Advertisement
<CMOS CIRCUIT BOARD>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
<02>CMOS
The Circuit board is only for reference. Avoid replacing individual parts.
Replace the entire unit only. When CMOS BOARD ASSEMBLY needs replacement,
LYB20083-001A
replace the CMOS FRM ASSEMBLY in whole because it cannot be replaced alone.
FOIL SIDE(B)
IC451
<SENSOR CIRCUIT BOARD>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
<03>SENSOR
LYB10205-001B
FOIL SIDE(B)
COMPONENT SIDE(A)
COMPONENT SIDE(A)
CN451
R451
R452
C463
C472
C461
C465
<REAR CIRCUIT BOARD>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
<05>REAR
CAUTION :
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH SAME TYPE AND RATED FUSE(S).
!
LYB10204-001B
ATTENTION :
POUR UNE PROTECTION PERMANENTE CONTRE LES RISQUE D'INCENDE,
REMPLACER LES FUSIBLES PAR UNAAUTRE DE MEME TYPE ET DE MEME TENSION.
FOIL SIDE(B)
D615
F601
F601
D605
C609
C611
D609
R608
D610
R604
REAR
REAR
R610
R605
R607
D606
PWB
PWB
D607
LYB10204
LYB10204
-001B
-001B
J601
<MONITOR CIRCUIT BOARD>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
<06>MONITOR
LYB10205-001B
FOIL SIDE(B)
COMPONENT SIDE(A)
J602
J611
J602
D621
D613
BT601
C613
R632
C634
C632
R642
L631
R633
R640
UL MARK
L603
PbF
PbF
0
0
5
5
LYA10204
LYA10204
-01B
-01B
L601
02B
02B
03B
03B
COMPONENT SIDE(A)
C301
R7727
C7705
R7312
R7709
R7701
R7311
R7710
Q7701
Q7303
R7719
L7302
R7315
Q7302
R7305
R7310
R7309
R7308
C7309
R7307
C7308
R7306
C7307
CN703
D701
IC701
18
Advertisement
