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Service Manual
KE500/ME550c
Date: May, 2007 / Issue 1.0

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Summary of Contents for LG KE500

  • Page 1 Service Manual KE500/ME550c Date: May, 2007 / Issue 1.0...
  • Page 2: Table Of Contents

    Table of Contents 1. General Description......5 4.15 Ear-Mic Headset MIC Trouble Shooting......... 95 4.16 Ear-Mic Headset HSOR/HSOL 2. Performance ........6 Trouble Shooting........96 2.1 Product Name ......... 6 4.17 FM-Radio Trouble Shooting....98 2.2 Supporting Standard ........6 4.18 Transflash Trouble Shooting....99 2.3 Main Parts : GSM Solution......
  • Page 4: General Description

    1. General Description 1. General Description The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.
  • Page 5: Performance

    2. Performance 2. Performance 2.1 Product Name ME550c : GPRS Class 10 / EDGE Class 10 2.2 Supporting Standard Item Feature Comment Supporting Standard EGSM/DCS1800/PCS1900 with seamless handover Phase 2+(include AMR) SIM Toolkit : Class 1,2,3,E Frequency Range EGSM TX : 880 - 915 MHz EGSM RX : 925 - 960 MHz DCS1800 TX : 1710 - 1785 MHz DCS1800 RX : 1805 - 1880 MHz...
  • Page 6: Hw Feature

    2. Performance 2.4 HW Feature Item Feature Comment Form Factor Slide 1) Capacity Battery Standard : Li-Polymer, 800mAh 2) Packing Type : Hard Pack Standard : Size 97.0 X 47.0 X 14.9 mm Weight With Battery Volume 75cc Staggered 10Layers , 0.8t Stand by time 250 hrs @ Paging Period 5...
  • Page 7 2. Performance Item Feature Comment Status Indicator None Alphanumeric Key : 12 Function Key: Function Key : 9 4 Key Navigation, OK, F1, Side Key : 4 F2, CLR, SND Keypad Total No of Keys :25 Side Key : Volume up/down, CAM, PWR/END Main : Internal Fixed Type Blue tooth : Internal Fixed Type...
  • Page 8 2. Performance Item Feature Comment RSSI 0 ~ 5 Levels Battery Charging 0 ~ 4 Levels Key Volume 0 ~ 5 Level Audio Volume 1 ~ 5 Level Time / Date Display NITZ Multi-Language English / French Phone Book / Message / Camera Quick Access Mode / My Stuff / Favorite PC Sync...
  • Page 9 2. Performance Item Feature Comment Call Duration SMS (EMS) 100 (10) EMS : Release4 (Except Text align) SMS Over GPRS EMS Melody / Picture Send / Receive / Save MMS MPEG4 / Send / Receive / Save Long Message MAX 925 Characters Cell Broadcast Download Over the WAP...
  • Page 10 2. Performance Item Feature Comment IrDa V2.0 HSP, HFP, OPP, Blue tooth FTP(server), BPP, A2DP, AVRCP GPRS Class 10 EDGE Class 10 Hold / Retrieve Conference Call Max. 6 DTMF Memo pad Sync ML Email - 11 -...
  • Page 11: Technical Specification

    2. Performance 2.6 Technical Specification Item Description Specification GSM850 TX: 824 + n x 0.2 MHz (n=1 ~ 124) RX: TX + 45 MHz GSM900 TX: 890 + n x 0.2 MHz (n=1 ~ 124) 890 + (n-1024) x 0.2 MHz (n=975 ~ 1023) RX: TX + 45 MHz Frequency Band DCS1800...
  • Page 12 2. Performance Item Description Specification GSM900 Offset from Carrier (kHz). Max. dBc 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 Output RF Spectrum 6,000 (due to modulation) DCS1800/PCS1900 Offset from Carrier (kHz). Max. dBc 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000 GSM900...
  • Page 13 2. Performance Item Description Specification DCS1800/PCS1900 Offset from Carrier (kHz). Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status Bit Error Ratio BER (Class II) < 2.439% @-102dBm Rx Level Report accuracy 3 dB 8 3 dB Frequency (Hz) Max.(dB)
  • Page 14 2. Performance Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side Tone Distortion Three stage distortion < 10% <Change> System frequency 2.5ppm (13 MHz) tolerance <Change>32.768KHz tolerance...
  • Page 15 2. Performance Item Description Specification Antenna Bar Number Power -85 dBm ~ -90 dBm ~ -86 dBm Antenna Display -95 dBm ~ -91 dBm -100 dBm ~ -96 dBm -105 dBm ~ -101 dBm ~ -105 dBm Barttey Bar Voltage 0(included Blinking) 3.65V~3.35V 3.71V ~ 3.66V...
  • Page 16: Circuit Description

    3. Circuit Description 3. Circuit Description 3.1 General Description The RF part consists of a transmitter, a receiver, a synthesizer, a voltage supply and a DCXO part. The main RF Chipset B6PLD is a highly integrated RF tranceiver IC FOR Digital Interface of GSM 850, GSM900, DCS1800 and PCS1900 quad-band cellualr systems.
  • Page 17 3. Circuit Description 3.2.1.1 Baseband PGA/Low pass Filter Specifications The baseband programmable amplifier comprises one stage with variable gain followed by a fixed gain amplifier. The overall gain control range is 36dB with 6dB Steps. The filtering is provided by a single R/C low pass filter with an on-chip capacitor followed by on-chip Chebychev low pass filters.
  • Page 18: Transmitter Part

    3. Circuit Description 3.2.2 Transmitter part The B6PLD transmitter is capable of both GMSK and 8-PSK modulation, to support for conventional GSM and EDGE. B6PLD integrates all loop filters to configure both PM loop and AM loop. See block diagram below. Fig.
  • Page 19 3. Circuit Description 3.2.3 RF Systhesiser 3.2.4 Front End Module Specification 3.2.4.1 Block Diagram and Internal Matching Condition HWXR693 - 20 -...
  • Page 20 3. Circuit Description 3.2.4.2 Logic Table for Selction Select Mode Vc(GSM850/EGSM) Vc(DCS/PCS) GSM850_Rx EGSM_Rx GSM850/EGSM_Tx High DCS_Rx PCS_Rx DCS/PCS_Tx High <Table> Band SW Logic Table 3.2.5 Power Amplifier Module for Quad-band GSM/GPRS/EDGE 3.2.5.1 PAM Specification -. Quad band GSM, GPRS & Ploar Loop EDGE Amplifier -.
  • Page 21 3. Circuit Description 3.2.6 Digital Core 3.2.6.1 Digital Interface Block Diagram Fig. 1-1 Digital Interface Block Digram - 22 -...
  • Page 22 3. Circuit Description 3.2.6.2 Control system and digital interface The B6PLD is a RF transceiver IC for GSM850, GSM900, DCS1800 and PCS1900 quad band cellular system, and incorporates EDGE transceiver capability. The B6PLD has a digital interface connection to the baseband processor. This interface complies with the digital interface specification DigRF standard v112.
  • Page 23: Digital Baseband

