1. General Description 1. General Description The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.
2. Performance 2.4 HW Feature Item Feature Comment Form Factor Slide 1) Capacity Battery Standard : Li-Polymer, 800mAh 2) Packing Type : Hard Pack Standard : Size 97.0 X 47.0 X 14.9 mm Weight With Battery Volume 75cc Staggered 10Layers , 0.8t Stand by time 250 hrs @ Paging Period 5...
Page 7
2. Performance Item Feature Comment Status Indicator None Alphanumeric Key : 12 Function Key: Function Key : 9 4 Key Navigation, OK, F1, Side Key : 4 F2, CLR, SND Keypad Total No of Keys :25 Side Key : Volume up/down, CAM, PWR/END Main : Internal Fixed Type Blue tooth : Internal Fixed Type...
Page 8
2. Performance Item Feature Comment RSSI 0 ~ 5 Levels Battery Charging 0 ~ 4 Levels Key Volume 0 ~ 5 Level Audio Volume 1 ~ 5 Level Time / Date Display NITZ Multi-Language English / French Phone Book / Message / Camera Quick Access Mode / My Stuff / Favorite PC Sync...
Page 9
2. Performance Item Feature Comment Call Duration SMS (EMS) 100 (10) EMS : Release4 (Except Text align) SMS Over GPRS EMS Melody / Picture Send / Receive / Save MMS MPEG4 / Send / Receive / Save Long Message MAX 925 Characters Cell Broadcast Download Over the WAP...
Page 10
2. Performance Item Feature Comment IrDa V2.0 HSP, HFP, OPP, Blue tooth FTP(server), BPP, A2DP, AVRCP GPRS Class 10 EDGE Class 10 Hold / Retrieve Conference Call Max. 6 DTMF Memo pad Sync ML Email - 11 -...
Page 13
2. Performance Item Description Specification DCS1800/PCS1900 Offset from Carrier (kHz). Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status Bit Error Ratio BER (Class II) < 2.439% @-102dBm Rx Level Report accuracy 3 dB 8 3 dB Frequency (Hz) Max.(dB)
Page 14
2. Performance Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side Tone Distortion Three stage distortion < 10% <Change> System frequency 2.5ppm (13 MHz) tolerance <Change>32.768KHz tolerance...
Page 15
2. Performance Item Description Specification Antenna Bar Number Power -85 dBm ~ -90 dBm ~ -86 dBm Antenna Display -95 dBm ~ -91 dBm -100 dBm ~ -96 dBm -105 dBm ~ -101 dBm ~ -105 dBm Barttey Bar Voltage 0(included Blinking) 3.65V~3.35V 3.71V ~ 3.66V...
3. Circuit Description 3. Circuit Description 3.1 General Description The RF part consists of a transmitter, a receiver, a synthesizer, a voltage supply and a DCXO part. The main RF Chipset B6PLD is a highly integrated RF tranceiver IC FOR Digital Interface of GSM 850, GSM900, DCS1800 and PCS1900 quad-band cellualr systems.
Page 17
3. Circuit Description 3.2.1.1 Baseband PGA/Low pass Filter Specifications The baseband programmable amplifier comprises one stage with variable gain followed by a fixed gain amplifier. The overall gain control range is 36dB with 6dB Steps. The filtering is provided by a single R/C low pass filter with an on-chip capacitor followed by on-chip Chebychev low pass filters.
3. Circuit Description 3.2.2 Transmitter part The B6PLD transmitter is capable of both GMSK and 8-PSK modulation, to support for conventional GSM and EDGE. B6PLD integrates all loop filters to configure both PM loop and AM loop. See block diagram below. Fig.
Page 19
3. Circuit Description 3.2.3 RF Systhesiser 3.2.4 Front End Module Specification 3.2.4.1 Block Diagram and Internal Matching Condition HWXR693 - 20 -...
