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LG U310 Service Manual

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U310 SVC ENG_Cover_1003
2006.10.3 7:44 PM
˘
` 1
Service Manual
U310
Date: October, 2006 / Issue 1.0

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Summary of Contents for LG U310

  • Page 1 U310 SVC ENG_Cover_1003 2006.10.3 7:44 PM ˘ Service Manual U310 Date: October, 2006 / Issue 1.0...

  • Page 2: Table Of Contents

    3.9. External memory interface ....41 Test Program ........155 3.10. H/W Sub System.........42 9.1 Configuration of HOT KIMCHI .....155 3.11 LG-U310 Main features......66 9.2 How to use HOT KIMCHI.....159 9.3 Example for using HOT KIMCHI ....160 4. TROUBLE SHOOTING ....72 4.1 RF Component........72 10.
  • Page 3 - 4 -...

  • Page 4: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 5 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 6: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Specification Shape GSM900/1800/1900 and WCDMA Folder Handset Size 93.7 X 49.0 X 18.6 mm Weight 87 g (with 800mAh Battery) Power 4.0V normal, 800 mAh Li-Polymer Talk Time Over 125 min (WCDMA, Tx=12 dBm, Voice) (with 800mAh) Over 160 min (GSM, Tx=Max, Voice) Standby Time...

  • Page 7: Usable Environment

    2. PERFORMANCE 2.2 Usable environment 1) Environment Item Specification Voltage 4.0 V(Typ), 3.38 V(Min), [Shut Down : 3.28 V] Operation Temp -20 ~ +60°C Storage Temp -20 ~ +70°C Humidity 85 % (Max) 2) Environment (Accessory) Reference Spec. Typ. Unit TA Power Available power * CLA : 12 ~ 24 V(DC)
  • Page 8 2. PERFORMANCE Item DCS & PCS 30M~1GHz -36dBm 30M ~ 1GHz -36dBm MS allocated 1G~[A]MHz -30dBm Channel [A]M~[B]MHz -36dBm 1G ~ 4GHz -30dBm Radiated [B]M~4GHz -30dBm Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm 915M~1GHz -57dBm 915M~1GHz...
  • Page 9 2. PERFORMANCE Item DCS & PCS Frequency offset 800kHz Intermodulation product should Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) ±3 ±3 ±3 ±3...
  • Page 10 2. PERFORMANCE 2) Transmitter - WCDMA Mode Item Specification Class 3 : +24dBm(+1/-3dB) Maximum Output Power Class 4 : +21dBm(±2dB) Frequency Error ±0.1ppm Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) +0.5/1.5 +1/3 +1.5/4.5 Inner Loop Power control in uplink -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3...
  • Page 11 2. PERFORMANCE Item Specification 33dB@5MHz, ACP>-50dBm Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW (*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc...
  • Page 12 2. PERFORMANCE 4) Receiver - WCDMA Mode Item Specification Reference Sensitivity Level -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB Adjacent Channel Selectivity (ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3)

  • Page 13: Current Consumption

    2. PERFORMANCE 2.4 Current Consumption Stand by Voice Call Under 4.0 mA Under 384 mA Under 533mA WCDMA (DRX=1.28) (Tx=12dBm) (Tx=12dBm) Under 4 mA (Paging=5period) Under 300 mA Under 5.7 mA (@Bluetooth (Tx=Max) Connected, Paging=5period) (Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight Off) (VT Test Condition : Speaker off, LCD backlight On) 2.5 RSSI BAR Level Change...

  • Page 14: Sound Pressure Level

    2. PERFORMANCE 2.7 Sound Pressure Level Test Item Specification Sending Loudness Rating (SLR) 8 ±3 dB -4 ± 3 dB Receiving Loudness Rating (RLR) -15 ± 3 dB Side Tone Masking Rating (STMR) 17 dB Echo Loss (EL) 40 dB Idle Noise-Sending (INS) -64 dBm0p Under -47 dBPA...

  • Page 15: Charging

    2. PERFORMANCE 2.8 Charging • Charging Method : CC & CV (Constant Current and Constant Voltage) • Maximum Charging Voltage : 4.2 V • Maximum Charging Current : 600 mA • Normal Battery Capacity : 800 mAh • Charging Time : Max 3 hours (except for trickle charging time) •...

  • Page 16: Technical Brief

    3. TECHNICAL BRIEF 3. RF TECHNICAL BRIEF 3.1 General Description The U310 supports UMTS-2100 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900. All receivers and the UMTS transmitter use the radioOne Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The EGSM, DCS1800 and PCS1900 transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.
  • Page 17 3. TECHNICAL BRIEF A generic, high-level functional block diagram of U310 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a switch module (plus a duplexer for UMTS-2100 operation).
  • Page 18 3. TECHNICAL BRIEF U310 power supply voltages are managed and regulated by the PM6650 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

  • Page 19: Gsm Mode

    3.2 GSM Mode 3.2.1 GSM Receiver The Dual-mode U310’s receiver functions are split between the two RFICs as follows: • UMTS-2100 operation uses the RFR6250 Receiver ICs to implement the receive signal path, accepting an RF input and delivering analog baseband outputs (I and Q).
  • Page 20 3. TECHNICAL BRIEF - 21 -...

  • Page 21: Gsm Transmitter

    3. TECHNICAL BRIEF 3.2.2 GSM Transmitter The shared GSM Low-band (EGSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6250A IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250.

  • Page 22: Wcdma Mode

    3. TECHNICAL BRIEF The waveform at the dual Tx VCO output is the GMSK-modulated signal centered at the desired GSM channel frequency. A phase-locked loop circuit is used to translate the GMSK-modulated signal from IF to RF primarily for two reasons: 1.
  • Page 23 3. TECHNICAL BRIEF The amplifier output drives the RF port of the quadrature RF-to-baseband down-converter. The down-converted baseband outputs are routed to low-pass filters (one I and one Q) having pass- band and stop-band characteristics suitable for DS-WCDMA processing. The filter outputs are buffered and passed on to the MSM6250A IC for further processing.
  • Page 24 PA. Between The PA device output and Duplexer input U310 has directional coupler. And this device in U310 needs not to use isolator. Transmit power is delivered from the duplexer to the antenna through the switch module.

  • Page 25: Lo Phase-Locked Loop

    3. TECHNICAL BRIEF 3.4 LO Phase-locked Loop Most LO functions are fully integrated on-chip, do not require user adjustment, and need not be considered by handset designers. QUALCOMM has established and implemented frequency plans and LO generation schemes that support the radioOne 6250-IIseries chipset while requiring minimal off-chip design effort.
  • Page 26 3. TECHNICAL BRIEF The VCO output drives LO generation and distribution circuits (within the RFR6250 IC) to create the necessary LO signals for Rx quadrature down-converter for either UMTS band. By definition, a Zero-IF down-converter requires FRF equal to FLO, and the RFR6250 design achieves this without allowing FVCO to equal FRF.