    3. Circuit Description 3.3 Digital Baseband <Fig.6> OMAPV1030 Block Diagram 3.3.1 General description The OMAPV1030 E-GPRS multimedia device belongs to the Texas Instruments OMAP-Vox_ processors family. It combines both a modem engine and an application engine. Memory and CPU resources are shared between modem and application processing. The OMAPV1030 chip is based on the OMAP3.4 architecture and integrates two processor subsystems: - An MPU subsystem based on an ARM926EJ-S...
  • Page 24: Block Description

    3. Circuit Description 3.3.2 Block Description The OMAPV1030 E-GPRS multimedia device is based on an OMAP3.4 platform that integrates: - The MPU subsystem - The DSP subsystem - A system DMA - A traffic controller providing: - External memory interfaces with: - A slow interface (EMIFS) to ROM, SRAM, FLASH memories - A fast interface (EMIFF) to SDRAM memories - Layer 3 (L3) interconnect made of two OCP target ports (OCP-T1 and OCP-T2) and one OCP...
  • Page 25 3. Circuit Description The OMAP3.4 platform is the computing core of the device. The other OMAPV1030 components are organized as follows: - The internal memory subsystem is made of a single-port 256K-bit shared internal SRAM. - The security subsystem is a set of several components, including dedicated a secure mode to run secure applications.
  • Page 26 3. Circuit Description <Fig.8> OMAPV1030 Radio Interface This implementation is based on the following: - The time processing unit (TPU) module is a real-time sequencer dedicated to monitoring GSM baseband processing. - The serial port of the time serial port (TSP) module controls both interfaces. - The real-time TSPACT signal of the TSP module - The McBSP digital RF module is used for the six-wire data interface.
  • Page 27: Sim Interface

    3. Circuit Description 3.3.4 SIM interface SIM interface scheme is shown in below. SIM_IO, SIM_CLK, SIM_RST, SIM_PWRCTRL ports are used to communicate DBB via ABB with plugged sim card and the LDO (VRSIM) in ABB enables operate 1.8V to 2.5V to search SIM card <Fig.9>...
  • Page 28: Uart Interface

    3. Circuit Description 3.3.5 UART Interface ME550c has Three UART Drivers as follow : - UART1 : USB - UART2 : ETM, Calibration - UART3 : AT command, Fax_modem, Bluetooth UART1(USB) Resource Name Description USB_DP Data USB_DM Data USB_PWR POWER USB_POWER VBUS VBUS...
  • Page 29 3. Circuit Description 3.3.6 GPIO Map In total 22 allowable resources, ME550c is using 9 resources except 3 resources dedicated to SIM and Memory. ME550c GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table 3. Resource Inactive Active...
  • Page 30: Camera Interface

    3. Circuit Description 3.3.7 Camera interface ME550c have a 8-bit parallel camera interface(NOBT Mode) . This is a general parallel interface with vertical and horizontal synchronization signals.(See. Figure 12) The maximum clock is 96 MHz for 8-bit data data, or 48 MHz for 10- or 12-bit data. <Fig.10>...
  • Page 31: Analog Baseband

    3. Circuit Description 3.4 Analog Baseband 3.4.1 General Description The TRITON chip is the analog and power management part of the Texas Instruments next generation wireless terminal. These GSM/GPRS/E-GPRS, 3G W-CDMA, CDMA2000 platforms are composed of a digital baseband processor, a RF chip, an application processor OMAP and of different peripheral devices like a LCD panel, a Multi-Media Card, a Bluetooth modem, a GPS modem.
  • Page 32 3. Circuit Description 3.4.2 Audio Signal Processing & Interface The Audio module consists of a Voice Codec dedicated to mobile telephone terminal application and a Stereo path. - The Voice Codec circuit processes analog audio components in the uplink path and transmits the converted data to the DSP speech coder through the voice serial port (VSP).
  • Page 33 3. Circuit Description <Fig.12> Power Supply Scheme - 34 -...
  • Page 34 3. Circuit Description 3.4.4 Monitoring ADC The monitoring ADC (MADC) consists of a 10-bit analog-to-digital converter (ADC) combined with an 11- input analog multiplexer. The ADC implementation consists of a successive approximation conversion. Five of the eleven inputs are available externally (ADIN1..5), and the remaining six inputs are dedicated to die temperature measurement, main battery voltage, backup battery voltage, charger voltage, charger current monitoring and USB Vbus voltage.
  • Page 35: Lcd Module

    3. Circuit Description 3.4.6 Memories - 512Mbit NAND Flash + 512Mbit DDR RAM 3.4.7 LCD Module The NM200CND module is a Color Active Matrix Liquid Crystal Display with an Light Emission Diode (LED) Back Light system. The matrix employs a-Si Thin Film Transistor as a active element. It is a transmissive type display operating in the normally white mode.
  • Page 36 3. Circuit Description 3.4.7.2 LCD module pin map description - 37 -...
  • Page 37 3. Circuit Description 3.4.8 Keypad Map description KEYPAD R200 KBR(0) VA200 EVLC5S02100 R201 KBR(1) VA201 EVLC5S02100 R202 KBR(2) VA202 EVLC5S02100 R203 KBC(0) R204 KBC(1) R205 KBC(2) R206 KBC(3) SIDE_KEY_VOL CN202 R207 EVLC5S02100 EVLC5S02100 KBC(1) R208 EVLC5S02100 EVLC5S02100 KBC(0) VA208 VA207 EVLC5S02100 R209 KBR(3)
  • Page 38 3. Circuit Description 3.4.9 Bottom System Connector Pin # ME550c Description 18Pin FM_ANT FM_RADIO ANTENNA HSMICIP/HOOK DETECT HEAD SET JACK_TYPE HAED SET HSO_L CHARGING (VCHG) HSO_R CHARGING (VCHG) UART3_TX/USB_DP USB/UART3 (Transmit Data) UART3_RX/USB_DM USB/UART3 (Receive Data) JACK_DETECT HEAD SET VBAT BAT T ERY(+4.2V) VBAT BATTERY(+4.2V)
  • Page 39: Bluetooth Interface

    3. Circuit Description 3.5 Bluetooth Interface 3.5.1 Bluetooth Circuit BLUETOOTH (Shielding Block) VRIO VBAT KA_OUT VLDO_OUT 10K R102 C103 C105 VLDO_OUT C106 0.1u 4.7u C108 CLK_32K ANA_OUT BT_CLK_REQ IO0_EXT_CLK_REQ_OUT RF_P IO1_EXT_CLK_REQ_IN RF_M KA_OUT IO2_SCL JTAG_TDI ANA_OUT RFIO_OUT IO3_SDA JTAG_TDO JTAG_TMS JTAG_TCK HCI_TX BT_RX...
  • Page 40: Pin Description