Page 20
3. Circuit Description 3.2.4.2 Logic Table for Selction Select Mode Vc(GSM850/EGSM) Vc(DCS/PCS) GSM850_Rx EGSM_Rx GSM850/EGSM_Tx High DCS_Rx PCS_Rx DCS/PCS_Tx High <Table> Band SW Logic Table 3.2.5 Power Amplifier Module for Quad-band GSM/GPRS/EDGE 3.2.5.1 PAM Specification -. Quad band GSM, GPRS & Ploar Loop EDGE Amplifier -.
Page 21
3. Circuit Description 3.2.6 Digital Core 3.2.6.1 Digital Interface Block Diagram Fig. 1-1 Digital Interface Block Digram - 22 -...
Page 22
3. Circuit Description 3.2.6.2 Control system and digital interface The B6PLD is a RF transceiver IC for GSM850, GSM900, DCS1800 and PCS1900 quad band cellular system, and incorporates EDGE transceiver capability. The B6PLD has a digital interface connection to the baseband processor. This interface complies with the digital interface specification DigRF standard v112.
3. Circuit Description 3.3 Digital Baseband <Fig.6> OMAPV1030 Block Diagram 3.3.1 General description The OMAPV1030 E-GPRS multimedia device belongs to the Texas Instruments OMAP-Vox_ processors family. It combines both a modem engine and an application engine. Memory and CPU resources are shared between modem and application processing. The OMAPV1030 chip is based on the OMAP3.4 architecture and integrates two processor subsystems: - An MPU subsystem based on an ARM926EJ-S...
3. Circuit Description 3.3.2 Block Description The OMAPV1030 E-GPRS multimedia device is based on an OMAP3.4 platform that integrates: - The MPU subsystem - The DSP subsystem - A system DMA - A traffic controller providing: - External memory interfaces with: - A slow interface (EMIFS) to ROM, SRAM, FLASH memories - A fast interface (EMIFF) to SDRAM memories - Layer 3 (L3) interconnect made of two OCP target ports (OCP-T1 and OCP-T2) and one OCP...
Page 25
3. Circuit Description The OMAP3.4 platform is the computing core of the device. The other OMAPV1030 components are organized as follows: - The internal memory subsystem is made of a single-port 256K-bit shared internal SRAM. - The security subsystem is a set of several components, including dedicated a secure mode to run secure applications.
Page 26
3. Circuit Description <Fig.8> OMAPV1030 Radio Interface This implementation is based on the following: - The time processing unit (TPU) module is a real-time sequencer dedicated to monitoring GSM baseband processing. - The serial port of the time serial port (TSP) module controls both interfaces. - The real-time TSPACT signal of the TSP module - The McBSP digital RF module is used for the six-wire data interface.
3. Circuit Description 3.3.4 SIM interface SIM interface scheme is shown in below. SIM_IO, SIM_CLK, SIM_RST, SIM_PWRCTRL ports are used to communicate DBB via ABB with plugged sim card and the LDO (VRSIM) in ABB enables operate 1.8V to 2.5V to search SIM card <Fig.9>...
3. Circuit Description 3.3.5 UART Interface ME550c has Three UART Drivers as follow : - UART1 : USB - UART2 : ETM, Calibration - UART3 : AT command, Fax_modem, Bluetooth UART1(USB) Resource Name Description USB_DP Data USB_DM Data USB_PWR POWER USB_POWER VBUS VBUS...
Page 29
3. Circuit Description 3.3.6 GPIO Map In total 22 allowable resources, ME550c is using 9 resources except 3 resources dedicated to SIM and Memory. ME550c GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table 3. Resource Inactive Active...
3. Circuit Description 3.3.7 Camera interface ME550c have a 8-bit parallel camera interface(NOBT Mode) . This is a general parallel interface with vertical and horizontal synchronization signals.(See. Figure 12) The maximum clock is 96 MHz for 8-bit data data, or 48 MHz for 10- or 12-bit data. <Fig.10>...