  • Page 27: Off-Chip Rf Components

    A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include: -. Insertion loss . this component is also in the receive and transmit paths; In the U310 typical losses: UMTS Tx = 1.5 dB, UMTS Rx = 2.3 dB.
  • Page 28 3. TECHNICAL BRIEF 3.5.3 UMTS Power Amplifier (U1002) The WS2512TR1G meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6250 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of- the-art reliability, temperature stability, and ruggedness.
  • Page 29 Its detector coupling range and converted voltage is based on diode sensitivity and transmitter power level. The U310 uses National Semiconductor LMV228TLX power detector IC. In Figure 3.5.5-1, Directional coupler is set to 18dB tab coupling. The output voltage is proportional to the logarithm of the input power.
  • Page 30 3. TECHNICAL BRIEF 3.5.6 Dual band GSM power amplifier (U1001) The SKY77318 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for tri-band cellular handsets comprising GSM900, DCS1800, and PCS1900 operation. The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The module consists of separate GSM900 PA and DCS1800/PCS1900 PA blocks, impedance- matching circuitry for 50 Ω...
  • Page 31 3. TECHNICAL BRIEF 3.5.7 GSM transmit VCO (X1000) The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts PLL and transmitter performance. VCO specifications refer to muRata MQW6V0C869M datasheet. The dual Tx VCO outputs, one for Low-band GSM and one for high band, drive a resistive network that splits the active signal into two signals: 1) the input to the active PA .
  • Page 32 3.5.10 Bluetooth (U703 : RB04,ANT700) The MSM6250A includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure.3.5.10-1 shows the Bluetooth system architecture in the U310. - 33 -...
  • Page 33 3. TECHNICAL BRIEF Figure 3.5.10-1 Bluetooth system architecture - 34 -...

  • Page 34: Digital Baseband(Dbb/Msm6250A)

    3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Digital Baseband(DBB/MSM6250A) 3.6.1 General Description A. Features(MSM6250A) • The ARM926EJ-S microprocessor can operate at up to 180 MHz with variable rate, software controlled clocks to provide greater standby time. • Integrated PLL to provide additional on-chip clock frequencies •...

  • Page 35: Hardware Architecture

    3. TECHNICAL BRIEF 3.7 Hardware Architecture Dual LCD (2.0 inch) 900/1800/ 1900 Camera Q_VCO 1.3M PCS1900_Rx USIM DCS1800_Rx RTR6250D GSM900_Rx Stereo Head UMC4N Phone MIDI Mono MSM6250A Analog Speaker Acoustic /Receiver VCTCXO Coupler HDET SDRAM NAND Flash RFR6250E Trans Flash Card BATT PM6650- I/O Conn...
  • Page 36 3. TECHNICAL BRIEF 3.7.1. Block Diagram(MSM6250A) HK ADC USB I/F 19.2M UART General Purpose GSM/ UMTS GPRS NAND & Processor SDRAM Tx/Rx I/Q Tx/Rx I/F SBI for PM6650 Stereo Speaker VOCODER CODEC Receiver SBI for RF IC USIM J-TAG I/F Controller Figure.

  • Page 37: Subsystem(Msm6250A)

    3. TECHNICAL BRIEF 3.8. Subsystem(MSM6250A) 3.8.1. ARM Microprocessor Subsystem The MSM6250A device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, and ROM devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6250, RFR6200, RFL6200, and PM6650-2M devices.

  • Page 38: Wideband Codec

    3. TECHNICAL BRIEF 3.8.6. Wideband CODEC The MSM6250A device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface on two single-ended earphone output.
  • Page 39 3. TECHNICAL BRIEF 3.8.10. UART There are three UARTs in the MSM6250A ASIC: • UART1 for data • UART2 (can be used for USIM interface) • UART3 (can be used for PM SBI interface) 3.8.11. USB The MSM6250A device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces.

  • Page 40: External Memory Interface

    • 1-CS(Chip Select) are used Interface Spec Device Part Name Maker Read Access Time Write Access Time FLASH TY90009800COGG Toshiba 35 ns/Bytes 50 ns/Bytes SDRAM TY90009800COGG Toshiba 107 ns/4Double Word 53 ns/4Double Word Table External memory interface for U310 - 41 -...

  • Page 41: H/W Sub System

    3. TECHNICAL BRIEF 3.10. H/W Sub System 3.10.1. RF Interface A. RTR6250D(WCDMA_Tx, GSM_Tx/Rx) MSM6250A controls RF part(RTR6250) using these signals. • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • PAON : Power AMP on RF part • RX_I/Q,TX_I/Q : I/Q for T/Rx of RF •...
  • Page 42 3. TECHNICAL BRIEF B. RFR6250E(WCDMA_Rx) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • RX_I/Q, : I/Q for Rx of RF C. the others • GSM_PA_BAND : DCS/GSM Band Selection of Power Amp • TRK_LO_ADJ : TCXO(19.2M) Control • PA_ON : WCDMA TX Power Amp Enable •...

  • Page 43: Msm Sub System

    3. TECHNICAL BRIEF 3.10.2. MSM Sub System 3.10.2.1. SIM Interface SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data T/Rx USIM CLK VREG_USIM 2.85V USIM CLK USIM Reset...
  • Page 44 3. TECHNICAL BRIEF 3.10.2.3. USB efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6250A was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification, Revision 2.0.
  • Page 45 3. TECHNICAL BRIEF 3.10.2.4. HKADC(House Keeping ADC) The MSM6250A device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6250A device has six analog input pins which are multiplexed to the input of the internal HKADC.

  • Page 46: Power Block

    3. TECHNICAL BRIEF 3.10.3. Power Block 3.10.3.1. General MSM6250A, included RF, is fully covered by PM6650-2M(Qualcomm PMIC). PM6650-2M cover the power of MSM6250A, MSM memory, RF block, Bluetooth, Trans flash, USIM and TCXO. Major power components are : PM6650-2M(U400) : Phone power supply BH28FB1WHFV(U505) : LCD Power supply QST4(Q400,Q401) : External charger supply switching SI3493DV(Q402) : Main Battery charging control...
  • Page 47 3. TECHNICAL BRIEF Figure. PM6650-2M Functional Block Diagram - 48 -...
  • Page 48 These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively. 3.45V~3.25V 3.71V~3.64V 3.63V~3.46V 4.2V~3.80V 3.79V~3.72V 2~0 (%) 40~21 (%) 20~3 (%) 100~63 (%) 62~41 (%) U310 Battery Bar Display - 49 -...
  • Page 49 3. TECHNICAL BRIEF 3.10.3.3.1. Trickle Charging Trickle Charging of the main battery, enabled through SBI control and powered from V , is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from V to pin (VBAT).
  • Page 50 3. TECHNICAL BRIEF 3.10.3.3.2. Constant Current Charging The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. 3.10.3.3.3.

  • Page 51: Key Pad

    3. TECHNICAL BRIEF 3.10.4. Key Pad There are 26 buttons and 3 side keys in Figure. Shows the Keypad circuit. ‘END’ Key is connected On_SW to PMIC(PM6650-2M) and MSM(GPIO76). COL0 COL1 COL2 COL3 COL4 COL5 HOT1 HOT2 HOT3 Side key ROW0 FUNC_1 (VT)
  • Page 52 3. TECHNICAL BRIEF VREG_MSMP_2.7V RA600 R606 HOT601 HOT602 HOT603 MENU MENU KEY_ROW(0) LEFT LEFT KEY_ROW(1) RIGHT RIGHT KEY_ROW(2) SEARCH SEARCH KEY_ROW(3) HOT604 HOT605 BACK KEY_COL(0) HOT4 HOT5 BACK KEY_ROW(4) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4) SIDE_KEY R600 VOL UP KEY_ROW(2) 100ohm PRSB6.8C VA600 R602 VOL DN...