    3. Circuit Description 3.5.2 Pin Description Description CLOCKS/GLOBAL SIGNALS SLOW-CLK_IN 32.768.kHz clock input XTALM Negative fast crystal in XTALP/FAST_CLK_IN Positive fast crystal in/fast clock input RADIO FREQUENCY INTERFACE Receiver/transmit differential RF I/O Receiver/transmit differential RF/IO POWER MANAGEMENT VLDC_OUT Very-low drop-output voltage KA_OUT Keep alive output NSHUT_DOWN...
  • Page 41 3. Circuit Description 3.5.3 Bluetooth circuit Description One chip Bluetooth Module U302(BRF6150) supports the following feature. -Bluetooth®1.2 Support A2DP, HFP,HSP Adaptive Frequency Hopping (AFH) Fast connection Extended SCO-All New Paket Types Scatter Mode Quality-Of-Service Improvements LMP Improvements Synchronization -UART Interface Baud Rate: 115.2kbps (default) -USB Interface v.2.0 -PCM Interface...
  • Page 42: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Part Technical Brief 4.1.1 RF Part Component SW401 FL401 U406 U404 U403 U405 X401 U402 U401 ] Part Description SW401 : Mobile Switch Connector U401 : BT_CLK Buffer U402 : SysCLK Buffer U403 : RF Transceiver(B6PLD) U404 : Power Amplifier Module(RPF09036B) U405 : 2.8V Regulator...
  • Page 43 4. TROUBLE SHOOTING 4.1.2 Part Description 4.1.2.1 Regulator Supply 2.8V to RF part U406 U405 VBAT LDO Supplies VCC_SYN TPS79928DRVR U405 C433 0.1u PGND C434 C435 0.01u 2.2u REGEN C_VCCRF TPS79928DRVR U406 PGND C436 C437 0.01u 2.2u <Fig.1> Regulator Circuit Diagram - 44 -...
  • Page 44 4. TROUBLE SHOOTING 4.1.2.2 Power Amplifier Module (RPF09036B) Select the RX / TX path and amplifier the power. ] Part Description C418 Front End Module Switch Control C418 C426 : VRAMP U404 C423 : BAND_SELECT C418 : Vc_EGSMGSM850_Tx C420 : Vc_DCSPCS_Tx C426 C423 Application...
  • Page 45 4. TROUBLE SHOOTING 4.1.2.3 SAW Filter Bank Pass wanted signal and include LNA matching circuit. FL40 1 GND13 EGSMGSM850TX GND12 DCSPCSTX GND11 GND10 GND9 GND8 PCSRX2 PCSLNAI GND7 PCSRX1 PCSLNAIB FL401 GND6 PCSDCSGN HWXR693 GND5 SFAY00009801 DCSRX2 DCSLNAI GND4 DCSRX1 DCSLNAIB GND3 DCSG90GN...
  • Page 46 4. TROUBLE SHOOTING 4.1.2.4 RF Transceiver (B6PLD) Digital Interface to Baseband. Integrate LNA and VCO circuit. FL401 U403 U702 X401 U402 C738 U401 C_VCCRF VCC_SYN SN74AHC1GU04DCKR C402 U401 1000p R401 BT_CLK C403 0.01u C404 0.01u R403 C407 3.9p C405 VRIO 3.9p C406 33nF...
  • Page 47 4. TROUBLE SHOOTING 4.1.2.5 DCXO Produce RF and BB reference Clock - 26MHz Clock. C406 33nF C409 X401 GNDVCXO_OR VOUTEF2 C412 VCCVCXO <Fig.5> DCXO Circuit Diagram - 48 -...
  • Page 48: Rf Part Trouble Shooting

    4. TROUBLE SHOOTING 4.2 RF Part Trouble shooting 4.2.1 RF Receiving Path Trouble Shooting START SW401 HP8960 : Test mode 190 CH, 5 level setting (TCH) FL401 190 CH, -60dBm setting (BCCH) U406 Spectrum analyzer setting U404 Oscilloscope setting U403 U405 1.
  • Page 49 4. TROUBLE SHOOTING 4.2.1.1 Regulator Circuit Regulator U406 C435(C437) 2.8V? Regulator is OK. C437 U405 Check U101 C435 VBAT LDO Supplies VCC_SYN C435(C437) TPS79928DRVR U405 C433 0.1u PGND C434 C435 0.01u 2.2u REGEN C_VCCRF TPS79928DRVR U406 PGND C436 C437 0.01u 2.2u - 50 -...
  • Page 50 4. TROUBLE SHOOTING 4.2.1.2 DCXO Circuit C406 33nF C409 C409 FL401 GNDVCXO_OR R405 <Fig.2> DCXO Circuit Diagram DCXO C409 C409 26MHz? DCXO is OK. Check U403 - 51 -...
  • Page 51 4. TROUBLE SHOOTING 4.2.1.3 Mobile Switch & PAM & FEM Circuit R408 SW401 C420 FL40 C418 C415 U404 U403 Mobile Switch C426 C423 Replace Mobile SW401 between R408 and s/w(SW401) C415 Is short? FEM(FL401) Check Check Control Signal C418,C420,C423,C426 Regulator(U403,U404) Check RF Tranceiver(U403) VC_EGSM/DCS_TX...
  • Page 52 4. TROUBLE SHOOTING 4.2.1.4 RF Main Transceiver Circuit C_VCCRF VCC_SYN SN74AHC1GU04DCKR C402 U401 1000p R401 BT_CLK C403 0.01u C404 0.01u R403 C407 FL401 3.9p C405 VRIO 3.9p C406 33nF C409 C410 C408 0.1u 0.01u C411 U402 R406 R407 8.2nH SYSCLK SN74LVC1G125DRLR PCSLNAI PCSLNAIB...
  • Page 53 4. TROUBLE SHOOTING 4.2.2 RF Transmitting Path Trouble Shooting SW701 START SW401 HP8960 : Test mode 190 CH, 5 level setting (TCH) FL401 190 CH, -60dBm setting (BCCH) U406 Spectrum analyzer setting U701 U404 Oscilloscope setting SW701 U403 U405 1. Check X401 Regulator Circuit U402...
  • Page 54 4. TROUBLE SHOOTING 4.2.2.1 Mobile Switch & PAM & FEM Circuit Mobile Switch R408 SW401 Replace mobile SW401 between R408 C415 s/w(SW401) and C415 Is short? FEM(FL401) C420 FL401 C418 U404 Check Control Signal Check PAM(U404) C420 C418,C420 U403 C426 C423 Check RF Check R406,R407...
  • Page 55 4. TROUBLE SHOOTING VC_EGSM/DCS_TX (C418/C420) TX_BAND(R418) TX_ON(C421) GSM900 - 56 -...
  • Page 56: Bluetooth Trouble Shooting