3. Circuit Description 3.4 Analog Baseband 3.4.1 General Description The TRITON chip is the analog and power management part of the Texas Instruments next generation wireless terminal. These GSM/GPRS/E-GPRS, 3G W-CDMA, CDMA2000 platforms are composed of a digital baseband processor, a RF chip, an application processor OMAP and of different peripheral devices like a LCD panel, a Multi-Media Card, a Bluetooth modem, a GPS modem.
Page 32
3. Circuit Description 3.4.2 Audio Signal Processing & Interface The Audio module consists of a Voice Codec dedicated to mobile telephone terminal application and a Stereo path. - The Voice Codec circuit processes analog audio components in the uplink path and transmits the converted data to the DSP speech coder through the voice serial port (VSP).
Page 34
3. Circuit Description 3.4.4 Monitoring ADC The monitoring ADC (MADC) consists of a 10-bit analog-to-digital converter (ADC) combined with an 11- input analog multiplexer. The ADC implementation consists of a successive approximation conversion. Five of the eleven inputs are available externally (ADIN1..5), and the remaining six inputs are dedicated to die temperature measurement, main battery voltage, backup battery voltage, charger voltage, charger current monitoring and USB Vbus voltage.
3. Circuit Description 3.4.6 Memories - 512Mbit NAND Flash + 512Mbit DDR RAM 3.4.7 LCD Module The NM200CND module is a Color Active Matrix Liquid Crystal Display with an Light Emission Diode (LED) Back Light system. The matrix employs a-Si Thin Film Transistor as a active element. It is a transmissive type display operating in the normally white mode.
4. TROUBLE SHOOTING 4.3 Bluetooth Trouble Shooting start In Engineering mode(2945#*#) Set BT Test mode ON Set RF test mode and then BT ON Check BT Antenna Status Replace BT Antenna (Refer to figure 1) Check 1.8V from ABB Check ABB(U103) (Refer to figure 2) Check DCXO(X401) or Check 26MHz...
4. TROUBLE SHOOTING 4.4 Baseband Part Troubleshooting 4.4.1 Power On Trouble 4.4.1.1 Power-On Trouble Troubleshooting Power-On Sequence - Connecting Battery - Power-On Key Detection - Pwon signal goes to ABB and then ABB resets DBB by ONNOFF signal - ONNOFF turns low(0v) to High (2.8V) and it resets DBB (Neptune) - All LDOs (internal LDOs of ABB and external LDOs) are turned on Check Points - Battery Voltage...
Page 61
4. TROUBLE SHOOTING 4.4.2 Check Point C135 C139 C136 C132 C130 C138 C131 C128 C134 C133 C137 <Fig. 2> Triton Power Supplies C128 : VRDBB =>1.4V/1.08V C130 : VREXTL =>1.8V or 0V , Not used C131 : VREXTH => 2.8V, TEMP_SENSE C132 : VRMMC =>...
Page 63
4. TROUBLE SHOOTING START Check is the CN202(main key) Re-solder the CN203(main key) Is well-soldered? R210(main key) Re-solder Is well-soldered? R210(main key) Check is the connection of Connect the Main key, Main, Main FPCB Main key, Main, Main FPCB ? Check the Main FPCB Replace Main FPCB Main FPCB is OK?
4. TROUBLE SHOOTING 4.4.3 Charging Trouble Shooting - Charging method : CC-CV - Charger Detection Voltage : About 4.0V - Charging Time : About 2H under - Charging Current : About 550mA - Cut-off Current : 80mA - Low Battery Alarm z Talk mode : 3.62V z Standby mode : 3.50V - Switch-Off Voltage : 3.35...
Page 65
4. TROUBLE SHOOTING 4.4.4 Charging Current - Charging Procedure z Connecting TA & Charger Detection z Control the charging Current by CHARGER IC z Charging Current flow into the Battery - Check Points z Connection of TA z Charger IC z Battery - Trouble Shooting Setup z Connect Battery &...