  • Page 53: Camera Interface

    3. TECHNICAL BRIEF 3.10.5 Camera Interface U310 Installed a 1.3M Pixel CMOS VGA Camera. Below figure show the camera board to board connector and camera I/F signal. HB-1M1005-600JT CAM_MCLK FB500 VA500 EVLC18S02015 CONNECTOR 2.2K R500 VREG_DODD_2.7V I2C_SCL 24-5602-024-000-829 VA501 R501 2.2K...
  • Page 54 3. TECHNICAL BRIEF The Camera module is connected to main board with 24pin Board to Board connector (AXK7L24227). Its interface is dedicated camera interface port in MSM6250A. The camera port supply 24MHz master clock to camera module and receive 12MHz pixel clock (30fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.
  • Page 55 3. TECHNICAL BRIEF 3.11.6 Folder ON/OFF Operation There is a magnet to detect the folder status, opened or closed. If a magnet is close to the hall-effect switch, the voltage at pin1 of U600 goes to 0V. Otherwise, 2.6V. This folder signal is delivered to MSM6275 GPIO43. FOLDER_SENSE U600 R601...

  • Page 56: Camera Direction Detection

    3. TECHNICAL BRIEF 3.10.7. Camera Direction Detection CAM_SENSE detects the Camera Direction (front or back) CAM_SENSE R709 U705 VREG_MSMP_2.7V MRSS32W_L CAM_SENSE C721 C720 0.1u Figure Camera Direction Detection - 57 -...

  • Page 57: Keypad Light

    3. TECHNICAL BRIEF 3.10.8. Keypad Light There is Backlight LED on Top side in board backlight circuit, which is driven by KYPD_BACKLIGHT line from PM6650-2M. Key Pad backlight controlled by PM6650-2M. Figure. Backlight LED - 58 -...

  • Page 58: Lcd Module

    3. TECHNICAL BRIEF 3.10.9. LCD Module Vibrator MAIN Vibrator Back MODULE Light LOUD SPK /Receiver Figure. LCD Module Block Diagram MAIN LCD MODULE SUB LCD MODULE 260K Color TFT 176 * 220 Pixel 65K Color TFT 96 * 96 Pixel S1D19501 Graphic Controller Driver(Main) Graphic Controller Driver( LGDP4123...
  • Page 59 3. TECHNICAL BRIEF 3.10.10.1. Display & LCD FPC Interface LCD module is connected to Main board with 50-pin BtoB connector (CN600_AXT450164) and Speaker, Receiver, Vibrator are connected by soldering the leads to pads in LCD FPCB module. The LCD is controlled by 16-bit EBI2 in MSM6250 1 : NC 26 : GND 2 : VREG_LCD_2.8V : LCD Power...
  • Page 60 3. TECHNICAL BRIEF 3.10.11. Audio and Sound 3.10.11.1. Overview of Audio & Sound path SUB b'd Head Set Conn. Jack Head_Set LCD Conn Module MSM6250A Receiver/Speaker (U200) LCD Conn Module Receiver/Speaker SUB b'd Head Set Head_set MIC Conn. Jack Figure Audio & Sound Path Block Diagram - 61 -...
  • Page 61 3. TECHNICAL BRIEF 3.10.11.2. Audio Signal Processing & Interface Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (MSM6250A). This transmitted signal is reformed to fit in GSM & WCDMA Frame format and delivered to RF Chip.
  • Page 62 3. TECHNICAL BRIEF MSM6250A BLK MIC_Feedback AUDIO Near to MSM MICFBP MICINN C200 0.1u C201 0.1u R205 MICOUTP 180K C202 0.015u R207 470K C212 0.015u C213 0.1u C214 0.1u R210 MICOUTN 180K MICINP MICFBN MICBIAS R511 VREG_MSMP_2.7V C528 0.01u R516 Head Set Jack BLK VIN- EAR_MIC2P...
  • Page 63 3. TECHNICAL BRIEF Handset main MIC BLK MICBIAS C500 C502 SP0102BE3 C504 U500 MIC1N C507 C506 MIC1P Audio Amp for loud Speaker Audio AMP C527 100p C530 R515 R518 MID_SPK+ 0.068u U508 MAX9716ETA _SHDN SPK_AMP_EN VREG_5V C535 OUT- AMP_SPK- BIAS OUT+ AMP_SPK+ C539...

  • Page 64: Trans Flash

    3. TECHNICAL BRIEF 3.10.12. Trans Flash MSM6250 BLK BT_SBCK_GPIO[23] BT_SBDT_GPIO[22] BT_TX_RN_N_GPIO[21] BT_DATA_GPIO[20] C247 0.1u MicroSD CAMERA Trans Flash BLK T-FLASH SOCKET VREG_MMC_3.0V S500 1827034-1 DAT2_RSV CD_DAT3_CS MMC_CD CMD_DI MMC_CMD CLK_SCLK MMC_CLK DAT0_DO MMC_DATA DAT1_RSV C524 0.1u - 65 -...

  • Page 65: Lg-U310 Main Features

    3. TECHNICAL BRIEF 3.11 LG-U310 Main features 1. LG-U310 Main features - Folder Type - WCDMA(2100) + GSM(900,1800) + PCS(1900) Triple mode - Dual color LCD(Main:260K TFT, Sub:65K OLED) - 1.3M Pixel CMOS VGA Camera - 17 pi Stereo speaker...
  • Page 66 3. TECHNICAL BRIEF 2. LG-U310 Main Components SUB Top Side MAIN Bottom Side MAIN Top Side SUB Bottom Side 1.3M Camera Module U310 LCD & Folder Assy Stereo Headset - 67 -...
  • Page 67 3. TECHNICAL BRIEF 2-3. SUB Bottom Side U507 U505 U600 U508 FL601, FL603 Dome sheet Reference Description Reference Description U505 LCD 2.8V LDO U508 Audio AMP U507 Audio Analog Switch U600 Folder detect sensor FL601, LCD EMI Filter FL603 - 68 -...
  • Page 68 3. TECHNICAL BRIEF 2-2. Main Bottom Side CN602 CN601 CN501 Q401 Q400 U504 U200 U501 X200 J300 X400 U1002 X1001 U1000 U500 FL1003 U1001 CN502 Reference Description Reference Description CN601 20pin sub board connector CN602 LCD 50pin connector U504 Camera 2.7V LDO CN501 18pin MMI connector U501...
  • Page 69 3. TECHNICAL BRIEF 2-2. Main Bottom Side(continued) FL604, FL602, FL600 CN500 U506 S500 U301 VOLUME UP KEY U503 VOLUME DOWN KEY U502 U300 CAMERA KEY FL1001 U400 Q1000 U1005 FL1000 Q402 SW1000 Reference Description Reference Description CN500 Camera connector FL604 EMI Filter S500 Micro SD card socket...
  • Page 70 3. TECHNICAL BRIEF 2-3. SUB Bottom Side ANT700 U703 BAT700 U704 2-4. SUB Top Side U705 CON702 Reference Description Reference Description ANT700 Bluetooth Antenna BAT700 Back Up battery U703 Bluetooth module CON702 Sub board connector U704 Bluetooth module clock buffer U705 Camera detect MR sensor - 71 -...