    4. TROUBLE SHOOTING 4.3 Bluetooth Trouble Shooting start In Engineering mode(2945#*#) Set BT Test mode ON Set RF test mode and then BT ON Check BT Antenna Status Replace BT Antenna (Refer to figure 1) Check 1.8V from ABB Check ABB(U103) (Refer to figure 2) Check DCXO(X401) or Check 26MHz...
  • Page 57 4. TROUBLE SHOOTING 4.3.1 Checking BT Antenna 4.3.1.1 Visual Inspection <Fig. 1> 4.3.1.2 Checking BT VRIO Checking pin A3,D8,H6(C103) Check ABB 1.8V High Check 1.8V High (U103) C103 Check BT_CLK <Fig. 2> - 58 -...
  • Page 58 4. TROUBLE SHOOTING 4.3.1.3 Checking BT_CLK C112 Checking C402(D7) C402 Check BT_CLK Check BT_CLK_REQ 26MHz <Fig. 3> 4.3.1.4 Checking BT CLK REQ Checkin g BT_CLK_REQ BT CLK REQ R106 Check BT_CLK_REQ 1.28s SYS_CLK_EN BT_CLK_REQ <Fig. 3> <Sleep Mode> - 59 -...
  • Page 59 4. TROUBLE SHOOTING 4.3.1.5 Checking BT RF OUT RFIO_OUT DBF81H903 FB100 RF_P GND1 ANT100 ANT101 R119 UNBL R120 R121 C124 RF_M 100p Check with Spectrum Analyzer in BT Equipment connection status. R119 - 60 -...
  • Page 60: Baseband Part Troubleshooting

    4. TROUBLE SHOOTING 4.4 Baseband Part Troubleshooting 4.4.1 Power On Trouble 4.4.1.1 Power-On Trouble Troubleshooting Power-On Sequence - Connecting Battery - Power-On Key Detection - Pwon signal goes to ABB and then ABB resets DBB by ONNOFF signal - ONNOFF turns low(0v) to High (2.8V) and it resets DBB (Neptune) - All LDOs (internal LDOs of ABB and external LDOs) are turned on Check Points - Battery Voltage...
  • Page 61 4. TROUBLE SHOOTING 4.4.2 Check Point C135 C139 C136 C132 C130 C138 C131 C128 C134 C133 C137 <Fig. 2> Triton Power Supplies C128 : VRDBB =>1.4V/1.08V C130 : VREXTL =>1.8V or 0V , Not used C131 : VREXTH => 2.8V, TEMP_SENSE C132 : VRMMC =>...
  • Page 62 4. TROUBLE SHOOTING <Fig. 2.1> Triton Power Supplies - 63 -...
  • Page 63 4. TROUBLE SHOOTING START Check is the CN202(main key) Re-solder the CN203(main key) Is well-soldered? R210(main key) Re-solder Is well-soldered? R210(main key) Check is the connection of Connect the Main key, Main, Main FPCB Main key, Main, Main FPCB ? Check the Main FPCB Replace Main FPCB Main FPCB is OK?
  • Page 64: Charging Trouble Shooting

    4. TROUBLE SHOOTING 4.4.3 Charging Trouble Shooting - Charging method : CC-CV - Charger Detection Voltage : About 4.0V - Charging Time : About 2H under - Charging Current : About 550mA - Cut-off Current : 80mA - Low Battery Alarm z Talk mode : 3.62V z Standby mode : 3.50V - Switch-Off Voltage : 3.35...
  • Page 65 4. TROUBLE SHOOTING 4.4.4 Charging Current - Charging Procedure z Connecting TA & Charger Detection z Control the charging Current by CHARGER IC z Charging Current flow into the Battery - Check Points z Connection of TA z Charger IC z Battery - Trouble Shooting Setup z Connect Battery &...
  • Page 66 4. TROUBLE SHOOTING START Re-solder the CN301 I/O Connector (CN301,Main) (Pin 12,13) Is well-soldered? Check the FB301,FB302(Main), Re-solder the FB301, FB302(Main) Is it OK? Voltage at pin 6,7 of U302(Main) Replace the U302(Main) =4.8? The IC out of order. Voltage at pin 5 of U102(Main) Replace the IC Is LOW in case charging ? The Battery may have Problem.
  • Page 67: Lcd Display Trouble

    4. TROUBLE SHOOTING 4.5 LCD Display Trouble z LCD Control signals from Main Board - DIF_RESET, MAIN_CS, DIF_ADS, DIF_WR, DIF_RD, DIF_VSYNC, E_DATA(15~8) ELCD_DATA_0 ELCD_DATA_1 ELCD_DATA_2 ELCD_DATA_3 ELCD_DATA_4 ELCD_DATA_5 E_DATA(15:8) ELCD_DATA_6 ELCD_DATA_7 E_DATA(8) ELCD_DATA_8 E_DATA(9) ELCD_DATA_9 E_DATA(10) ELCD_DATA_10 E_DATA(11) ELCD_DATA_11 E_DATA(12) ELCD_DATA_12 E_DATA(13) ELCD_DATA_13...
  • Page 68 4. TROUBLE SHOOTING 4.5.1 Check Point #1 - Slide key PCB FPCB Connector LCD module < CN101 > Connector < CN101 Connection of Slide key PCB > < CN100 Connection of Slide key PCB > DP_28 VBAT CN100 CN101 51 52 MLED LED_CA1 LED_CA2...
  • Page 69 4. TROUBLE SHOOTING 4.5.2 Check Point #2 - FPCB Slide key PCB Connector< CN100 > Main PCB Connector< CN201 > 4.5.3 Check Point #3 - Main PCB FPCB Connector < CN201 > EMI filter - 70 -...
  • Page 70 4. TROUBLE SHOOTING < CN201 Connection of Main PCB > FPCB_CONNECTOR LEFT VCAM18_EN CN201 VRSIM VRIO CIF_PD CAM_D(0) E_DATA(15:8) CAM_D(1) CAM_D(2) E_DATA(8) CAM_D(3) E_DATA(9) CAM_D(4) FL203 EVRC14S03Q030100R E_DATA(10) CAM_D(5) E_DATA(11) CAM_D(6) INOUT_A1 INOUT_B1 E_DATA(12) INOUT_A2 INOUT_B2 CAM_D(7) E_DATA(13) CAM_RST INOUT_A3 INOUT_B3 E_DATA(14) CAM_HS...
  • Page 71 4. TROUBLE SHOOTING START Refer to Power is supplied to Power On Trouble the board? First of all, push a key pad then check 1.8/2.8V check Points during a Key pad LED ON. Connection between Reconnect FPCB FPCB and boards is OK? Re-solder the Connectors are soldered well? Connector...
  • Page 72: Camera Trouble Shooting

