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Summary of Contents for Blu DASH 4.0
- Page 1 BLU DASH 4.0 SERVICE MANUAL...
- Page 2 ATTENTION Boards, which contain Electrostatic Sensitive Device(ESD), art indicated. Following information is ESD handling: Service personnel should ground themselves by using a wrist strap when exchange system boards. When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
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Page 3: Table Of Contents
Contents CONTENTS ..................................3 1. INTRODUCTION ................................4 1.1 O ................................... 4 BJECTIVE 1.2 G ............................4 ENERAL AFETY NOTICE 1.3 U ................................ 4 NSTRUCTION 2. TECHNOLOGY SUMMARIZE ............................5 2.1 D ......................5 ESCRIPTION OF MAIN BOARD COMPONENT MAP 2.2 MT6572 ............................ -
Page 4: Introduction
1. Introduction 1.1 Objective The manual is not a general publication but only edited for experienced technician. The main purpose is to provide basic foundation for the electrical & mechanical maintenance. 1.2 General Safety notice 1) Only experienced technician can repair with this guide during product is power on. Any maintenance by other non-technicians will cause serious damage of the handset. -
Page 5: Technology Summarize
2. Technology summarize 2.1 Description of main board component map 2013-10-16... -
Page 6: Mt6572 Circuit System
2.2 MT6572 circuit system MT6572 functional block diagram as following: MT6572 functional system is made of three parts as below: Digital baseband function: Memory, LCM, GPIO interface, Keypad interface etc. Analog baseband function: AUDIO（including MIC, Receiver, Speaker）,Camera, Video, Ambient light and Proximity sensor, Power management, RTC, Charge control, etc. RF function: RF transceiver, GSM/WCDMA/TD communication system, etc. -
Page 7: Base Band Circuit
2.3 Base band circuit MT6572 baseband System Architecture as following: Platform Features: ◆ General: 1） Smartphone,3 MCU subsystems architecture 2） eMMC boot support 3） Supports LPDDR-1/LPDDR-2/LPDDR-3/PD-DDR3 ◆ AP MCU subsystem 1) Dual-core ARM Cortex-A7 MP Core operating at 1.2GHz 2) NEON multimedia processing engine with SIMDv2/VFPv4 ISA support 3) 32KB L1 I-cache and 32KB L1 D-cache 4) 256KB unified L2 cache 5) DVFS technology with adaptive operating voltage from 1.05V to 1.26V... - Page 8 ◆ External memory interface. 1) Supports LPDDR1/2/3, PC-DDR3 up to 2GB 2) 32-bit data bus width 3) Memory clock up to 333MHz 4) Supports self-refresh/partial self-refresh mode 5) Low-power operation 6) GPIOs 7) 2 sets of memory card controllers supporting SD/SDHC/MS/MSPRO/MMC and SDIO2.0/3.0 protocols ◆...
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Page 9: Trouble Shooting
3. Trouble Shooting 3.1 Fail to startup/power on The following conditions may cause boot fail: battery low, battery connector is damaged or bad welding, components bad weld/short-circuit or damaged First, change a fully charged battery test, still startup fail, check battery connector ok or not, if connector damaged change a new one;... -
Page 10: Fail To Charge
3.2 Fail to charge Check charging circuit related component, check below information in sequence: First, checks whether boot normal use the battery, if not check battery connector solder ok or not; Second, check USB connector on board solder ok or not; Third, check T2020 whether reverse, check C2020 resistance is very big or not, check B2020、B2021 solder ok or not;... -
Page 11: Fail To Display
3.3 Fail to display The screen dose not shines or shows white: First, use DC power supply to start-up, check the board whether power on normal, ensure main board can power on normal Second, check LCD module, change a new module, check whether can display normal, Third, check L1850, D1850, U1850 solder ok or not Fourth, use oscilloscope to test LCD_BACKLIGHT_EN, check it whether high, if not, check U1200 solder ok or not, re-hot U1200 or check a new one. -
Page 12: Fail To Call
3.4 Fail to call When call with somebody, we cannot hear what he says or he cannot hear what we say: This fail may cause by receiver or microphone fail, should to check mic or receiver problem ，if ok, it may RF fail, if fail, we need to make sure is receiver or microphone fail. Call 112, if cannot hear voice, it may receiver problem, check microphone related circuit ,check B1640, B1641 , C1640, C1641, C1642, T1640, T1641 solder ok or not, if all ok, change a new microphone, also fail, check CPU, re-hot U1200 or change a new one. -
Page 13: Speaker No Sound
3.5 Speaker no sound First, check speaker ok or not, change a new one; Second, check B1601, B1600, T1912, T1913 solder ok or not; Third, check U1420, re-hot or change a new one. No sound Is speaker OK? Replace Speaker Are B1601, B1600 ADD B1600, B1601 NC or not? -
Page 14: Earphone Fail
3.6 Earphone fail No sound in earphone Is earphone Replace connector OK? earphone Is J1620 Re-solder J1620 soldering well? Re-solder uncorrected Are All TVS right direction? Re-solder Related R, uncorrected R C C right? Hot or change U1420 2013-10-16... -
Page 15: Vibrator Fail
3.7 Vibrator fail Motor doesn’t work Supply 3.3V for motor, Change a test motor can work or new Motor Check VIBR_PMU ok or Change uncorrected not, Check SUB PCB component or sub reverses or not Hot U1420 or Change a new one 2013-10-16... -
Page 16: Side Key Fail
3.8 Side key fail Side key no function Re-solder or Is key switch soldering change new R1469, R1435 Solder 1K resistance R1497, NC or not? Check U1200 Re-sold or change U1200 2013-10-16... -
Page 17: Failure To Identify Sim Card
3.9 Failure to identify SIM card SIM is not identified Touch Pin is Clean SIM socket clean? SIM is damaged. Change a new Replace it SIM to try Change a new one. Is SIM socket good? Change U1420 Check if VSIM1/ VSIM2 are OK? Check each signal Hot U1420 or change... -
Page 18: Camera Fail
3.11 Camera fail First, change a new camera module, check camera connector ok or not; Second, check AVDD, DOVDD, if fail check U1420 Third, use oscilloscope to test I2C, CAM_RST, CAM_MCLK, CAM_PCLK, MIPI_DATA, and MIPI_CLK. If signals abnormal check U1200, re-hot or change a new one. Camera fail Is camera connector Re-solder or... -
Page 19: Failure To Read T-Flash Card
3.12 Failure to read T-flash card First, change another T flash card, check whether T flash card bad or not Second, check card connector solder ok or not, if fail, re-solder or change a new one Third, check TVS reserved or not, check VDD whether normal Fourth, test related signals, such as MCCK, MCCM0, MCDA0, MCDA1…MCDA3, if abnormal, check U1200, re-hot or change a new one. -
Page 20: Bga Related Gnd Pad
4. BGA related GND pad Yellow------GND pad 4.1 CPU and memory pin map 2013-10-16... -
Page 21: Pmu Pin Map
4.2 PMU pin map 2013-10-16...
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