  • Page 71: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Component U1002 X1001 U400 U1000 U1003 U1005 FL1000 U500 FL1003 X1000 U1001 SW1000 ANT 1001, 1002 Reference Description Reference Description X1001 VCTCXO(19.2MHz) U1003 HDET IC U1005 WCDMA Receiver FL1003 WCDMA Duplexer IC(RFR6250) U1000 GSM/WCDMA Transceiver IC U1002...

  • Page 72: Signal Path

    4. TROUBLE SHOOTING 4.2 SIGNAL PATH WCDMA Tx PATH WCDMA Rx PATH - 73 -...
  • Page 73 4. TROUBLE SHOOTING GSM Tx PATH GSM Rx PATH DCS/PCS Tx PATH DCS Rx PATH GSM/DCS/PCS Rx Common path PCS Rx PATH - 74 -...

  • Page 74: Checking Vctcxo Block

    4. TROUBLE SHOOTING 4.3 Checking VCTCXO Block The reference frequency (19.2MHz) from X1001 (VCTCXO) is used WCDMA TX part, GSM part and BB part. - 75 -...
  • Page 75 4. TROUBLE SHOOTING Check 1. Crystal part If you already check this crystal part, you can skip check 1. Test Point (Crystal Part) C1060 1000p VREG_TCXO_2.85V C1066 C1067 1000p 0.1u 19.2MHz R1026 X1001 C1072 100ohm TCXO_PM TRK_LO_ADJ VCONT 100p TG-5001LA-19.2MHz C1073 TCXO_OUT 0.01u...
  • Page 76 4. TROUBLE SHOOTING - 77 -...

  • Page 77: Checking Ant. Sw Module Block

    4. TROUBLE SHOOTING 4.4 Checking Ant. SW Module Block FL100(DGM092M03) ANT_SEL0 T_SEL2 ANT_SEL1 TP 1. VREG_RFRX_0_2.85V Antenna Switch Block(Bottom) SW1000 R1038 KMS-512 C1003 L1007 10nH C1005 L1011 FL1000 VREG_RFRX_0_2.85V 7.5nH DGM092M03 PCN_PCS_TX EGSM_RX1 EGSM_RX2 GSM850_EGSM_TX PCN_RX1 PCN_RX2 WCDMA2100 PCS_RX1 PCS_RX2 ANT_SEL0 CTRL1 GSM850_RX1...
  • Page 78 4. TROUBLE SHOOTING Mode ANT_SEL0 ANT_SEL1 ANT_SEL2 EGSM TX High High DCS/PCS TX High High EGSM RX High High DCS RX High PCS RX High UMTS High Logic Table of the Antenna Switch - 79 -...
  • Page 79 4. TROUBLE SHOOTING Checking Switch Block power source Check Soldering of ANT_SEL0, 1, 2 High Level Check VCC 2.5V < Voltgae < 3.0V TP1 VREG_RFRX_0_2.85V Check the Logic in each mode - 80 -...

  • Page 80: Checking Wcdma Block

    4. TROUBLE SHOOTING 4.5 Checking WCDMA Block START 1. Check VCXO 19.2MHz 2. Check ANT. SW Module ANT_SEL0, 1, 2 3. Check RF Tx Level 4. Check PAM Block 5. Check RF Rx Level 6. Re-download SW & CAL. - 81 -...

  • Page 81: Checking Vcxo Block

    4. TROUBLE SHOOTING 4.5.1 Checking VCXO Block Refer to 4.3 4.5.2 Checking Ant. SW module Refer to 4.4 4.5.3 Checking RF TX Level Test Point (RF TX Level) ANT1001 ANT1002 SW1000 R1038 KMS-512 C1003 L1007 10nH C1005 L1011 FL1000 7.5nH DGM092M03 PCN_PCS_TX EGSM_RX1...
  • Page 82 4. TROUBLE SHOOTING WCDMA +VPWR +VPWR C1062 C1061 1000p C1063 4.7u 1000p WS2512_TR1G U1002 FL10 L1301 VCC2 VCC1 SAFEB1 3.3nH GND4 RFIN RFOUT GND1 C1068 R1025 6.2K PA_R0 C1070 GND3 VCONT Q1000 GND2 UMC4N BGND VREF C1071 L1023 PA_ON 4.7nH C1074 VREG_RFTX_2.85V C1077...
  • Page 83 4. TROUBLE SHOOTING 4.5.4 Checking PAM Block • PAM control signal PA_ON : WCDMA Tx Power Detect IC(HDET) Enable TX_AGC_ADJ : WCDMA Tx Power Amp Gain Control PA_ON TX_AGC_ADJ PA_ON must be HIGH(over 2.5V) PA_FET_N must be LOW if the max Tx power is set (lower than 0.5V) PAM IN/OUT Signal PAM_IN PAM_OUT...
  • Page 84 4. TROUBLE SHOOTING 4.5.5 Check RF Rx Level Bias1 Test Point (RF Rx Level) ANT1001 SW1000 R1038 KMS-512 C1003 L1007 10nH C1005 L1011 FL1000 VREG_RFRX_0_2.85V 7.5nH DGM092M03 PCN_PCS_TX EGSM_RX1 EGSM_RX2 GSM850_EGSM_TX PCN_RX1 PCN_RX2 WCDMA2100 PCS_RX1 PCS_RX2 ANT_SEL0 CTRL1 GSM850_RX1 ANT_SEL1 CTRL2 GSM850_RX2 C1076...
  • Page 85 4. TROUBLE SHOOTING Set the Phone Rx is ON Check bias1 Check bias block Over 2V ? soldering Check TP1 Check RF s/w Signal exist? Check TP2 Check FEM Signal exist? Check TP3 Check Duplexer Signal exist? Check TP4 Check RFR6250 Signal exist? Change the board - 86 -...

  • Page 86: Checking Gsm Block

    4. TROUBLE SHOOTING 4.6 Checking GSM Block START 1. Check TXVCO Block 2. Check ANT. SW Module 3. Check Tx PAM Block 4. Check RF Rx Level 5. Re-download SW & CAL. - 87 -...

  • Page 87: Checking Vco Block

    4. TROUBLE SHOOTING 4.6.1 Checking VCO Block Test Point (TXVCO Level) R1008 C1035 R1009 C1033 C1034 R1012 120p 1000p VREG_RFTX_2.85V C1038 R1013 (PPS) 0.1u (2012) C1029 R1014 C1039 100p X1000 MQW6V0C869M FB1000 VREG_RFTX_2.85V OUT1 R1015 R1018 OUT2 R1016 100ohm GSM_TX_VCO_1_EN_N R1019 100ohm GSM_TX_VCO_0_EN_N...
  • Page 88 4. TROUBLE SHOOTING START Check TP1 Check RTR6250 0.5V < TP1 < 2.5V Check TP2, TP3 If GSM TP2=High , TP3=Low Check Soldering If DCS/PCS TP2=Low , TP3=High & MSM6250A Check TP4 Check PMIC(U401) Check PMIC(U403) 2.8V < TP4 < 3.0V Check TP5, TP6 Check Soldering of 0dBm <...
  • Page 89 4. TROUBLE SHOOTING 4.6.2 Checking Ant. SW Module Refer to chapter 4.4 4.6.3 Checking RF Tx level Test Point (RF Tx Level) SW1000 R1038 KMS-512 C1003 L1007 10nH C1005 L1011 FL1000 VREG_RFRX_0_2.85V 7.5nH DGM092M03 PCN_PCS_TX EGSM_RX1 EGSM_RX2 GSM850_EGSM_TX PCN_RX1 PCN_RX2 WCDMA2100 PCS_RX1 PCS_RX2...
  • Page 90 4. TROUBLE SHOOTING - 91 -...