    4. TROUBLE SHOOTING 4.6 Camera Trouble Shooting z Camera signals from Main Board - CAM_RST, CAM_MCLK, CAM_PCLK, CAM_VS, CAM_HS, CAM_D(0) ~ D(7) C441 C443 C440 C442 C439 C445 C438 C444 z Camera signals from Main Board - Check the power supply - Check the soldering of Components - Check the CAMERA signals z Trouble Shooting Setup...
  • Page 73 4. TROUBLE SHOOTING 4.6.1 Check Point #1 - Connection of Camera Module Camera module CAM_RS T CAM_D(4 ) 2.8V Point 1.5V Point CAM_PCLK CAM_HS 1.8V CAM_MCLK CAM_VS Point - 74 -...
  • Page 74 4. TROUBLE SHOOTING 4.6.2 Check Point #2 - Connection of Slide PCB Connector Slide PCB Connector< CN100 > Slide PCB Connector< CN101 > of FPCB Main PCB Connector< CN102 > of FPCB - 75 -...
  • Page 75 4. TROUBLE SHOOTING 4.6.3 Check Point #3 - Main PCB Main Camera Control Signal Connector< CN201> (CAM_MCLK, PCLK, HS, VS) - 76 -...
  • Page 76 4. TROUBLE SHOOTING < CN201 Connection of Main PCB > FPCB_CONNECTOR LEFT VCAM18_EN CN201 VRSIM VRIO CIF_PD CAM_D(0) E_DATA(15:8) CAM_D(1) CAM_D(2) E_DATA(8) CAM_D(3) E_DATA(9) CAM_D(4) FL203 EVRC14S03Q030100R E_DATA(10) CAM_D(5) E_DATA(11) CAM_D(6) INOUT_A1 INOUT_B1 E_DATA(12) CAM_D(7) INOUT_A2 INOUT_B2 E_DATA(13) INOUT_A3 INOUT_B3 CAM_RST E_DATA(14) INOUT_A4...
  • Page 77 4. TROUBLE SHOOTING START Refer to Power is supplied to Power On Trouble the board? -> -> First of all, Go to menu ëB aseband Camera Main LCD Preview Refer to LCD Display OK? LCD Display Trouble Check Connection Reconnect FPCB or between 1.
  • Page 78: Flash Led Trouble Shooting

    4. TROUBLE SHOOTING 4.7 Flash LED Trouble Shooting Flash LED FLASH_LED LEWW-S35KA LD100 VA100 EVL5M02200 R104 R105 R106 R107 z Check Point - Check the connection status - Check the soldering of Componets - Check the FLASH_LED signal - 79 -...
  • Page 79 4. TROUBLE SHOOTING 4.7.1 Check Point #1 - Slide key PCB Charge pump IC FPCB (Control Connector Flash LED) < CN101 > < U104 Connection of Slide key PCB > C106 C107 C108 VBAT FB100 VOUT_FL FLASH_LED FB101 C111 VOUT_BL MLED 2.2u PGND...
  • Page 80 4. TROUBLE SHOOTING START Refer to Power is supplied to Power On Trouble the board? Connection between Reconnect FPCB FPCB and boards is OK? Re-solder Paths of LED control Connector signals are OK? FPCB OK? Replace the FPCB The LED is broken. After changing the board, Change the LED.
  • Page 81: Sim Detect Trouble Shooting

    4. TROUBLE SHOOTING 4.8 SIM Detect Trouble Shooting SIM interface scheme is shown below. SIM_IO, SIM_CLK, SIM_RST ports are used to communicate DBB with ABB and the Charge Pump in ABB enables 1.8V/3V SIM operation. NOT MOUNT VBAT VRSIM U100 R1114D281D-TR-F VOUT GND1...
  • Page 82 4. TROUBLE SHOOTING z Connection between SIM and DBB - SIM_CLK, SIM_IO, SIM_RST, SIM_PWRCTRL z Check Points - Contact between SIM and socket - Soldering of SIM socket z Trouble Shooting - Insert the SIM into socket - Connect PIF_UNION Jig to the phone, and Power on z Trouble Shooting Procedure - Check the power supply - Check the soldering of SIM socket...
  • Page 83 4. TROUBLE SHOOTING START Insert SIM The soldering of SIM Re-solder the connector is OK? J100 of the main key .. The all paths connected Re-solder the to J100(main key) are OK? R116,R113,R110, C120, C121, C122, C123(main key) POWER ON Check the SIM_RST, Check connection of the Main, Main SIM_CLK, SIM_IO, VRSIM...
  • Page 84: Slide Up/Down And Trouble Shooting

    4. TROUBLE SHOOTING 4.9 Slide Up/Down and Trouble Shooting Slide Operation scheme is shown below. VRIO U101 EM-0781-T5 C103 SLIDE U101 C103 C104 C104 0.01u 4.9.1 Slide Operation(ON/OFF) - There is a magnet to detect the slide status, opened or closed. - If a magnet is down to the hall-effect switch(U502) the voltage at pin 1 of U502 goes to 0V.
  • Page 85 4. TROUBLE SHOOTING 4.9.2 Slide Trouble (ON/OFF) START Re-solder the The all paths connected to U101 are OK? C103, C104 Refer to Power ON Is the VRIO a 1.8V? Trouble Folder signal is low on Replace the U101. Magnetizing into U101? The U101 is broken The DBB(U102) is broken.
  • Page 86: Speaker/Receiver Trouble Shooting (Common Path)

    4. TROUBLE SHOOTING 4.10 Speaker/Receiver Trouble Shooting (Common Path) SPK__RCV_N START SPK__RCV_P Disassemble the slide case of phone. Check the resistance between Speaker has a problem. SPK_RCV_P & SPK__RCV_N of the Speaker Replace the Speaker. With the DVM ~ 8 ohm_ Disconnect The F-PCB from Main Board.
  • Page 87 4. TROUBLE SHOOTING U104(DBB) is broken. Check the SPK_EN( R120) Change the board. Is SPK_EN a High? Play the Ring tone. Check the input(C212,C214) of U202 The signal is a Analog U202 is broken. Replace the U202. <Fig.1> INPUT(C212) of U202 <Fig.2>...
  • Page 88 4. TROUBLE SHOOTING Check the soldering of Resolder the R207, R209, R207, R209, C212, C214,C215, C216 C212, C214,C215, C216 Soldering is OK? Play the Ring tone. U104(DBB) is broken. Check the C214(SPKNA),C212(SPKPA) The signal is a Analog Change the board. Check the Speaker contact PAD of the F-PCB - 89 -...
  • Page 89: Speaker/Receiver Trouble Shooting (Acoustic Path)

    4. TROUBLE SHOOTING 4.11 Speaker/Receiver Trouble Shooting (Acoustic Path) START L201 L202 Disassemble the slide case of phone. C220 C219 C221 Check the soldering state of L201,L202,C219,C220,C221 Receiver has a problem. @MAIN_PCB Replace the Receiver. C105,C106,C107,VA101, VA102 @MAIN_FPCB VA102 Disconnect the F-PCB from the Main Board.
  • Page 90: Mic Trouble Shooting

