Sharp DV-RW550U Service Manual page 9

How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
(1) Prepare the hot-air flat pack-IC desoldering ma-
chine, then apply hot air to the Flat Pack-IC (about 5
to 6 seconds). (Fig. S-1-1)
(2) Remove the flat pack-IC with tweezers while apply-
ing the hot air.
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Caution:
1. Do not supply hot air to the chip parts around the flat
pack-IC for over 6 seconds because damage to the
chip parts may occur. Put masking tape around the
flat pack-IC to protect other parts from damage.
(Fig. S-1-2)
2. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each pin
or the solder lands under the IC when removing it.
CBA
Masking
Tape
Tweezers
With Soldering Iron:
(1) Using desoldering braid, remove the solder from all
(2) Lift each lead of the flat pack-IC upward one by one,
Fig. S-1-1
(3) Bottom of the flat pack-IC is fixed with glue to the
(4) Release the flat pack-IC from the CBA using twee-
Hot-air
Flat Pack-IC
With Iron Wire:
Desoldering
Machine
(1) Using desoldering braid, remove the solder from all
(2) Affix the wire to a workbench or solid mounting point,
Flat Pack-IC
(3) While heating the pins using a fine tip soldering iron
Fig. S-1-2
1-4-2
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you can
remove it easily. (Fig. S-1-3)
Flat Pack-IC
using a sharp pin or wire to which solder will not
adhere (iron wire). When heating the pins, use a fine
tip soldering iron or a hot air desoldering machine.
(Fig. S-1-4)
Fine Tip
Soldering Iron
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
zers. (Fig. S-1-6)
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you can
remove it easily. (Fig. S-1-3)
as shown in Fig. S-1-5.
or hot air blower, pull up the wire as the solder melts
so as to lift the IC leads from the CBA contact pads
as shown in Fig. S-1-5.
Desoldering Braid
Soldering Iron
Fig. S-1-3
Sharp
Pin
Fig. S-1-4
DVR_NOTE