  • Page 91: Checking Pam Block

    4. TROUBLE SHOOTING 4.6.4 Checking PAM Block PAM Control Signal TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc < 2.6V, TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 2.5V , Power OFF : lower than 0.7V) TP3.

  • Page 92: Checking Rf Rx Block

    4. TROUBLE SHOOTING 4.6.5 Checking RF Rx Block PCS.RX EGSM.RX DCS.RX Test Point (RF Rx Level) L1003 2.7nH L1005 3.6nH PCS.RX C1004 1000p 1930-1990 MHz L1008 3.6nH L1009 2.7nH L1012 5.6nH L1014 7.5nH DCS.RX C1009 1000p 1805-1880 MHz L1015 7.5nH L1017 5.6nH L1018...
  • Page 93 4. TROUBLE SHOOTING Set the Phone Rx is ON Check Resoldering soldering Check Change FEM & buffer FEM & buffer Change the board - 94 -...

  • Page 94: Bluetooth Rf Block

    4. TROUBLE SHOOTING 4.7 Bluetooth RF Block TC-3000A (Bluetooth Tester) 1. Set phone to bluetooth test-mode : Enter Test Mode(277634#*#) -> Module Test Set -> BT DUT -> BT DUT ON 2. Connect phone to bluetooth tester 3. Set channel to 39 4.
  • Page 95 4. TROUBLE SHOOTING ANT700 BLUETOOTH FEED KYOCERA SNMF0012601 R704 VREG_BT_2.85V C700 C750 0.5p U703 C709 RB04 0.1u R700 BT_CLK BT_SBST SBST CLK_REF R701 BT_SBCK SBCK R711 R702 BT_SBDT SBDT VDD_MSM VREG_MSMP_2.7V BT_TX_RX_N SYNC_DET_TX_EN R703 BT_DATA RX_BB_TX_BB VDD_A VREG_BT_2.85V C710 1000p C711 1000p TCXO_OUT...

  • Page 96: Power On Trouble

    4. TROUBLE SHOOTING 4. BB Trouble Shooting 4.8 Power ON Trouble Power On sequence of U310 is : PWR(END) key press -> PM_ON_SW_N go to low(D601),PM6650-2M KPDPWR_N pin(24) -> PM6650-2M Power Up -> VREG_MSMC_1.25V(C430), VREG_MSME_1.8V(C431), VREG_MSMP_2.7V(C425), VREG_MSMA_2.6V(C422), VREG_TCXO_2.85V(C416) power up and system reset assert to MSM ->...
  • Page 97 4. TROUBLE SHOOTING MSM6250 VREG_MSMC_1.25V(C430) VREG_MSME_1.8V(C431) 32.768KHz VREGC_MSMP_2.7V(C425) PM6650 VREGC_MSMA_2.6V(C422) VREG_TCXO_2.85V(C416) 19.2MHz(R406) - 98 -...

  • Page 98: Usb Trouble

    4. TROUBLE SHOOTING 4.9 USB Trouble USB Initial sequence of U310 is : USB connected to U310 -> USB_VBUS(D504) go to 5V -> USB_D+(D501) go to 3.3V -> 48M Crystal on -> USB_DATA(TPUSBP) is triggered -> USB work. Start Cable insert...

  • Page 99: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.10 SIM Detect Trouble USB Initial sequence of 600V is : VREG_USIM_2.85V(C429 of PM6650-2M) go to 3.0V -> USIM_CLK,USIM_RST,USIM_DATA triggered -> USIM IF work(Schematic and place are refer to SIM technical brief) Start Re-insert the SIM card Work well? Check J300, VREG_USIM_2.85V is 3.0V?

  • Page 100: Key Sense Trouble

    4. TROUBLE SHOOTING 4.11 Key Sense Trouble Key Sense sequence of U310 is : Default condition ROW(0-4) is 2.7V -> Press the key -> Corresponding row(x) and col(x) go to 0V -> Key sensing Start Change the side key Work well?

  • Page 101: Camera Trouble

    4. TROUBLE SHOOTING 4.12 Camera Trouble Camera control signals are generated by MSM6250A and directly connected with MSM6250A. Start Check the camera conn. and reconnect the camera Camera is OK? Change the U504 or Check VREG_CAM_2.7V, VREG_DODD_2.7V Change the U502 Check the DSP_CLK Change the Main board (FB500)

  • Page 102: Main Lcd Trouble

    4. TROUBLE SHOOTING 4.13 Main LCD Trouble Main LCD control signals are generated by MSM6250A. Those signal’s path are : MSM6250A -> MAIN B’d -> CN602 -> LCD FPCB and LCD Module - 103 -...
  • Page 103 4. TROUBLE SHOOTING LCD Control data flow LCD Module 40pin LCD connector FPCB for LCD Module CN602(50pin LCD connector) - 104 -...

  • Page 104: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.14 Folder ON/OFF Trouble Folder On/Off(Close/Open) is worked as below : Folder On/Off Event -> Flip(U600 pin 1) is triggered(Open : about 2.6V, Close : 0V) -> MSM6250A Sense the Folder Flip Event. Sensing signal is directly connected to MSM6250A. Start Check the magnet in Insert the magnet...

  • Page 105: Camera Direction Detection Trouble

    4. TROUBLE SHOOTING 4.15 Camera Direction Detection Trouble Camera direction detection is worked as below : Camera direction change Event -> CAM_SENSE(U705 pin out) is triggered as this (Cam front side view : 0V, Cam back side view : about 2.5V) -> MSM6250A Sense the Camera direction change Event Start Check the magnet in the mechanics of camera module...

  • Page 106: Trans Flash Trouble

    4. TROUBLE SHOOTING 4.16 Trans Flash Trouble Trans Flash is worked as below : Trans Flash insertion -> VREG_MMC_3.0V is 3.0V -> MMC_CD go to High -> Trans Flash Insertion detecting by MSM6250A -> go working Start Insert the Trans Flash Card Trans Flash insertion Check the VREG_MMC_3.0V,MMC_CD signal Detection is correct ?

