Q2
X1
11
(11)
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side) the parts face are indicated.
10
K
A
C156
E
B
D151
C
A/K
R153
Q155
C80
K
A
D53
C152
B C E
R73
Q151
C74
LF54
D154
A
D152
K
A
Q154
K
R71
C69
R68
C68
C78
LF52
TP102
R72
A
D54
K
C70
11
(11)
1-681-325-
P1
(REC OUT)
Parts on the pattern face side seen from
the pattern face are indicated.
Parts on the parts face side seen from
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