Huawei Y300 Maintenance Manual page 5

Y300 Maintenance Manual
9.2.3 Clock Circuit ......................................................................................................................................... 38
9.2.4 Flash Memory Circuit ........................................................................................................................... 40
9.3 RF Unit ........................................................................................................................................................... 45
9.4 Peripheral Circuits .......................................................................................................................................... 54
9.4.1 LCD Circuit .......................................................................................................................................... 54
9.4.2 Motor Circuit ........................................................................................................................................ 57
9.4.3 Receiver and Speaker ............................................................................................................................ 59
9.4.4 Microphone ........................................................................................................................................... 63
9.4.5 Headset Circuit ...................................................................................................................................... 65
9.4.6 SIM Card Circuit ................................................................................................................................... 67
9.4.7 I/O Interface Circuit .............................................................................................................................. 70
9.4.8 microSD Card Port Circuit .................................................................................................................... 71
9.4.9 FM and Bluetooth Circuit ..................................................................................................................... 72
10 Solder Points on the PCB and BGA Chip............................................................................. 76
11 Functional Tests......................................................................................................................... 86
11.1 Keys .............................................................................................................................................................. 86
11.2 MMI Tests .................................................................................................................................................... 87
11.3 Voice Call Test .............................................................................................................................................. 87
Issue 1.0 (2013-01-24) Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
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