  • Page 107: Audio Trouble Shooting

    4. TROUBLE SHOOTING 4.17 Audio Trouble Shooting 4.17.1 Receiver Path Voice Receiver path as below: MSM6250A Ear1ON/Ear1OP -> R512,R510 -> U507(Speaker/receiver switch) ->R514, R522 -> CN602(b’d to b’d connector for LCD Module) -> LCD b’d to b’d connector of LCD FPCB -> LCD module ->...
  • Page 108 4. TROUBLE SHOOTING Speaker Speaker soldering point FPCB for LCD Module U507(Speaker/receiver switch) R512,R510 (receiver signal serial resistor) R514,R522 (audio signal serial resistor) - 109 -...
  • Page 109 4. TROUBLE SHOOTING 4.17.2 Voice and Sound Path for Head_set Voice and Multimedia Sound path for Head_Set as below: MSM6250A HPH_R, HPH_L -> C537, C538 -> R524, R526 -> CN501 headset Jack pin 4,5 Start Connect the phone to network Equipment and setup call Setup 1KHz tone out And insert head_Set...
  • Page 110 4. TROUBLE SHOOTING C537,C538 CN501 MSM6250A - 111 -...
  • Page 111 4. TROUBLE SHOOTING 4.17.3 Loud Speaker path(voice speaker phone, VT, multimedia play, etc) Loud speaker path as below: MSM6250A AUXOP_AUXOL, AUXOP_AUXOR -> C530,C540 -> R515,R528 -> U508(amp) -> U507(Receiver/Speaker switch) -> R514, R522 -> CN602 -> LCD FPCB -> Speaker Start Connect the phone to network Equipment and setup call...
  • Page 112 4. TROUBLE SHOOTING Speaker Speaker soldering point FPCB for LCD Module R514,R522 U507 U508 (audio signal serial (Speaker/receiver (Speaker amp) resistor) switch) R515,R528 - 113 -...
  • Page 113 4. TROUBLE SHOOTING 4.17.4 Microphone for Main MIC Main Microphone path as below: MIC -> C504,C506 -> MSM6250A -> MIC feed back gain logic -> MSM internal CODEC AUDIO Near to MSM MICBIAS C500 C502 SP0102BE3 C504 U500 MIC1N C507 C506 MIC1P Start...
  • Page 114 4. TROUBLE SHOOTING U500(MIC for Handset) MICBIAS C500 C502 SP0102BE3 C504 U500 MIC1N C507 C506 MIC1P - 115 -...
  • Page 115 4. TROUBLE SHOOTING 4.17.5 Microphone for Head_Set MIC for Head_Set path as below: Insert Headset -> EAR_SENSE_N(pin6) go 0V -> MSM6250A sense Head_Set insertion -> MIC signal go to MSM(C216, C217) by through b-to-b connector AUDIO Near to MSM CN501 MMI_CONNECTOR R521 VREG_MSMP_2.7V...
  • Page 116 4. TROUBLE SHOOTING C216,C217 for MIC serial capacitor MSM6250A - 117 -...

  • Page 117: Charger Trouble Shooting

    4. TROUBLE SHOOTING 4.18 Charger Trouble Shooting Charging Current Flow USB Cable USB_VBUS (5.0V) Pass control Tr (ON) USB Charging control USB_CNT_N +5V_PWR (4.6V) Pass control Tr (ON) TA Charging control CHG_CNT_N Charging current ICHARGE sensing ICHARGEOUT 4.2~4.25V +VPWR VBATT Main Battery Battery FET...
  • Page 118 4. TROUBLE SHOOTING Start Check the pin and battery Connect terminals of I/O connector Connection OK? Change I/O connector Is the TA voltage 4.6V? Change TA/USB cable Is the USB voltage 5.0V? Check the Q400,Q401,Q402 Charging OK? Change the board - 119 -...
  • Page 119 4. TROUBLE SHOOTING Q401 Q400 Q402 VBATT - 120 -...

  • Page 120: Download

    LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed. Additionally, LGMDP allows multi downloading up to 8 handsets at the same time.

  • Page 121: Connecting To Pc

    5. DOWNLOAD 5.2.1 Connecting to PC • Choose desired country and then click on the OK button. Once the desired country is selected, the selected country name will be displayed at the bottom of left corner screen. For instance, if the selected country is “Italy”, then LGMDP will operate based on the Italy Setting Values.
  • Page 122 5. DOWNLOAD • Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. The current security status will be displayed under Security column. Make sure that the selected country is valid. If the selected country is invalid, select the country name again.
  • Page 123 5. DOWNLOAD • The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed. - 124 -...
  • Page 124 5. DOWNLOAD 1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse... button. The edit box shows the file path where new images are located. Please note that all images should be located in a selected folder. 2) Click on the Browse...
  • Page 125 5. DOWNLOAD 6) Clear: Clearing all directory paths of images in the dialog. 7) Start: Starting downloading the selected individual image. 5.2.2 Choosing image files • Select the image folder, where all the image files are located, by clicking on the Browse..(The folder name shall be different from that of the folder name in the snapshot.
  • Page 126 5. DOWNLOAD • Select the path, where Media Image file is located by clicking on the Browse... button. The selected Media image will be downloaded to the handset from the path directory in the PC. Make sure that you have chosen the right media image file. •...
  • Page 127 5. DOWNLOAD • Choose a Module Image file after clicking on the Browse... button. The selected Module image will be downloaded to the handset from the path directory in the PC. Make sure that you have chosen the right Module image file. •...
  • Page 128 5. DOWNLOAD • If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the desired NV file to be downloaded on the handset. To enable this simply check the box or select the NV file from the LGMDP installation directory by clicking on the Browse... button. •...

  • Page 129: Download Process

    5. DOWNLOAD 5.2.3 Downloading • The following flow chart is whole process for downloading images to the handset. You will see snapshots for each step in the succeeding slides. Download Start (NV Backup) (NV Restore) Erase MEDIA directory Reset Download MEDIA Erase MODULE directory Download MODULE (Erase EFS)
  • Page 130 5. DOWNLOAD • This message box informs that a new file for NV backup will be created in the displayed file name in the LGMDP installation directory. • Backing up NV data and backed up NV data will be stored in the LGMDP installation directory.
  • Page 131 5. DOWNLOAD • Rebooting the handset and re-establishing the connection • Restoring NV data which backed up in the Backing up process. User can also restore NV data using NV Default image selection. • Rebooting the handset and re-establishing the connection •...
  • Page 132 5. DOWNLOAD • Downloading Media image in progress • Downloading Module image in progress • Downloading process has completed successfully - 133 -...
  • Page 133 5. DOWNLOAD 5.2.4 Tools • Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device Manager from the Tools of the file menu. •...

  • Page 134: Troubleshooting Download Errors

    5. DOWNLOAD 5.3 Troubleshooting Download Errors 1) When the phone does not work after downloading has been completed. 2) Media Erasing Error 3) NV Restore Error 5.3.1 When the phone does not work • Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and then try to download all the images again including AMSS modem, Media, and Module image.
  • Page 135 5. DOWNLOAD • Choose Image file after clicking on the Browse... button. Make sure that you have chosen the right image file. After choosing valid images, then click on the Start button to start downloading selected images. The selected image will be downloaded to the handset from the path directory in the PC. After downloading images successfully, it will boot to normal mode.
  • Page 136 5. DOWNLOAD • Reboot the phone and then re- try to download only the Media and Module images again. Both Media and Module image have to be downloaded at the same time. 5.3.3 NV Restore Error • Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt. - 137 -...
  • Page 137 5. DOWNLOAD • Connect the handset and Press the Connect button in the Select Port window. (Enable state in the window indicates that the Phone has been detected and is ready to download.) • Click on NV Restore. A list of NV Backup files(*.nv2) will be shown. These files were saved every time NV Backup option was selected.
  • Page 138 5. DOWNLOAD • Choose the desired NV file to be downloaded on the handset, and click on Restore. • Snapshot showing the error, Reading the NV file and restore NV. - 139 -...

  • Page 139: Caution

    5. DOWNLOAD 5.4 Caution 1) Not recommended that multi-downloading using the USB hub. 2) Recommended that the Module and Media Image have to be downloaded at the same time. 3) Erase EFS option will erase everything (media, module, nv items, and user data) in the EFS area.

