Servicing Notes - Sony D-E666 Service Manual

DANGER
Invisible laser radiation when open and interlock failed or defeated.
Avoid direct exposure to beam.
CAUTION
Use of controls or adjustments or performance of procedures other
than those specified herein may result in hazardous radiation
exposure.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR
BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the charged
electrostatic load, etc. on clothing and the human body. During repair,
pay attention to electrostatic breakdown and also use the procedure in
the printed matter which is included in the repair parts.
The flexible board is easily damaged and should be handled with care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on the
disc reflective surface by the objective lens in the optical pick-up block.
Therefore, when checking the laser diode emission, observe from more
than 30cm away from the objective lens.
Before Replacing the Optical pick-up Block
Please be sure to check thoroughly the parameters as per the "Optical
pick-up Block Checking Procedure" (Part No. : 9-960-027-11) issued
separately before replacing the optical Pick-up block.
Note and specifications required to check are given below.
• FOK output : IC601 eg pin
When checking FOK, remove the lead wire to disc motor.
• RF signal P-to-P value : 0.4 to 0.65Vp-p (Except US model)
: 0.35 to 0.65Vp-p (US model)
D-E666/EJ620/EJ621/EJ622/EJ623/EJ625/EJ626CK
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE
PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SECTION 1

SERVICING NOTES

Laser Diode Checking Methods
During normal operation of the equipment, emission of the laser diode
is prohibited unless the upper panel is closed while turning ON the S801
(push switch type).
The following two checking methods for the laser diode are operable.
Method :
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. Push the S801 as shown in Fig. 1 .
3. Check the object lens for confirming normal emission of the laser
diode. If not emitting, there is a trouble in the automatic power
control circuit or the optical pick-up. During normal operation, the
laser diode is turned ON about 2.5 seconds for focus searching.
À LA SÉCURITÉ!
Fig.1 Method to push S801
S801
3