Page 66
4. TROUBLE SHOOTING START Re-solder the CN301 I/O Connector (CN301,Main) (Pin 12,13) Is well-soldered? Check the FB301,FB302(Main), Re-solder the FB301, FB302(Main) Is it OK? Voltage at pin 6,7 of U302(Main) Replace the U302(Main) =4.8? The IC out of order. Voltage at pin 5 of U102(Main) Replace the IC Is LOW in case charging ? The Battery may have Problem.
Page 71
4. TROUBLE SHOOTING START Refer to Power is supplied to Power On Trouble the board? First of all, push a key pad then check 1.8/2.8V check Points during a Key pad LED ON. Connection between Reconnect FPCB FPCB and boards is OK? Re-solder the Connectors are soldered well? Connector...
4. TROUBLE SHOOTING 4.6 Camera Trouble Shooting z Camera signals from Main Board - CAM_RST, CAM_MCLK, CAM_PCLK, CAM_VS, CAM_HS, CAM_D(0) ~ D(7) C441 C443 C440 C442 C439 C445 C438 C444 z Camera signals from Main Board - Check the power supply - Check the soldering of Components - Check the CAMERA signals z Trouble Shooting Setup...
Page 73
4. TROUBLE SHOOTING 4.6.1 Check Point #1 - Connection of Camera Module Camera module CAM_RS T CAM_D(4 ) 2.8V Point 1.5V Point CAM_PCLK CAM_HS 1.8V CAM_MCLK CAM_VS Point - 74 -...
Page 74
4. TROUBLE SHOOTING 4.6.2 Check Point #2 - Connection of Slide PCB Connector Slide PCB Connector< CN100 > Slide PCB Connector< CN101 > of FPCB Main PCB Connector< CN102 > of FPCB - 75 -...
Page 75
4. TROUBLE SHOOTING 4.6.3 Check Point #3 - Main PCB Main Camera Control Signal Connector< CN201> (CAM_MCLK, PCLK, HS, VS) - 76 -...
Page 77
4. TROUBLE SHOOTING START Refer to Power is supplied to Power On Trouble the board? -> -> First of all, Go to menu ëB aseband Camera Main LCD Preview Refer to LCD Display OK? LCD Display Trouble Check Connection Reconnect FPCB or between 1.
4. TROUBLE SHOOTING 4.7 Flash LED Trouble Shooting Flash LED FLASH_LED LEWW-S35KA LD100 VA100 EVL5M02200 R104 R105 R106 R107 z Check Point - Check the connection status - Check the soldering of Componets - Check the FLASH_LED signal - 79 -...
Page 80
4. TROUBLE SHOOTING START Refer to Power is supplied to Power On Trouble the board? Connection between Reconnect FPCB FPCB and boards is OK? Re-solder Paths of LED control Connector signals are OK? FPCB OK? Replace the FPCB The LED is broken. After changing the board, Change the LED.
4. TROUBLE SHOOTING 4.8 SIM Detect Trouble Shooting SIM interface scheme is shown below. SIM_IO, SIM_CLK, SIM_RST ports are used to communicate DBB with ABB and the Charge Pump in ABB enables 1.8V/3V SIM operation. NOT MOUNT VBAT VRSIM U100 R1114D281D-TR-F VOUT GND1...
Page 82
4. TROUBLE SHOOTING z Connection between SIM and DBB - SIM_CLK, SIM_IO, SIM_RST, SIM_PWRCTRL z Check Points - Contact between SIM and socket - Soldering of SIM socket z Trouble Shooting - Insert the SIM into socket - Connect PIF_UNION Jig to the phone, and Power on z Trouble Shooting Procedure - Check the power supply - Check the soldering of SIM socket...