  • Page 140: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM 6.1 GSM & WCDMA RF Block RX SAW RX_IQ - - RX_IQ 2110-2170 SBST/CK/DT - -SBST/CK/DT RFR6250 TCXO SBST/CK/DT PM6650 -TCXO -TCXO_EN VCTCXO Loop 19.2MHz filter TRK_LO_AD J UMTS TX_SAW - UMTS Coupler 1920-1980 VCONTROL- TX_AGC_ADJ PLL1...

  • Page 141: Interface Diagram

    6. BLOCK DIAGRAM 6.2 Interface Diagram - 142 -...

  • Page 142: Circuit Diagram

    VREG_TCXO_RF_2.85V Checked C1103 0.1u 5.6p C1106 C1107 DRAWING 100p 0.1u C1108 R1036 C1110 Approved C1109 3.9n 470p 3.3K 0.01u C1111 (PPS) (1%) TCXO_OUT (2012) 1000p R1037 (1%) 4.7K DRAWING LG Electronics Inc. U310_REV_1.1 LG(42)-A-5505-10:01 LG Electronics Inc. - 143 -...
  • Page 143 BT_SBST_GPIO[24] BT_SBST AE11 EBI2_ADD[10] BT_SBCK_GPIO[23] BT_SBCK EBI2_ADD[9] BT_SBDT_GPIO[22] BT_SBDT AC11 EBI2_ADD[8] BT_TX_RN_N_GPIO[21] BT_TX_RX_N AA11 EBI2_ADD[7] BT_DATA_GPIO[20] BT_DATA EBI2_ADD[6] BLUETOOTH AC10 EBI2_ADD[5] EBI2_ADD[4] AA10 EBI2_ADD[3] EBI2_ADD[2] EBI2_ADD[1] C247 0.1u U310 KEYPAD UART USIM PMIC MicroSD CAMERA MSM6250A U310_REV_1.1 - 144 -...
  • Page 144 NC76 JTAG_RTCK JTAG_TDO NC17 NC77 URXD NC18 NC78 MODE_1 UTXD NC19 NC79 NC20 NC80 NC21 NC81 NC22 NC82 NC23 NC83 NC24 NC84 NC25 NC85 NC26 NC86 NC27 NC87 NC28 NC88 NC29 NC89 U310 MCP & USIM U310_REV_1.1 - 145 -...
  • Page 145 MOTOR_PWR- USIM_DATA USIM_P_DATA VREG_USIM_2.85V +VPWR VREG_MMC_3.0V C428 C429 2.2u 2.2u 1608 1608 smd_2520h1_6_r smd_2520h1_6_r L401 L402 4.7uH 4.7uH C433 C432 C431 C430 R409 1000p 1000p 4.7u 4.7u 1608 1608 Sheet/ U310 Sheets PMIC U310_REV_1.1 LG Electronics Inc. - 146 -...
  • Page 146 USB_D+ RCV- USB_D- EAR_SENSE_N RCV+ R510 10 VBATT R530 470K VBAT_SENSE C542 R529 PM_ON_SW_N C543 +5V_PWR VBATT USB_VBUS NFM21PC105B1A3 INSTPAR UART_TXD PSD05-LF UART_RXD D500 U310 CN502 CAM & AUDIO & I/O VBAT_TEMP BLUETOOTH R532 VREG_MSMP_2.7V 80.6K U310_REV_1.1 - 147 -...
  • Page 147 LEPBS14IG R616 R617 R618 LD607 LD608 LD609 KEY_COL(4) KEY_COL(3) LEPBS14IG LEPBS14IG LEPBS14IG KEY_COL(2) R619 R620 LD610 LD611 KEY_COL(1) KEY_COL(0) LEPBS14IG LEPBS14IG R621 R622 LD612 LD613 U310 LEPBS14IG LEPBS14IG R623 LD614 LEPBS14IG KYPD_BACKLIGHT KEY & LCD CONN U310_REV_1.1 - 148 -...
  • Page 148 R701 BT_SBCK SBCK EVLC14S02050 R711 R702 BT_SBDT SBDT VDD_MSM VREG_MSMP_2.7V BT_TX_RX_N SYNC_DET_TX_EN R703 BT_DATA RX_BB_TX_BB VDD_A VREG_BT_2.85V C710 1000p C711 1000p TCXO_OUT XTAL_IN LDO1 LDO2 C701 C702 C703 C704 C705 C706 C707 C708 0.01u 0.01u U310 U310_REV_1.0 - 149 -...

  • Page 149: Pcb Layout

    8. pcb layout - 150 -...
  • Page 150 8. pcb layout - 151 -...
  • Page 151 8. pcb layout - 152 -...
  • Page 152 8. pcb layout - 153 -...
  • Page 153 - 154 -...

  • Page 154: Calibration & Rf Auto Test Program

    9. Calibration & RF Auto Test Program 9. Calibration & RF Auto Test Program 9.1 Configuration of HOT KIMCHI 9.1.1 Configuration of directory HOT KIMCHI PROJECT Auto_Model U310 AutoSetup_100.xml Procedure_U310_102.xml Spec_U310_101.xml Cal_Model U310 At_Serial_Cmd.xml dacTable.cfg HOT_KIMCHI CmMqDll.dll Diag_NV6250_RevB.dll ComLMPLib_06.dll DLL_E5515CD.DLL Hot_KimchiD.exe...
  • Page 155 9. Calibration & RF Auto Test Program 9.1.2 Setup file (Info_Db.txt) /*cal*/[Default]=[U310] /*cal*/[U310]=[..\\Cal_Model\\U310\\LG_RfCal_QuU310Ag_099.dll] /*auto*/[U310]=[..\\RF Auto\\Rf_AutoMain_Ver1114.dll] [ezlooks]=[off] [batcal]=[off] [svc]=[off] ‘on’ or ‘off’. (use only lower case) [standalone]=[off] [tescom]=[off] ‘auto’ or ‘cal’. (use only lower case) [process]=[cal] [U310]=[..\\Auto_Model\\U310\\Procedure_U310_102.xml,..\\Auto_Model\\U310\\Spec_U310_101. xml,..\\Auto_Model\\U310\\AutoSetup_100.xml] 1: Indication of ‘cal process’ or ‘auto process’...
  • Page 156 9. Calibration & RF Auto Test Program 9.1.3 Items of setup file [ezlooks] => The yes or no for using ezlooks Domestic: on, Overseas: off [batcal] => The yes or no for using battery calibration [svc] => The yes or no for using HOT KIMCHI at service center Domestic: off, Service Center: on [standalone] =>...
  • Page 157 9. Calibration & RF Auto Test Program 9.1.4 Example for setup file CAL Process Ex1) Service center [ezlooks]=[off] [batcal]=[off] [svc]=[on] [standalone]=[off] [tescom]=[off] [process]=[cal] Ex2) Overseas factory or Repair [ezlooks]=[off] [batcal]=[on] [svc]=[off] [standalone]=[on] [tescom]=[off] [process]=[cal] Ex3) Domestic factory [ezlooks]=[on] [batcal]=[on] [svc]=[off] [standalone]=[off] [tescom]=[off] [process]=[cal]...

  • Page 158: How To Use Hot Kimchi

    9. Calibration & RF Auto Test Program 9.2. How to use HOT KIMCHI U310 U310 * Flow 1. Select the model name which you want 2. Click APPLY button to load the ‘cal’. 3. Click START button to run the procedure which you want...