    4. TROUBLE SHOOTING 4.12 MIC Trouble Shooting z MIC Operation scheme is shown below. R142 C113 0.1uF MICIN MIC_ABB_N R143 C114 0.1uF MICIP MIC_ABB_P L101 HSMIC HSMICIP 100nH MICBIAS MICBIAS C115 HSMICBIAS HSMICBIAS 100p AUXI_FMR RADIO_R RADIO_L EARN RCV_N R142 R143 EARP RCV_P...
  • Page 91 4. TROUBLE SHOOTING z MIC Trouble START Voltage across R100 or L100 MICBIAS Voltage of U103 Replace U103 is about 2.5V? is about 2.5V? Re-solder R100 & L100 Check the signal level at each side of MIC100. Replace MIC100 Is it a few tens mVAC? Check the soldering of Replace U103 R142,R143,C113,C114...
  • Page 92: Ear-Mic Jack Detection Trouble Shooting

    4. TROUBLE SHOOTING 4.13 Ear-Mic Jack Detection Trouble Shooting START Disassemble the rear case of phone. Connect the Ear-Mic Headset to the Ear-Mic Socket of phone. Re-solder Check the Ear-Jack Detection. R307, VA302 Is the status of VA302 low? R307 VA302 Check the soldering status Re-solder Pin #8 of CN301...
  • Page 93: Ear-Mic Hook Detection Trouble Shooting

    4. TROUBLE SHOOTING 4.14 Ear-Mic Hook Detection Trouble Shooting START Disassemble the rear case of phone. Connect the Ear-Mic Headset to the Ear-Mic Socket of phone. Ear-Mic Headset has a Press the HOOK Button. problem. Is the status of R304 LOW? Exchange the Ear-Mic Headset Check the soldering status...
  • Page 94: Ear-Mic Headset Mic Trouble Shooting

    4. TROUBLE SHOOTING 4.15 Ear-Mic Headset MIC Trouble Shooting START Disassemble the rear case of phone. Connect the Ear-Mic Headset to the Ear-Mic Socket of phone. Re-solder Check Soldering of R310,R312 R310,R312,C302,C303,C308 C302, C303,C308,L304,C310,VA301 ,L304,C310,VA301 Is it O.K? Check the status of R310. U103(ABB) is broken.
  • Page 95: Ear-Mic Headset Hsor/Hsol Trouble Shooting

    4. TROUBLE SHOOTING 4.16 Ear-Mic Headset HSOR/HSOL Trouble Shooting START Ear-Mic Headset has a Check the resistance between problem. HSOR/L & GND of the Headset. Exchange the Ear-Mic 16 0hm 15%? Headset Disassemble the rear case of phone. Connect the Ear-Mic Headset to the Ear- Mic Socket.
  • Page 96 4. TROUBLE SHOOTING z Ear-Mic Headset Operation scheme is shown below. VRIO VBAT VCHG_IN HOOK_DETECT C301 120p HSO_L HSO_R HSMICBIAS R310 C302 C303 C304 C305 120p VRIO R311 C306 C307 HSMICIP L304 C310 VA301 100nH 120p EVLC14S02050 CN301 R314 JACK_TYPE JACK_DETECT - 97 -...
  • Page 97: Fm-Radio Trouble Shooting

    4. TROUBLE SHOOTING 4.17 FM-Radio Trouble Shooting START Go to the Power Trouble Check the VRABB Voltage(2.8V) shooting O.K? Check the soldering status Of C315(Main) Replace the C315(Main) O.K? Check 32.768kHz signal Check the signal of C314, C316 @ C321 Can you see a signal? Can you see a signal? Go to the speaker/...
  • Page 98: Transflash Trouble Shooting

    4. TROUBLE SHOOTING 4.18 Transflash Trouble Shooting z Transflsh Operation scheme is shown below. VRMMC S100 SCHA1B0102 C100 DAT2_RSV TF_DAT2 R101 CD_DAT3_CS TF_DAT3 R100 CMD_DI TF_CMD R102 R101 CLK_SCLK R103 TF_CLK S100 R102 DAT0_DO TF_DAT0 DAT1_RSV TF_DAT1 DETECT COMMON C100 C101 DUMMY1 R103...
  • Page 99 4. TROUBLE SHOOTING z VRMMC Signal(Power ON) <VRMMC Signal when T-Flash is inserted> z TF_DAT0 Signal (Music Play) <TF_DAT0 Signal while T-Flash is read> - 100 -...
  • Page 100: Main Key Backlight Led Trouble Shooting

    4. TROUBLE SHOOTING 4.19 Main Key Backlight LED Trouble Shooting z Keypad backlight LED Operation scheme is shown below. VBAT MAIN_KEY_BL_EN Q501 z Backlight operation - Keypad backlight LED is controlled with MAIN_KEY_BL_EN signal - MAIN_KEY_BL_EN signal from DBB(U102) - The LEDs are forward biased and turned on z Check Point - VBAT level ( 3.35 ~4.2V) - LEDs...
  • Page 101 4. TROUBLE SHOOTING z MAIN KEY Backlight LED Trouble START Is the Voltage level VBAT Charge Battery 3.35 ~4.2? Are all LEDs Check the soldering of each LED100 ~108(Main key) R or Replace LESs not Working? working Check the condition of Q100(Main key) is Q100 Working?
  • Page 102: Slide Key Backlight Led Trouble Shooting

    4. TROUBLE SHOOTING 4.20 Slide Key Backlight LED Trouble Shooting z Slide backlight LED Operation scheme is shown below. VBAT R103 R104 R134 LED100 R103 LED101 R103 LED100 LED101 R134 LED_ABC z Slide Backlight operation - Slide backlight LED is controlled with LED_ABC signal - LED_ABC signal from ABB(U102) - The LEDs are forward biased and turned on z Check Point...
  • Page 103: Vibrator Trouble Shooting

    4. TROUBLE SHOOTING 4.21 Vibrator Trouble Shooting z Vibrator operation scheme is shown below R104 100nH OUT100 VIBRATOR R105 R104 R105 100nH R105 OUT101 OUT100 OUT101 CN100 VBACKUP Soldering check VIBRATOR TF_DAT2 TF_DAT1 TF_DAT3 TF_DAT0 CN100(Main-Sub) TF_CMD TF_CLK z Vibrator Trouble START ABB(U101) has a problem.
  • Page 104: Downloading Software

    5. Downloading Software 5. Downloading Software 5.1 The purpose of downloading software 5.1.1 To make a phone operate at the first manufacturing - A phone = Hardware + Software - A phone cannot operate with hardware alone. - The hardware with the suitable software can operate properly. 5.1.2 To upgrade the software of the phone - The software of the phone may be changed to enhance the performance of the phone.
  • Page 105 5. Downloading Software 5.2.2 In case of using the PIF( MON Port) ME550c Handset PC with RS-232 POWER SUPPLY a. Preparation - Target Handset (ME550c) - PIF - RS-232 Cable and PIF-to-Phone interface Cable - Power Supply or Battery b. IBM compatible PC supporting RS-232 with Windows 98 or newer If you use battery, you should have a battery with the voltage above 3.7V.
  • Page 106: Download Procedure