Page 83
4. TROUBLE SHOOTING START Insert SIM The soldering of SIM Re-solder the connector is OK? J100 of the main key .. The all paths connected Re-solder the to J100(main key) are OK? R116,R113,R110, C120, C121, C122, C123(main key) POWER ON Check the SIM_RST, Check connection of the Main, Main SIM_CLK, SIM_IO, VRSIM...
4. TROUBLE SHOOTING 4.9 Slide Up/Down and Trouble Shooting Slide Operation scheme is shown below. VRIO U101 EM-0781-T5 C103 SLIDE U101 C103 C104 C104 0.01u 4.9.1 Slide Operation(ON/OFF) - There is a magnet to detect the slide status, opened or closed. - If a magnet is down to the hall-effect switch(U502) the voltage at pin 1 of U502 goes to 0V.
Page 85
4. TROUBLE SHOOTING 4.9.2 Slide Trouble (ON/OFF) START Re-solder the The all paths connected to U101 are OK? C103, C104 Refer to Power ON Is the VRIO a 1.8V? Trouble Folder signal is low on Replace the U101. Magnetizing into U101? The U101 is broken The DBB(U102) is broken.
4. TROUBLE SHOOTING 4.10 Speaker/Receiver Trouble Shooting (Common Path) SPK__RCV_N START SPK__RCV_P Disassemble the slide case of phone. Check the resistance between Speaker has a problem. SPK_RCV_P & SPK__RCV_N of the Speaker Replace the Speaker. With the DVM ~ 8 ohm_ Disconnect The F-PCB from Main Board.
Page 87
4. TROUBLE SHOOTING U104(DBB) is broken. Check the SPK_EN( R120) Change the board. Is SPK_EN a High? Play the Ring tone. Check the input(C212,C214) of U202 The signal is a Analog U202 is broken. Replace the U202. <Fig.1> INPUT(C212) of U202 <Fig.2>...
Page 88
4. TROUBLE SHOOTING Check the soldering of Resolder the R207, R209, R207, R209, C212, C214,C215, C216 C212, C214,C215, C216 Soldering is OK? Play the Ring tone. U104(DBB) is broken. Check the C214(SPKNA),C212(SPKPA) The signal is a Analog Change the board. Check the Speaker contact PAD of the F-PCB - 89 -...
4. TROUBLE SHOOTING 4.11 Speaker/Receiver Trouble Shooting (Acoustic Path) START L201 L202 Disassemble the slide case of phone. C220 C219 C221 Check the soldering state of L201,L202,C219,C220,C221 Receiver has a problem. @MAIN_PCB Replace the Receiver. C105,C106,C107,VA101, VA102 @MAIN_FPCB VA102 Disconnect the F-PCB from the Main Board.
Page 91
4. TROUBLE SHOOTING z MIC Trouble START Voltage across R100 or L100 MICBIAS Voltage of U103 Replace U103 is about 2.5V? is about 2.5V? Re-solder R100 & L100 Check the signal level at each side of MIC100. Replace MIC100 Is it a few tens mVAC? Check the soldering of Replace U103 R142,R143,C113,C114...
4. TROUBLE SHOOTING 4.13 Ear-Mic Jack Detection Trouble Shooting START Disassemble the rear case of phone. Connect the Ear-Mic Headset to the Ear-Mic Socket of phone. Re-solder Check the Ear-Jack Detection. R307, VA302 Is the status of VA302 low? R307 VA302 Check the soldering status Re-solder Pin #8 of CN301...
4. TROUBLE SHOOTING 4.14 Ear-Mic Hook Detection Trouble Shooting START Disassemble the rear case of phone. Connect the Ear-Mic Headset to the Ear-Mic Socket of phone. Ear-Mic Headset has a Press the HOOK Button. problem. Is the status of R304 LOW? Exchange the Ear-Mic Headset Check the soldering status...