  • Page 159: Example For Using Hot Kimchi

    9. Calibration & RF Auto Test Program 9.3 Example for using HOT KIMCHI Choose Exe_QU310Ver0.99A Click APPLY button Click START button U310_Ver0.99A Calibration - 160 -...
  • Page 160 9. Calibration & RF Auto Test Program 9.3.1 Example for Calibration U310 Click START - 161 -...
  • Page 161 9. Calibration & RF Auto Test Program 9.3.2 Example for RF Auto Test Click Run button U310 U310 U310 U310 - 162 -...

  • Page 162: Exploded View & Replacement Part List

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.1 EXPLODED VIEW - 163 -...
  • Page 163 - 164 -...

  • Page 164: Replacement Parts

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark IMT,FOLDER TIFF0013301 Without AAAY00 ADDITION AAAY0183901 Color...
  • Page 165 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MPBQ00 PAD,LCD(SUB) MPBQ0028801 COMPLEX, (empty), , , , , Color Without MTAB00 TAPE,PROTECTION MTAB0127501 COMPLEX, (empty), , , , , Color Without MTAE00 TAPE,WINDOW(SUB) MTAE0028201 COMPLEX, (empty), , , , , Color...
  • Page 166 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MTAB01 TAPE,PROTECTION MTAB0127701 COMPLEX, (empty), , , , , Color Without MWAC00 WINDOW,LCD MWAC0069101 CUTTING, PMMA MR 200, , , , , Color Without MWAF00 WINDOW,LCD(SUB) MWAF0035001...
  • Page 167 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MLAK00 LABEL,MODEL MLAK0006901 Without ADCA00 DOME ASSY,METAL ADCA0054401 Color Without MLAZ00 LABEL MLAZ0038301 PID Label 4 Array Color Without AFBA00 FRAME ASSY,SHIELD AFBA0004701 Color MFEA00 FRAME,SHIELD MFEA0011601 CASTING, Zn Alloy, , , , ,...

  • Page 168: Main Component

    CMOS ,MEGA ,1.3M, OVT(OV9655) 1/4", 8*7.95*5.9t, SVCY00 CAMERA SVCY0011901 FPCB Type SAFY00 PCB ASSY,MAIN SAFY0163001 SAFB00 PCB ASSY,MAIN,INSERT SAFB0059801 SPKY00 PCB,SIDEKEY SPKY0038701 POLYI ,.2 mm,DOUBLE ,U310 F-SIDEKEY SAFF00 PCB ASSY,MAIN,SMT SAFF0084801 PCB ASSY,MAIN,SMT SAFC00 SAFC0075601 BOTTOM C1000 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C1001 CAP,CERAMIC,CHIP...
  • Page 169 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1011 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1012 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1013 CAP,TANTAL,CHIP ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP C1014 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 170 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1045 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1046 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1047 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1048 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 171 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1084 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1085 CAP,CERAMIC,CHIP ECCH0000144 1.2 nF,50V,K,X7R,HD,1005,R/TP C1086 CAP,CERAMIC,CHIP ECCH0002001 100000 pF,6.3V ,K ,B ,HD ,1005 ,R/TP C1087 CAP,CERAMIC,CHIP ECCH0000110...
  • Page 172 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C207 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C208 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C209 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C210 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C211 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C212 CAP,CERAMIC,CHIP ECCH0000157...
  • Page 173 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C242 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP C243 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C244 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C245 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C246 CAP,CERAMIC,CHIP ECCH0000161...
  • Page 174 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C416 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C417 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C418 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C419 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 175 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C517 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C518 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C519 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C521 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 176 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark D502 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE SOD-323 ,12 V,350 W,R/TP ,Single Line TVS Diode for D503 DIODE,TVS EDTY0006201 D504 DIODE,TVS EDTY0008610 SOD-523 ,5 V,250 W,R/TP ,PB-FREE EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , D600 DIODE,SWITCHING...
  • Page 177 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L1012 INDUCTOR,CHIP ELCH0001407 5.6 nH,S ,1005 ,R/TP ,PBFREE L1013 INDUCTOR,CHIP ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE L1014 INDUCTOR,CHIP ELCH0003817 7.5 nH,J ,1005 ,R/TP , L1015 INDUCTOR,CHIP ELCH0003817...
  • Page 178 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R1007 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP R1008 RES,CHIP,MAKER ERHZ0000522 24 ohm,1/16W ,J ,1005 ,R/TP R1009 RES,CHIP,MAKER ERHZ0000512 82 ohm,1/16W ,J ,1005 ,R/TP R1010 RES,CHIP,MAKER ERHZ0000307 6200 ohm,1/16W ,F ,1005 ,R/TP...
  • Page 179 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R203 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R204 RES,CHIP,MAKER ERHZ0000205 1 Mohm,1/16W ,F ,1005 ,R/TP R205 RES,CHIP,MAKER ERHZ0000231 180 Kohm,1/16W ,F ,1005 ,R/TP R206 RES,CHIP,MAKER ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP...
  • Page 180 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R502 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R503 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R505 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R506 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP...
  • Page 181 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark U400 EUSY0306302 BCCS ,84 PIN,R/TP ,7x7, MSMC(1.2V), pbfree UNIT ,-42 dB,6.15*3.76*1.25 ,Silicon mic , ,-42 ,300 ,OMNI U500 MICROPHONE SUMY0010602 ,[empty] ,6.15*3.76*1.25 ,SMD DFN33-12 ,12 PIN,R/TP ,DFN33-12,12PIN,1X/1.5X/2X U501 EUSY0238701 CHARGE PUMP 3LED,150mA...
  • Page 182 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VA620 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 MHz, PPM, pF,SMD ,5.0*4.0*1.3 ,824M~915M, X1000 EXSC0009901 1710M~1910M, 12pin, DBDO 19.2 MHz,2.5 PPM,40 pF,SMD ,3.2*2.5*1.05 ,2ppm at -30 X1001 VCTCXO EXSK0006102...
  • Page 183 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark pastel blue ,1608 ,R/TP , ,; ,[empty] , , , , , ,[empty] ,[empty] LD609 DIODE,LED,CHIP EDLH0012901 ,[empty] pastel blue ,1608 ,R/TP , ,; ,[empty] , , , , , ,[empty] ,[empty] LD610 DIODE,LED,CHIP EDLH0012901...
  • Page 184 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R617 RES,CHIP ERHY0009535 24 ohm,1/20W(0.05W) ,J ,0603 ,R/TP R618 RES,CHIP ERHY0009535 24 ohm,1/20W(0.05W) ,J ,0603 ,R/TP R619 RES,CHIP ERHY0009535 24 ohm,1/20W(0.05W) ,J ,0603 ,R/TP R620 RES,CHIP ERHY0009535 24 ohm,1/20W(0.05W) ,J ,0603 ,R/TP...
  • Page 185 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C705 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C706 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C707 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C708 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C709 CAP,CERAMIC,CHIP ECCH0000182...

  • Page 186: Accessory

    SBOM standard on GCSC Location Level Description Part Number Specification Color Remark BATTERY PACK,LI- 3.7 V,800 mAh,1 CELL,PRISMATIC ,U310 HITWA SBPP00 SBPP0019401 White POLYMER BATT(383450), Europe Label, Pb-Free ; ,10mW ,32ohm ,112dB ,20HZ ,20HZ ,[empty] ,BLACK ,18P SGEY00 EAR PHONE/EAR MIKE SET...
  • Page 187 Note...
  • Page 188 Note...

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