LG KE590 Service Manual page 25

3. Circuit Description
The OMAP3.4 platform is the computing core of the device. The other OMAPV1030 components are
organized as follows:
- The internal memory subsystem is made of a single-port 256K-bit shared internal SRAM.
- The security subsystem is a set of several components, including dedicated a secure mode to run
secure applications.
- A master-slave USB module provides an external interface supporting high data transfer rates
between the OMAPV1030 and external application
- The memory interfaces provide access to external memories. There are two types of memory
controllers:
- SDRAM controller supporting SDR and DDR modes
- General-purpose controller supporting asynchronous and synchronous
- The system components are used to manage system interactions such as interrupts, clock control,
reset control, and idle management.
- The peripheral subsystem refers to all the peripherals accessible by the MPU and/or the DSP. They
are all OCP- or TIPB-compliant and are connected to the OMAP3.4 platform through the traffic
controller or the TIPB busses.
3.3.3 RF Interface (Digital RF Interface)
The OMAPV1030 radio interface module of OMAPV1030 device is an interface that carries the
following information:
- Transmit symbols from DBB to RF IC
- Receive samples from RF IC to DBB
- Bidirectional information control
- Real-time and activation signals from DBB to RF IC
- System clock
The OMAPV1030 radio interface module of OMAPV1030 device supports two types of radio
interfaces.
They differ mainly in the type of data interface:
- The first interface is based on a standard six-wire scheme: three wires for transmit and three for
receive.
- The second one is based on a two-wire bidirectional scheme: one wire for data in/out, and one for
control receive/transmit.
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