    5. Downloading Software 5.3 Download Procedure 5.3.1 Computer Program file -> MultiGSM.EXE Click 1. Copy "GSMULTI" Folder. Paste in " C:\" 2. Execute "GSMULTI.reg file" Registered at PC > 3. "MultiGSM.exe" execution file - 107 -...
  • Page 107 5. Downloading Software 5.3.2 Click the “Setting” button. Then, choose Configuration which is going to download. 4. Munu "Setting" -> "Configuration" - 108 -...
  • Page 108 5. Downloading Software 5.3.3 Computer Program file -> MultiGSM.EXE Click 5. Configuration : select values like below C;\GSMULTI\MODEL\KE500\KE500.dll Phone software select( *.cab file) Download speed Start Comport END Comport Frame count select internal Boot - 109 -...
  • Page 109 5. Downloading Software 5.3.4 Computer Program file -> MultiGSM.EXE Click 6. Press the " START" button - 110 -...
  • Page 110 5. Downloading Software 5.3.5 After “Start Button”, Which Stand-by condition > > 7. Stand-by condition "TI(EX) : Wait ASIC" is displayed connect the Phone - 111 -...
  • Page 111 5. Downloading Software 5.3.6 SW downloading condition Downloading : Start - 112 -...
  • Page 112 5. Downloading Software 5.3.7 SW downloading END condition Downloading : END - 113 -...
  • Page 113: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM ME550c Block Diagram (Baseband) SPK_AMPN SPK_AMPP RCV_PP RCV_NN VIBRATOR VBACKUP CHG_EN BT_NRST UART2_RX UART2_TX TR_USB_DM TR_USB_DP SPK_AMPP SPK_AMPN - 114 -...
  • Page 114 6. BLOCK DIAGRAM ME550c Block Diagram (Baseband) - 115 -...
  • Page 115 6. BLOCK DIAGRAM - 116 -...
  • Page 116: Circuit Diagram

    1.3 / 1.4 / 1.05 Checked VRMEM VRDBB VRIO DRAWING ABB/DBB VREXTH 1.8 / 200@1.8V NAME 100@2.8V Approved N.A. VREXTL 1.3/1.05 200@1.3V 1.8 / 2.8 100@1.8~2.8V Q101 DTC144EM-T2L DRAWING LG Electronics Inc. Iss. Notice No. Date Name - 117 -...
  • Page 117 33nH Sheets MODEL C219 VIBRATOR ME550c MAIN 01/24 C220 Designer 100p TF_DAT2 TF_DAT1 2007 VRMMC TF_DAT3 TF_DAT0 RCV_N RCV_NN Checked L202 33nH DRAWING TF_CMD C221 MEMORY / T-FLASH / SIM NAME TF_CLK Approved DRAWING LG Electronics Inc. - 118 -...
  • Page 118 ME550c MAIN TP305 01/24 JTAG_TRST Designer TP306 JTAG_TDI 2007 TP307 R333 JTAG_TMS TP308 USB_BOOT_SEL JTAG_TCK TP309 JTAG_RTCK Checked R334 Q301 TP310 DRAWING VBUS BOOT_SEL JTAG_TDO IO CONNECTOR & UART 2SC5585 R335 NAME Approved DRAWING LG Electronics Inc. - 119 -...
  • Page 119 0.1u PGND C434 C435 Section Date Sign & Name Sheet/ 0.01u 2.2u Sheets MODEL ME550c MAIN 01/24 Designer 2007 REGEN C_VCCRF Checked DRAWING TPS79928DRVR U406 RF_RENESAS NAME Approved PGND C436 C437 0.01u 2.2u DRAWING LG Electronics Inc. - 120 -...
  • Page 120 Section Date Sign & Name Sheet/ Sheets MODEL ME550c Main Key 01/23 MAIN_KEY_BL_EN Designer 2007 Checked DRAWING MIC & SIM & KeyLED & B/T & Batt.Conn. NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. - 121 -...
  • Page 121 R212 Section Date Sign & Name Sheet/ Sheets MODEL ME550c Main Key V_28 VRIO 01/23 Designer 2007 C200 C201 Checked DRAWING FM & CONN & KEY NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. - 122 -...
  • Page 122 OUT101 VBACKUP 3V/1mAh C102 0.1u Section Date Sign & Name Sheet/ Sheets MODEL ME550c MAIN-SUB 01/02 Designer 2007 Checked DRAWING T-FLASH / RTC Batt. / MOTOR NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. - 123 -...
  • Page 123 R145 ISINK4 LCD_BL_EN EN_SET C114 C115 C116 C117 Checked DRAWING U104 R132 AAT2805IXN-4.5-T1 ChargePump & LDO & LED & CONN. NAME 100K Approved CHARGE PUMP 3LED(60mA) + FLASH(300mA) DRAWING Iss. Notice No. Date Name LG Electronics Inc. - 124 -...
  • Page 124 KBR(5) VBAT KBC(0) KBC(1) KBC(2) Section Date Sign & Name Sheet/ KBC(3) Sheets MODEL KBC(4) VBATS ME550c MAIN FPCB 02/07 BATT_TEMP Designer MAIN_KEY_BL_EN 2007 Checked DRAWING NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. - 125 -...
  • Page 125 7. CIRCUIT DIAGRAM CAM/PWR SIDEKEY (PWON) (CAM) PWON KBC(2) (CAM) KBR(3) Section Date Sign & Name Sheet/ Sheets ME550c MODEL Designer Checked DRAWING SIDEKEY_FPCB NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. LG Electronics Inc. - 126 -...
  • Page 126 7. CIRCUIT DIAGRAM VOLUME SIDEKREY (UP) (DOWN) KBR(3) KBC(0) (UP) KBC(1) (DOWN) Section Date Sign & Name Sheet/ Sheets MODEL ME550c Designer Checked DRAWING SIDEKEY_FPCB NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. LG Electronics Inc. - 127 -...
  • Page 127: Pcb Layout

    8. PCB LAYOUT - 128 -...
  • Page 128 8. PCB LAYOUT - 129 -...
  • Page 129 8. PCB LAYOUT - 130 -...
  • Page 130 8. PCB LAYOUT - 131 -...
  • Page 131 8. PCB LAYOUT - 132 -...
  • Page 132 8. PCB LAYOUT - 133 -...
  • Page 133 8. PCB LAYOUT - 134 -...
  • Page 134 8. PCB LAYOUT - 135 -...
  • Page 135 8. PCB LAYOUT - 136 -...
  • Page 136 8. PCB LAYOUT - 137 -...
  • Page 137 - 138 -...
  • Page 138: Rf Calibration

    9. RF Calibration 9. RF Calibration 9.1 What’s the Rx Calibration? 9.1.1 Find proper AGC Gain to make the same Rx Power fed into the Base Band Part regardless of Antenna Input Level 9.1.2 Can make report correct RSSI level Part X(Input Level)+G(Gain)=Y 9.2 What’s the Tx Calibration?
  • Page 139: Calibration Program - Hot_Kimchi