4. TROUBLE SHOOTING 4.15 Ear-Mic Headset MIC Trouble Shooting START Disassemble the rear case of phone. Connect the Ear-Mic Headset to the Ear-Mic Socket of phone. Re-solder Check Soldering of R310,R312 R310,R312,C302,C303,C308 C302, C303,C308,L304,C310,VA301 ,L304,C310,VA301 Is it O.K? Check the status of R310. U103(ABB) is broken.
4. TROUBLE SHOOTING 4.16 Ear-Mic Headset HSOR/HSOL Trouble Shooting START Ear-Mic Headset has a Check the resistance between problem. HSOR/L & GND of the Headset. Exchange the Ear-Mic 16 0hm 15%? Headset Disassemble the rear case of phone. Connect the Ear-Mic Headset to the Ear- Mic Socket.
4. TROUBLE SHOOTING 4.17 FM-Radio Trouble Shooting START Go to the Power Trouble Check the VRABB Voltage(2.8V) shooting O.K? Check the soldering status Of C315(Main) Replace the C315(Main) O.K? Check 32.768kHz signal Check the signal of C314, C316 @ C321 Can you see a signal? Can you see a signal? Go to the speaker/...
Page 99
4. TROUBLE SHOOTING z VRMMC Signal(Power ON) <VRMMC Signal when T-Flash is inserted> z TF_DAT0 Signal (Music Play) <TF_DAT0 Signal while T-Flash is read> - 100 -...
4. TROUBLE SHOOTING 4.19 Main Key Backlight LED Trouble Shooting z Keypad backlight LED Operation scheme is shown below. VBAT MAIN_KEY_BL_EN Q501 z Backlight operation - Keypad backlight LED is controlled with MAIN_KEY_BL_EN signal - MAIN_KEY_BL_EN signal from DBB(U102) - The LEDs are forward biased and turned on z Check Point - VBAT level ( 3.35 ~4.2V) - LEDs...
Page 101
4. TROUBLE SHOOTING z MAIN KEY Backlight LED Trouble START Is the Voltage level VBAT Charge Battery 3.35 ~4.2? Are all LEDs Check the soldering of each LED100 ~108(Main key) R or Replace LESs not Working? working Check the condition of Q100(Main key) is Q100 Working?
4. TROUBLE SHOOTING 4.20 Slide Key Backlight LED Trouble Shooting z Slide backlight LED Operation scheme is shown below. VBAT R103 R104 R134 LED100 R103 LED101 R103 LED100 LED101 R134 LED_ABC z Slide Backlight operation - Slide backlight LED is controlled with LED_ABC signal - LED_ABC signal from ABB(U102) - The LEDs are forward biased and turned on z Check Point...
5. Downloading Software 5. Downloading Software 5.1 The purpose of downloading software 5.1.1 To make a phone operate at the first manufacturing - A phone = Hardware + Software - A phone cannot operate with hardware alone. - The hardware with the suitable software can operate properly. 5.1.2 To upgrade the software of the phone - The software of the phone may be changed to enhance the performance of the phone.
Page 105
5. Downloading Software 5.2.2 In case of using the PIF( MON Port) ME550c Handset PC with RS-232 POWER SUPPLY a. Preparation - Target Handset (ME550c) - PIF - RS-232 Cable and PIF-to-Phone interface Cable - Power Supply or Battery b. IBM compatible PC supporting RS-232 with Windows 98 or newer If you use battery, you should have a battery with the voltage above 3.7V.
Page 119
0.1u PGND C434 C435 Section Date Sign & Name Sheet/ 0.01u 2.2u Sheets MODEL ME550c MAIN 01/24 Designer 2007 REGEN C_VCCRF Checked DRAWING TPS79928DRVR U406 RF_RENESAS NAME Approved PGND C436 C437 0.01u 2.2u DRAWING LG Electronics Inc. - 120 -...