    9. RF Calibration 9.3 Calibration program - HOT_KIMCHI 9.3.1 Calibration Program (HOT_KIMCHI) - Under windows 2k or XP - PIF JIG Support Agilent 8960 Test Set 9.3.2 Required Equipments - Test PC with PCMCIA slot - GPIB card - E5515C(Agilent 8960 series) - Power supply - 140 -...
  • Page 140 9. RF Calibration 9.3.3 Calibration Equipment Setup - 141 -...
  • Page 141 9. RF Calibration 9.3.4 Calibration program - HOT_KIMCHI 9.3.4.1 Open the HOT_KIMCHI folder 9.3.4.2 Execute Program (HOT_KIMCHI) - 142 -...
  • Page 142 9. RF Calibration 9.3.4.3 Set the “SETTING” menu 9.3.4.4 Click the “START” LOGIC MODE 1. CAL ONLY 2. AUTO ONLY 3. CAL + AUTO - 143 -...
  • Page 143 9. RF Calibration 9.3.4.5 Check “[TEST RESULT] : PASS” - 144 -...
  • Page 144: Exploded View & Replacement Part List

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.1 EXPLODED VIEW 35 36 31 32 12 13 - 145 -...
  • Page 145 - 146 -...
  • Page 146: Replacement Parts

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark GSM(SLIDE) TGLL0011204 Silver AAAY00 ADDITION AAAY0238301 Silver...
  • Page 147 COMPLEX, (empty), , , , , Silver MTAZ02 TAPE MTAZ0183901 COMPLEX, (empty), , , , , Silver COVER ASSY, ACGS00 ACGS0011301 KE500 FRASV SLIDE UPPER ASSY Silver SLIDE(UPPER) MCJW00 COVER,SLIDE(UPPER) MCJW0011901 MOLD, PC LEXAN EXL4419, , , , , Silver MDAL00 DECO,WINDOW MDAL0007901 PRESS, STS, 0.3T, , , ,...
  • Page 148 CAP,MOBILE SWITCH MCCF0042101 COMPLEX, (empty), , , , , Silver MLAK00 LABEL,MODEL MLAK0006901 ADCA00 DOME ASSY,METAL ADCA0063601 KE500 FRASV MAIN KEY METAL DOME ASSY Silver MCBA00 CAN,SHIELD MCBA0016201 PRESS, STS, , , , , Silver SC100 CAN,SHIELD MCBA0016301 PRESS, STS, , , , ,...
  • Page 149 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MLAZ00 LABEL MLAZ0038301 PID Label 4 Array Color - 150 -...
  • Page 150: Main Component

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Main component> Location Level Description Part Number Specification Color Remark SMZY00 MODULE,ETC SMZY0014203 512MB MicroSD 3.0 ,-2.0 dBd,, ,internal, GSM900/1800/1900 ,;...
  • Page 151 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R105 RES,CHIP,MAKER ERHZ0000473 39 ohm,1/16W ,J ,1005 ,R/TP R106 RES,CHIP,MAKER ERHZ0000473 39 ohm,1/16W ,J ,1005 ,R/TP R107 RES,CHIP,MAKER ERHZ0000473 39 ohm,1/16W ,J ,1005 ,R/TP R108 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 152 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C112 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP C113 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP C114 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C115 CAP,CHIP,MAKER ECZH0003202...
  • Page 153 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VA100 VARISTOR SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free VA101 VARISTOR SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free VA102 VARISTOR SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free VA103 VARISTOR...
  • Page 154 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C111 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP C112 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C115 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C116 CAP,CERAMIC,CHIP ECCH0006201...
  • Page 155 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R203 RES,CHIP,MAKER ERHZ0000420 150 ohm,1/16W ,J ,1005 ,R/TP R204 RES,CHIP,MAKER ERHZ0000420 150 ohm,1/16W ,J ,1005 ,R/TP R205 RES,CHIP,MAKER ERHZ0000420 150 ohm,1/16W ,J ,1005 ,R/TP R206 RES,CHIP,MAKER ERHZ0000420 150 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 156 PCB ASSY,MAIN,INSERT SAFB0069501 SAJY00 PCB ASSY,SUB SAJY0023001 Silver SAJB00 PCB ASSY,SUB,INSERT SAJB0010201 Silver Without AFBA00 FRAME ASSY,SHIELD AFBA0006801 KE500 FRASV SHIELD FRAME ASSY Color SJMY00 VIBRATOR,MOTOR SJMY0008401 3 V,80 mA,10*2.7 ,17mm SAJE00 PCB ASSY,SUB,SMT SAJE0017401 Silver PCB ASSY,SUB,SMT SAJC00 SAJC0015801 Silver...
  • Page 157 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C106 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP C107 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP C301 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP C302 CAP,CERAMIC,CHIP ECCH0000129...
  • Page 158 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C411 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C412 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C413 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C414 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C415 CAP,CHIP,MAKER ECZH0000830...
  • Page 159 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R113 RES,CHIP ERHY0009560 33 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP R114 RES,CHIP ERHY0009303 10 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP R115 RES,CHIP ERHY0009536 100 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP R306 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP...
  • Page 160 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R419 INDUCTOR,CHIP ELCH0003826 3.3 nH,S ,1005 ,R/TP ,chip R420 INDUCTOR,CHIP ELCH0004703 1 nH,S ,1005 ,R/TP , SW401 CONN,RF SWITCH ENWY0003301 ,SMD ,0.4 dB, DFN 3*3*0.9 ,10 PIN,R/TP ,Charger IC, I Max 1A, Wall U102 EUSY0254701 Adaptor/USB Charger...
  • Page 161 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C118 CAP,CERAMIC,CHIP ECCH0009201 47 nF,6.3V ,K ,X5R ,TC ,0603 ,R/TP C119 CAP,CERAMIC,CHIP ECCH0009508 47 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP C120 CAP,CHIP,MAKER ECZH0001106 4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP C121 CAP,CHIP,MAKER ECZH0000826...
  • Page 162 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C154 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP C155 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP C157 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP C201 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 163 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L102 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP , L103 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP , L104 INDUCTOR,SMD,POWER ELCP0009403 2.2 uH,M ,2.8*2.6*1 ,R/TP ,power inductor L201 INDUCTOR,CHIP ELCH0005006...
  • Page 164 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R203 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R204 RES,CHIP,MAKER ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP R205 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R290 RES,CHIP ERHY0009501 0 ohm,1/20W(0.05W) ,J ,0603 ,R/TP...
  • Page 165: Accessory

    BATT, Pb-Free ,; ,3.7 ,800 ,0.2C ,PRISMATIC ,50x34x38 , POLYMER ,TITAN SILVER ,Hard Pack ,Latin America Label SGDY00 DATA CABLE SGDY0010901 LG-US03K ,18pin USB DataCable ; ,. ,. ,. ,. ,. ,[empty] ,[empty] ,18P MMI CONNECTOR SGEY00 EAR PHONE/EAR MIKE SET SGEY0003615 ,SILVER COLOR...
  • Page 166 Note...
  • Page 167 Note...

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