Page 120
Section Date Sign & Name Sheet/ Sheets MODEL ME550c Main Key 01/23 MAIN_KEY_BL_EN Designer 2007 Checked DRAWING MIC & SIM & KeyLED & B/T & Batt.Conn. NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. - 121 -...
Page 121
R212 Section Date Sign & Name Sheet/ Sheets MODEL ME550c Main Key V_28 VRIO 01/23 Designer 2007 C200 C201 Checked DRAWING FM & CONN & KEY NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. - 122 -...
Page 122
OUT101 VBACKUP 3V/1mAh C102 0.1u Section Date Sign & Name Sheet/ Sheets MODEL ME550c MAIN-SUB 01/02 Designer 2007 Checked DRAWING T-FLASH / RTC Batt. / MOTOR NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. - 123 -...
Page 123
R145 ISINK4 LCD_BL_EN EN_SET C114 C115 C116 C117 Checked DRAWING U104 R132 AAT2805IXN-4.5-T1 ChargePump & LDO & LED & CONN. NAME 100K Approved CHARGE PUMP 3LED(60mA) + FLASH(300mA) DRAWING Iss. Notice No. Date Name LG Electronics Inc. - 124 -...
Page 124
KBR(5) VBAT KBC(0) KBC(1) KBC(2) Section Date Sign & Name Sheet/ KBC(3) Sheets MODEL KBC(4) VBATS ME550c MAIN FPCB 02/07 BATT_TEMP Designer MAIN_KEY_BL_EN 2007 Checked DRAWING NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. - 125 -...
Page 125
7. CIRCUIT DIAGRAM CAM/PWR SIDEKEY (PWON) (CAM) PWON KBC(2) (CAM) KBR(3) Section Date Sign & Name Sheet/ Sheets ME550c MODEL Designer Checked DRAWING SIDEKEY_FPCB NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. LG Electronics Inc. - 126 -...
Page 126
7. CIRCUIT DIAGRAM VOLUME SIDEKREY (UP) (DOWN) KBR(3) KBC(0) (UP) KBC(1) (DOWN) Section Date Sign & Name Sheet/ Sheets MODEL ME550c Designer Checked DRAWING SIDEKEY_FPCB NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. LG Electronics Inc. - 127 -...
9. RF Calibration 9. RF Calibration 9.1 What’s the Rx Calibration? 9.1.1 Find proper AGC Gain to make the same Rx Power fed into the Base Band Part regardless of Antenna Input Level 9.1.2 Can make report correct RSSI level Part X(Input Level)+G(Gain)=Y 9.2 What’s the Tx Calibration?
9. RF Calibration 9.3 Calibration program - HOT_KIMCHI 9.3.1 Calibration Program (HOT_KIMCHI) - Under windows 2k or XP - PIF JIG Support Agilent 8960 Test Set 9.3.2 Required Equipments - Test PC with PCMCIA slot - GPIB card - E5515C(Agilent 8960 series) - Power supply - 140 -...
10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark GSM(SLIDE) TGLL0011204 Silver AAAY00 ADDITION AAAY0238301 Silver...
Page 149
10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MLAZ00 LABEL MLAZ0038301 PID Label 4 Array Color - 150 -...
10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Main component> Location Level Description Part Number Specification Color Remark SMZY00 MODULE,ETC SMZY0014203 512MB MicroSD 3.0 ,-2.0 dBd,, ,internal, GSM900/1800/1900 ,;...
Page 151
10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R105 RES,CHIP,MAKER ERHZ0000473 39 ohm,1/16W ,J ,1005 ,R/TP R106 RES,CHIP,MAKER ERHZ0000473 39 ohm,1/16W ,J ,1005 ,R/TP R107 RES,CHIP,MAKER ERHZ0000473 39 ohm,1/16W ,J ,1005 ,R/TP R108 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP...
Page 152
10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C112 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP C113 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP C114 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C115 CAP,CHIP,MAKER ECZH0003202...